Contacting Solutions for Reliable, Repeatable Test ... - Johnstech

Contact Life Depends on Many FactorsSince NiPd and NiPdAu platings are much harder and rougher than their matte tin counterparts, Test Contactors or sockets mustbe designed to withstand these challenges. Contact life depends not only on the package material plating properties, but it canvary even more significantly based on the handler-to-Contactor interface, handler velocity, whether auto alignment plates are used,alignment plate opening size and tolerances, and test temperature. Johnstech offers worldwide service and support to ensure thehandler interface is optimized for highest yields, longest contact life, and extended MTBA.New Johnstech ROL TechnologyLow-Force XL-2 ContactsJohnstech has developed the new Low-Force XL-2Series Contacts for the Pad ROL200 and ROL100AContactors for NiPd and NiPdAu package applications.The new Low-Force XL-2 (extended life) Contacts workin concert with new elastomers to provide an optimizedcontacting system for maximum contact life. TheContactors are designed to deliver the proper amountof force to both the device-under-test and the loadboard pads for longer contact life, exceptional continuity,longer MTBA, and longer load board pad life. The Low-Force XL-2 Contacts provide a self-cleaning wipe forexcellent MTBA, even on NiPdAu surfaces that containcontaminants or debris. In addition, the contact motion isdesigned to avoid package burrs, resulting in less debrisgeneration and longer contact life. The contact profilesand elastomers for the Pad ROL100A Series andPad ROL200 Series configured for NiPd and NiPdAuapplications are shown here.Pad ROL100A SeriesPad ROL200 SeriesCustomer Production Performance ImprovementsCustomer production testing with the new Low-Force XL-2Contacts has provided solid performance results. Theyhave experienced higher yields, improved continuity,longer load board pad life, and extended MTBA.Customers have seen significant improvements in contactlife, often beyond 500,000 cycles, even with the mostchallenging NiPdAu and NiPd package platings.