Quarterly FIT Rate Reliability Monitor- Test Report ... - PLX Technology

RELIABILITY HTOL DATA @125 °C for 90nmFOUNDRY: Renesas Japan, Process: 90 nm CMOSEFR (Early Fail Rate,=< 168 Hours)FITs @ 60% CL, 55C, Ea = 0.7eVYEAR Sample # Failure PPM Sample Cum Dev # Failure FITsQ4'11 240 0 0 240 240,000 0 49Q1'12 119 0 0 119 359,000 0 33Q2'12 240 0 0 120 479,000 0 25Q3'12 240 0 0 240 719,000 0 16Q4'12 240 0 0 120 779,000 0 15Note:PPM Goal = 200ppm FIT Goal ≤ 100EFR(Early Fail Rate, =168 Hours)CumulativePPM1086420FIT10080604020049332516 15YearYear

RELIABILITY HTOL DATA @125 °C for 0.13µmFOUNDRY: TSMC Taiwan, Process: 0.13 µm LVCMOSEFR (Early Fail Rate,=< 168 Hours)FITs @ 60% CL, 55C, Ea = 0.7eVYEAR Sample # Failure PPM Sample Cum Dev # Failure FITsQ1'08 120 0 0 120 1,787,960 0 7Q2'08 120 0 0 120 1,847,960 0 6Q3'08 120 0 0 119 1,966,960 1*** 13Q4'08 120 0 0 120 2,086,960 0 12Q1'09 120 0 0 120 2,206,960 0 12Q2'09 120 0 0 120 2,326,960 0 11Q3'09 239 1**** 0 239 2,565,960 0 10Q4'09 240 0 0 240 2,805,960 0 9Q1'10 240 0 0 240 2,985,960 0 13Q2'10 240 0 0 240 3,165,960 1*** 13Q3'10 240 0 0 240 3,405,960 0 12Q4'10 240 0 0 239 3,644,960 1*** 3Q1'11 240 0 0 240 3,884,960 0 3Q2'11 120 0 0 120 4,004,960 0 3Q3'11 120 0 0 120 4,124,960 0 3Q4'11 120 0 0 120 4,244,960 0 3Q1'12 120 0 0 120 4,364,960 0 3Q2'12 120 0 0 120 4,484,960 0 3Q3'12 120 0 0 120 4,604,960 0 3Q4'12 120 0 0 120 4,724,960 0 2Note:* = invalid reject at 168 hrs due to EOS** = invalid reject due to mechanical damage after 1000 hrs***=1 unit functional failure, root cause could not be determined, random failure.**** = invalid reject at 168 hrs due to Assy related stitch bond issue.PPM Goal = 200ppm FIT Goal ≤ 20EFR(Early Fail Rate, =168 Hours)CumulativePPM1086420FIT1008060402003 3 3 3 3 2YearYear

RELIABILITY HTOL DATA @125 °C for 0.15µmFOUNDRY: Renesas Japan, Process: 0.15 µm CMOSEFR (Early Fail Rate,=< 168 Hours)FITs @ 60% CL, 55C, Ea = 0.7eVYEAR Sample # Failure PPM Sample Cum Dev # Failure FITs2000-2007 1366 0 0 1366 1,366,000 0 9Q1'08 120 0 0 120 1,486,000 0 8Q2'08 120 0 0 120 1,606,000 0 7Q3'08 96 0 0 96 1,654,000 0 7Q4'08 96 0 0 96 1,702,000 0 7Q1'09 72 0 0 72 1,774,000 0 7Q3'09 72 0 0 72 1,846,000 0 6Q1'10 44 0 0 44 1,890,000 0* 6Q2/Q3'10 45 0 0 45 1,935,000 0* 6Q4'10 120 0 0 120 2,055,000 0* 6Q1/Q2'11 48 0 0 48 2,151,000 0* 5Q3'11 72 0 0 72 2,199,000 0* 5Q4'11 72 0 0 72 2,199,000 0* 5Q1'12 48 0 0 48 2,151,000 0* 5Q2'12 48 0 0 48 2,247,000 0* 5Q3'12 48 0 0 48 2,295,000 0* 5Q4'12 45 0 0 45 2,289,000 0* 5Note:*= RenesasProcess HTOL Reliability Data.PPM Goal = 200ppm FIT Goal ≤ 20PPM1086420EFR(Early Fail Rate, =168 Hours)Cumulative6 5 5 5 5 5YearYear

