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Page 1 PROBLEM 3.1 KNOWN: One-dimensional, plane wall ...

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<strong>PROBLEM</strong> 3.26<strong>KNOWN</strong>: Surface area and maximum temperature of a chip. Thickness of aluminum coverand chip/cover contact resistance. Fluid convection conditions.FIND: Maximum chip power.SCHEMATIC:ASSUMPTIONS: (1) Steady-state conditions, (2) <strong>One</strong>-<strong>dimensional</strong> heat transfer, (3)Negligible heat loss from sides and bottom, (4) Chip is isothermal.PROPERTIES: Table A.1, Aluminum (T ≈ 325 K): k = 238 W/m⋅K.ANALYSIS: For a control surface about the chip, conservation of energy yieldsorEg − Eout = 0( Tc− T∞) A( L/k) + R′′+ ( 1/ h)Pc− = 0⎣⎡ t,c ⎦⎤$( 85 − 25-4 2) C( 10 m )Pc,max=⎡ 4 2( 0.002 / 238) 0.5 10−( 1/1000)⎤⎢+ × + m ⋅K/W⎣⎥⎦60 10−4 $× C⋅m2Pc,max=8.4× 10-6+ 0.5× 104+ 103m2⋅K/W− −( )Pc,max= 5.7 W. Rt,c >> Rcond8.

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