Quarterly FIT Rate Reliability Monitor- Test Report ... - PLX Technology

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RELIABILITY HTOL DATA @125 °C for 90nmFOUNDRY: Renesas Japan, Process: 90 nm CMOSEFR (Early Fail Rate,=< 168 Hours)FITs @ 60% CL, 55C, Ea = 0.7eVYEAR Sample # Failure PPM Sample Cum Dev # Failure FITsQ4'11 240 0 0 240 240,000 0 49Q1'12 119 0 0 119 359,000 0 33Q2'12 240 0 0 120 479,000 0 25Q3'12 240 0 0 240 719,000 0 16Q4'12 240 0 0 120 779,000 0 15Note:PPM Goal = 200ppm FIT Goal ≤ 100EFR(Early Fail Rate, =168 Hours)CumulativePPM1086420FIT10080604020049332516 15YearYear
RELIABILITY HTOL DATA @125 °C for 0.13µmFOUNDRY: TSMC Taiwan, Process: 0.13 µm LVCMOSEFR (Early Fail Rate,=< 168 Hours)FITs @ 60% CL, 55C, Ea = 0.7eVYEAR Sample # Failure PPM Sample Cum Dev # Failure FITsQ1'08 120 0 0 120 1,787,960 0 7Q2'08 120 0 0 120 1,847,960 0 6Q3'08 120 0 0 119 1,966,960 1*** 13Q4'08 120 0 0 120 2,086,960 0 12Q1'09 120 0 0 120 2,206,960 0 12Q2'09 120 0 0 120 2,326,960 0 11Q3'09 239 1**** 0 239 2,565,960 0 10Q4'09 240 0 0 240 2,805,960 0 9Q1'10 240 0 0 240 2,985,960 0 13Q2'10 240 0 0 240 3,165,960 1*** 13Q3'10 240 0 0 240 3,405,960 0 12Q4'10 240 0 0 239 3,644,960 1*** 3Q1'11 240 0 0 240 3,884,960 0 3Q2'11 120 0 0 120 4,004,960 0 3Q3'11 120 0 0 120 4,124,960 0 3Q4'11 120 0 0 120 4,244,960 0 3Q1'12 120 0 0 120 4,364,960 0 3Q2'12 120 0 0 120 4,484,960 0 3Q3'12 120 0 0 120 4,604,960 0 3Q4'12 120 0 0 120 4,724,960 0 2Note:* = invalid reject at 168 hrs due to EOS** = invalid reject due to mechanical damage after 1000 hrs***=1 unit functional failure, root cause could not be determined, random failure.**** = invalid reject at 168 hrs due to Assy related stitch bond issue.PPM Goal = 200ppm FIT Goal ≤ 20EFR(Early Fail Rate, =168 Hours)CumulativePPM1086420FIT1008060402003 3 3 3 3 2YearYear
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Quarterly FIT Rate Reliability Monitor- Test Report ... - PLX Technology

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