RELIABILITY HTOL DATA @125 °C for 0.18µmFOUNDRY: TSMC Taiwan, Process: 0.18 µm CMOSEFR (Early Fail Rate,=< 168 Hours)FITs @ 60% CL, 55C, Ea = 0.7eVYEAR Sample # Failure PPM Sample Cum Dev # Failure FITsQ1'08 120 0 0 120 1,833,676 0 14Q2'08 120 0 0 120 2,013,676 0 13Q3'08 120 0 0 120 2,133,676 0 12Q4'08 120 0 0 120 2,253,676 0 12Q1'09 120 0 0 120 2,373,676 0 11Q2'09 120 0 0 120 2,493,676 0 10Q3'09 120 0 0 119 2,612,676 1** 10Q4'09 120 0 0 120 2,732,676 0 10Q1'10 120 0 0 120 2,852,676 0 9Q2'10 120 0 0 120 2,972,676 0 9Q3'10 120 0 0 120 3,092,676 0 8Q4'10 120 0 0 119 3,211,676 1*** 8Q1'11 120 0 0 120 3,331,676 0 8Q2'11 120 0 0 120 3,451,676 0 8Q3'11 120 0 0 120 3,571,676 0 7Q4'11 120 0 0 120 3,691,676 0 7Q1'12 120 0 0 120 3,811,676 0 7Q2'12 120 0 0 120 3,931,676 0 7Q3'12 120 0 0 120 4,051,676 0 6Q4'12 120 0 0 120 4,171,676 0 6Q1'13 120 0 0 120 4,291,676 0 6Note: * = 1 unit functional failure, root cause could not be determined, random failure.** = invalid reject at 500 hrs due to missing solder balls*** = invalid reject at 1000 hrs due to EOSPPM Goal = 200ppm FIT Goal ≤ 20EFR(Early Fail Rate, =168 Hours)CumulativePPM108642FIT100806040207 7 7 6 6 600YearYear

RELIABILITY HTOL DATA @125 °C for 0.25µmFOUNDRY: TSMC Taiwan, Process: 0.25 µm CMOSEFR (Early Fail Rate,=< 168 Hours)FITs @ 60% CL, 55C, Ea = 0.7eVYEAR Sample # Failure PPM Sample Cum Dev # Failure FITsQ1'08 120 0 0 120 1,966,264 0 6Q2'08 120 0 0 120 2,026,264 1*** 13Q3'08 100 0**** 0 100 2,126,264 0**** 12Q1'09 100 0**** 0 100 2,226,264 0**** 12Q2'09 100 0**** 0 100 2,326,264 0**** 11Q3'09 100 0**** 0 100 2,426,264 0**** 11Q4'09 100 0**** 0 100 2,526,264 0**** 10Q1'10 100 0**** 0 100 2,626,264 0**** 10Q2'10 100 0**** 0 100 2,726,264 0**** 10Q3'10 100 0**** 0 100 2,826,264 0**** 9Q4'10 100 0**** 0 100 2,926,264 0**** 9Q1'11 100 0**** 0 100 3,026,264 0**** 9Q2'11 100 0**** 0 100 3,126,264 0**** 8Q3'11 100 0**** 0 100 3,226,264 0**** 8Q4'11 100 0**** 0 100 3,326,264 0**** 8Q1'12 100 0**** 0 100 3,426,264 0**** 8Q2'12 100 0**** 0 100 3,526,264 0**** 7Q3'12 100 0**** 0 100 3,626,264 0**** 7Q4'12 100 0**** 0 100 3,726,264 0**** 7Note: * = Mechanical damage after 500 hrs** = 9 mechanical damage after 1KH***= 1 unit functional failure after 1000 hrs, root cause could not be determined, random failure.****= TSMC Process HTOL Reliability Data.PPM Goal = 200ppm FIT Goal ≤ 2010EFR(Early Fail Rate, =168 Hours)Cumulative880PPM6420FIT60402008 8 8 7 7 7YearYear

