Cu CMP Cleaning - Avsusergroups.org

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BTA Removal• BTA is typically used between the polish processand the cleaning step.• Removal is desired to prevent defects and increaseelectrical resistance.• High pH cleaning chemistries can remove BTA morereadily than low pH chemistries• XPS data demonstrates thisFebruary 200216
CMP Equipment Performance• Contact Cleaning– Double-sided scrubbers– “Disk-type” scrubbers• Non-Contact Cleaning– Single wafer megasonics– Batch megasonics• Single-pass chemistry is typical• Ambient temperature operation• No particle brush loading in scrubbers• Megasonic performance enhancement for particle removalFebruary 200217
Page 1 and 2: Cu CMP CleaningAqueous, Alkaline Ch
Page 3 and 4: Introduction• Focus is on develop
Page 5: ESC Chemical Formulations• Base F
Page 8 and 9: Cu CompatibilityESC Products includ
Page 10 and 11: 2-Step Clean• A 2-step clean, hig
Page 12 and 13: 1-Step, High pH Clean• Several cu
Page 14 and 15: Applied MIRRA MESA Data• Customer
Page 18 and 19: CMP Equipment Supplier Experience
Page 20 and 21: Cost of Ownership• 20:1 to 40:1 d

Cu CMP Cleaning - Avsusergroups.org

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