Cu CMP Cleaning - Avsusergroups.org

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CMP Equipment Supplier Experience• AMAT Mirra Mesa• Lam TERES• IPEC/Speed-Fam 776• Ebara• Verteq Goldfinger• Verteq Cobra VcS• DNS AS2000• Ontrak DSS/Synergy• FSI Mercury• SSEC ScrubberFebruary 200218
Megasonic Cleaning EnhancementStatic Cleaning Angle TestVerteq Goldfinger Megasonic SystemContaminated WaferMeasured Static Cleaning Angle120100806040200Solution A(pH 8)Oxalic Acid(pH 5.3)100:1 NH4OH(pH 11)Slurry ASlurry BSlurry CSolution B(pH 5)ESC 774(pH >11.0)GoldfingerMegasonicTransducerArea cleaned bychemical andmegasonic energyWafer is cleaned with megasonics andchemistry without wafer rotationArea not cleaned bychemical andmegasonic energyStatic AngleFebruary 200219
Page 1 and 2: Cu CMP CleaningAqueous, Alkaline Ch
Page 3 and 4: Introduction• Focus is on develop
Page 5: ESC Chemical Formulations• Base F
Page 8 and 9: Cu CompatibilityESC Products includ
Page 10 and 11: 2-Step Clean• A 2-step clean, hig
Page 12 and 13: 1-Step, High pH Clean• Several cu
Page 14 and 15: Applied MIRRA MESA Data• Customer
Page 16 and 17: BTA Removal• BTA is typically use
Page 20 and 21: Cost of Ownership• 20:1 to 40:1 d

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