RELIABILITY HTOL DATA @125 °C for 0.35µmFOUNDRY: Epson Japan, Process: 0.35 µm CMOSEFR (Early Fail Rate,=< 168 Hours)YEAR Sample # Failure PPM Sample Cum Dev # Failure FITsQ1'08 44 0 0 44 1,126,740 0 10Q2'08 132 0 0 132 1,214,740 0 10Q3'08 22 0 0 22 1,225,740 0 10Q4'08 44 0 0 44 1,269,740 0 9Q1'09 135 0 0 135 1,337,240 0 9Q2'09 135 0 0 135 1,404,740 0 8Q3/Q4'09 135 0 0 135 1,539,740 0 8Q1/Q2'10 135 0 0 135 1,674,740 0 7Q3/Q4'10 135 0 0 135 1,809,740 0 7Q1/Q2'11 135 0 0 135 1,944,740 0 6Q3/Q4'11 135 0 0 135 2,079,740 0 6Q1/Q2'12 405 0 0 405 2,484,740 0 5Q3'12 100 0 0 100 2,584,740 0 5Q4'12 100 0 0 100 2,684,740 0 4Note:TSMC Process HTOL Reliability Data.FITs @ 60% CL, 55C, Ea = 0.7eVPPM Goal = 200ppm FIT Goal ≤ 2010EFR(Early Fail Rate, =168 Hours)Cumulative880PPM64FIT60402207 6 6 5 5 400YearYear

RELIABILITY STRESS DATATemperature Cycle Test >=500 Cycles, -65/+150 ˚CYEAR PKGSAMPLE 500 cycles FAILURE RATETYPESIZE (%)2008 H/FCBGA270 0 02009 H/FCBGA644 0 02010 H/FCBGA541 0 02011 H/FCBGA246 0 0Q1'12 H/FCBGA145 0 0Q2'12 H/FCBGA350 0 0Q3'12 H/FCBGA270 0 0Q4'12 H/FCBGA838 0 0Q1'13 H/FCBGA334 0 02008 HSBGA465 0 02009 HSBGA909 0 02010 HSBGA579 0 02011 HSBGA1008 0 0Q1'12 HSBGA135 0 0Q2'12 HSBGA260 0 0Q3'12 HSBGA44 0 0Q4'12 HSBGA54 0 0Q1'13HSBGANIL2004-2007 PBGA4833 0 02008 PBGA1785 0 02009 PBGA932 0 02010 PBGA678 0 02011 PBGA438 0 0Q1'12 PBGA482 0 0Q2'12 PBGA434 0 0Q3'12 PBGA902 0 0Q4'12 PBGA984 0 0Q1'13PBGANIL2010 QFN255 0 02011 QFN418 0 0Q1'12 QFN300 0 0Q2'12 QFN415 0 0Q3'12 QFN542 0 0Q4'12 QFN573 0 0Q1'13QFNNIL2004-2007 QFP1583 0 02008 QFP651 0 02009 QFP629 0 02010 QFP622 0 02011 QFP884 0 0Q1'12 QFP583 0 0Q2'12 QFP974 0 0Q3'12 QFP782 0 0Q4'12 QFP447 0 0Q1'13QFPNILNote:FINAL RESULT(PASS/FAIL)PASSPASSPASSPASSPASSPASSPASSPASSPASSPASSPASSPASSPASSPASSPASSPASSPASSPASSPASSPASSPASSPASSPASSPASSPASSPASSPASSPASSPASSPASSPASSPASSPASSPASSPASSPASSPASSPASSPASSPASSPASSASSEMBLY SUBCONASE, KaohsiungASE, MalaysiaPACKAGE TECHNOLOGIESEPQFP, QFN, aQFN, PBGA, HSBGA, HFCBGA, FCBGAPQFP, PBGA, HSBGA

