Cu CMP Cleaning - Avsusergroups.org

More documents

Recommendations

Info

1-Step, High pH Clean• Several customers have qualified ESC 784 as asingle-chemistry clean• Cu contamination level has been demonstrated to bewithin spec without additional cleaning steps• Development of improved chelating efficacy toaddress future needs for Cu contamination levelsand to increase the CMP process windowFebruary 200212
ESC 784 vs. TMAHDefects on Patterned Cu/Oxide Waferafter CMP Process300Cu Concentration on DielectricSurface Following Cu CMP Processon Patterned Wafers1,000Average # ofdefects250200150100Processed in SprayToolProcessed inDouble-sided ScrubberAtoms/cm 2 x E 10TOF-SIMS100500TMAH ESC 784 DIW TMAH ESC 78410DIW TMAH ESC 784• ESC 784 shows better particle removal performance without mechanicalassistance• ESC 784 shows slightly better particle removal performance in scrubberprocess• ESC 784 shows significantly better Cu contamination removal performanceFebruary 200213
Page 1 and 2: Cu CMP CleaningAqueous, Alkaline Ch
Page 3 and 4: Introduction• Focus is on develop
Page 5: ESC Chemical Formulations• Base F
Page 8 and 9: Cu CompatibilityESC Products includ
Page 10 and 11: 2-Step Clean• A 2-step clean, hig
Page 14 and 15: Applied MIRRA MESA Data• Customer
Page 16 and 17: BTA Removal• BTA is typically use
Page 18 and 19: CMP Equipment Supplier Experience
Page 20 and 21: Cost of Ownership• 20:1 to 40:1 d

Cu CMP Cleaning - Avsusergroups.org

You also want an ePaper? Increase the reach of your titles

Delete template?

Save as template?