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Surface modification for hydrophilic property of stainless steel ...

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M.C. Kim et al. / <strong>Surface</strong> and Coatings Technology 171 (2003) 312–316313In comparison, the <strong>steel</strong> products normally have a roughsurface. All the treatments are carried out under theroom temperature. The aging tests are per<strong>for</strong>med in theconstant conditions <strong>of</strong> the relative humidity <strong>of</strong> 64% <strong>for</strong>4 days.3. Results and discussion3.1. Contact angle analysis and optimum condition <strong>for</strong><strong>hydrophilic</strong> <strong>property</strong>As a first step <strong>of</strong> our analysis, we per<strong>for</strong>med contactangle analysis to obtain the optimized conditions <strong>for</strong> a<strong>hydrophilic</strong> surface with respect to the nozzle-to-surfaceFig. 1. Contact angle data under different nozzle velocity (a) and gapdistance (b). Contact angle images (c) be<strong>for</strong>e treatment and aftertreatment in the optimum conditions <strong>of</strong> NSG 5 mm and NMV <strong>of</strong> 10mmys.GmbH, Bielefeld, Germany. The power <strong>for</strong> the plasmageneration and sustenance is supplied with the impulsevoltage into the jet-nozzle electrode via the trans<strong>for</strong>mer.The maximum voltage is applied into the jet-nozzleelectrode. The output frequency is approximately 10 kVfrom peak to peak at the frequency <strong>of</strong> 16–20 kHz. Thelength <strong>of</strong> plasma jet flame is approximately 30 mm andthe diameter is 10 mm. Mixed N and O with a high2 2degree <strong>of</strong> purity (99.999%) are used as reactive gaseswith the ratio <strong>of</strong> N :O s4:1 similar to air. The gases2 2are controlled by manual flow-controller and constantlyflowed into the jet-nozzle <strong>for</strong> a plasma ignition. The jetnozzlebody is fixed on the frame <strong>of</strong> the X–Y movingtable made to treat large-area substrate such as web orpolymer films. The <strong>stainless</strong> <strong>steel</strong> is sequentially cleanedin acetone, methyl alcohol, and de-ionized water byultrasonic cleaning method. For clearer confirmation onAFM results, silicon (100) wafer is also cleaned witha <strong>for</strong>e-mentioned method and treated in the plasmaunder the same conditions due to its highly flat surface.Fig. 2. (a) High-resolution XPS analysis <strong>of</strong> C ls (a), Ols(b), andFe 2p on the same surface as Fig. 1c.3y2

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