RELIABILITY STRESS DATATemperature Humidity Test 85/85 or HASTYEARPKGTYPESAMPLESIZEFAILURE RATE(%)FINAL RESULT(PASS/FAIL)2008 H/FCBGA2700PASS2009 H/FCBGA5850PASS2010 H/FCBGA5720PASS2011 H/FCBGA137 0PASSQ1'12 H/FCBGA 45 0PASSQ2,12 H/FCBGA364 0PASSQ3'12 H/FCBGA4970PASSQ4'12 H/FCBGA3340PASSQ1'13 H/FCBGA4240PASS2008 HSBGA4650PASS2009 HSBGA9090PASS2010 HSBGA4970PASS2011 HSBGA11900PASSQ1'12 HSBGA 99 0PASSQ2'12 HSBGA1300PASSQ3'12 HSBGA 44 0PASSQ4'12 HSBGA 294 0PASSQ1'13HSBGANIL2004-2007 PBGA50470PASS2008 PBGA17850PASS2009 PBGA932 0PASS2010 PBGA7280PASS2011 PBGA5090PASSQ1'12 PBGA 376 0PASSQ2'12 PBGA1820PASSQ3'12 PBGA 1745 0PASSQ4'12 PBGA 367 0PASSQ1'13PBGANIL2010 QFN 135 0PASS2011 QFN1200PASSQ1'12 QFN 90 0PASSQ2'12 QFN600PASSQ3'12 QFN 753 0PASSQ4'12 QFN 316 0PASSQ1'13QFNNIL2004-2007 QFP 23050PASS2008 QFP4750PASS2009 QFP327 0PASS2010 QFP150 0PASS2011 QFP 7570PASSQ1'12 QFP 2240PASSQ2'12 QFP4190PASSQ3'12 QFP 970 0PASSQ4'12 QFP 425 0PASSQ1'13QFPNILHAST is an alternative stress with conditions of 96 Hours, 130C, 85%RH.

RELIABILITY STRESS DATAPressure Cooker Test: 168 Hours, 121 ˚C/ 100% RHYEAR PKG SAMPLE 96 Hours 168 Hours FAILURE RATETYPE SIZE ( Ref ) ( Accep ) (%)2008 HSBGA 150 0 0 02009 HSBGA 60 0 0 02010 HSBGA 120 0 0 02011 HSBGA 292 0 0 0Q1'12 HSBGA 120 0 0 0Q2'12 HSBGA 120 0 0 0Q3'12 HSBGA 22 0 0 0Q4'12 HSBGA NILQ1'13 HSBGA NIL2004-2007 PBGA 1130 0 0 02008 PBGA 120 0 0 02009 PBGA 120 0 0 02010 PBGA 90 0 0 02011 PBGA 150 0 0 0Q1'12 PBGA 257 0 0 0Q2'12 PBGA 120 0 0 0Q3'12 PBGA NILQ4'12 PBGA NILQ1'13 PBGA NIL2010 QFN 205 0 0 02011 QFN 188 0 0 0Q1'12 QFN 375 0 0 0Q2'12 QFN 345 0 0 0Q3'12 QFN 201 0 0 0Q4'12 QFN 145 0 0 0Q1'13 QFN NIL2004-2007 QFP 6792 0 0 02008 QFP 474 0 0 02009 QFP 337 0 0 02010 QFP 358 0 0 02011 QFP 558 0 0 0Q1'12 QFP 449 0 0 0Q2'12 QFP 561 0 0 0Q3'12 QFP 233 0 0 0Q4'12 QFP 90 0 0 0Q1'13 QFP NILNote:FINAL RESULT(PASS/FAIL)PASSPASSPASSPASSPASSPASSPASSPASSPASSPASSPASSPASSPASSPASSPASSPASSPASSPASSPASSPASSPASSPASSPASSPASSPASSPASSPASSPASSPASSASSEMBLY SUBCONASE, KaohsiungASE, MalaysiaRenesas, JapanSeiko-Epson, JapanPACKAGE TECHNOLOGIESEPQFP, QFN, aQFN, PBGA, HSBGA, HFCBGA, FCBGAPQFP, PBGA, HSBGAPQFP, PBGA, FBGAPQFP, PBGA

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