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9 rue Alfred Kastler - BP 10748 - 44307 Nantes Cedex 3 - France
Phone : +33 (0) 240 180 916 - email : info@systemplus.fr - website : www.systemplus.fr
September 2011 - Version 1
Written by: Romain FRAUX
DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic
estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is
made of the contents of this report. The quoted trademarks are property of their owners.
© 2011 by SYSTEM PLUS CONSULTING, all rights reserved. Knowles SPU0409LE5H – MEMS Microphone 1

Glossary
1. Overview / Introduction……….……………….…........…4
– Executive Summary
– Reverse Costing Methodology
2. Knowles Company Profile…………………….……....….6
– Knowles Profile
– MEMS Microphone Portfolio
– SPU0410LR5H Characteristics
– Knowles Business Model
4. Physical Analysis………………………...………............12
– Synthesis of the Physical Analysis
– Physical Analysis Methodology
– Package Characteristics & Markings
– Package Pin-Out
– Package Cross-Section
– Device Structure
– Package Opening
– ASIC Dimensions
– ASIC Markings
– ASIC Cross-Section
– ASIC Delayering
– ASIC Process Characteristics
– MEMS Dimensions
– MEMS Markings
– MEMS Surface
– MEMS Structure
– MEMS Cross-section
– MEMS Process Characteristics
– Physical Data Summary
Table of Contents
5. Manufacturing Process Flow…….…………………..….55
– Global Overview
– ASIC Process Flow
– Description of the ASIC Wafer Fabrication Unit
– MEMS Process Flow
– Description of the MEMS Wafer Fabrication Unit
– Packaging Process Flow
– Description of the Packaging Unit
6. Cost Analysis………………………….………………..…..70
– Synthesis of the Cost Analysis
– Main Steps of Economic Analysis
– Yields Explanation
– Yields Hypotheses
– Die per wafer & Probe Test
– ASIC Front-End : Hypotheses
– ASIC Front-End Cost
– ASIC Back-End 0 : Probe Test, Backgrinding & Dicing
– ASIC Die Cost
– MEMS Front-End : Hypotheses
– MEMS Front-End Cost
– MEMS Front-End Cost per Process Steps
– MEMS Front-End : Equipment Cost per Family
– MEMS Front-End : Material Cost per Family
– MEMS Back-End 0 : Probe Test & Dicing
– MEMS Die Cost (Front End + Back End 0)
– Back-End 1 : Packaging Cost
– Back-End 1 : Final test & Calibration Cost
– SPU0410LR5H Component Cost (FE + BE 0 + BE 1)
7. Estimated Price Analysis….………………….……..……95
– Definition of Prices
– Manufacturer Financial Ratios
– SPU0410LR5H Estimated Manufacturer Price
Contact…….……………………………………………………99
© 2011 by SYSTEM PLUS CONSULTING, all rights reserved. Knowles SPU0409LE5H – MEMS Microphone 2

• Package type: 6-pin LGA
• Dimensions: 3.76mm x 3.00mm x 1.10mm
• Marking:
S318
6654
Package side view
Package Characteristics & Markings
Package Top view
Package back view
© 2011 by SYSTEM PLUS CONSULTING, all rights reserved. Knowles SPU0409LE5H – MEMS Microphone 3

Diaphragm
Cavity
Metal lid
MEMS
Package Cross-Section
Glob-top
Package Cross-Section Overview
The package is composed of:
• A 4-layers PCB substrate (epoxy resin reinforced fiberglass (FR-4 PCB) and
conductive copper layers (ML)) with embedded capacitor.
• A metal lid (brass – copper/zinc alloy)
© 2011 by SYSTEM PLUS CONSULTING, all rights reserved. Knowles SPU0409LE5H – MEMS Microphone 4
ASIC
4 ML

Bonding material: Gold
Bonding diameter: 20µm
MEMS
Package Opening
Package Opening – Optical top view
© 2011 by SYSTEM PLUS CONSULTING, all rights reserved. Knowles SPU0409LE5H – MEMS Microphone 5
ASIC
Bonding number: 5
� Between ASIC & Package: 3
� Between MEMS & ASIC: 2

ASIC Overview
Polysilicon
Capacitors – SEM View
ASIC Delayering (Polysilicon level)
CMOS gate width measurement in logic Area – SEM View
• Transistor gate width : ~0.33µm
� Technology node used is 0.35µm.
• Polysilicium capacitors
© 2011 by SYSTEM PLUS CONSULTING, all rights reserved. Knowles SPU0409LE5H – MEMS Microphone 6

1.1mm
1.1mm
MEMS Dimensions
Die area: 1.21mm²
Die thickness: ~400µm
Total Pads nb: 2
© 2011 by SYSTEM PLUS CONSULTING, all rights reserved. Knowles SPU0409LE5H – MEMS Microphone 7

MEMS Overview
MEMS Backplate – SEM View
Backplate support
post
MEMS Surface
Backplate hole
Diaphragm hole
MEMS Backplate – SEM View
© 2011 by SYSTEM PLUS CONSULTING, all rights reserved. Knowles SPU0409LE5H – MEMS Microphone 8

MEMS Mic
MEMS Mic
MEMS Mic
• Diaphragm
• Poly 1 – 1µm
• Sacrificial layer 2
• PSG – 3.6µm
• Backplate
Electrode
• Poly 2 – 0.5µm
MEMS Process Flow
Oxide
(PSG)
Polysilicon
Polysilicon
© 2011 by SYSTEM PLUS CONSULTING, all rights reserved. Knowles SPU0409LE5H – MEMS Microphone 9

Equipment Family Equipment
Cost
Cleaning $0.18 0.3%
Backgrinding $0.77 1.1%
Measurement $1.11 1.6%
Thermal $2.69 3.9%
Deposition $11.25 16.4%
Lithography $12.76 18.6%
Etching $39.69 58.0%
TOTAL $68.45
Breakdown
MEMS Equipment Cost per Family
(Simulated with MEMS CoSim+ Cost
Simulation Tool)
MEMS Front-End : Equipment Cost per Family
• The main part of the equipment cost is due to the etching
steps with 55% (the DRIE steps explain this value).
Details of the equipment cost per step are given in the Excel Spreadsheet.
Etching
58%
MEMS Equipment Cost Breakdown per Family
Cleaning
0%
Backgrinding
1%
Measurement
2%
© 2011 by SYSTEM PLUS CONSULTING, all rights reserved. Knowles SPU0409LE5H – MEMS Microphone 10
Thermal
4%
Deposition
16%
Lithography
19%

Contact
• Reverse costing analysis represents the best cost/price evaluation given the publically
available data, completed with industry expert estimates.
• Given the hypothesis presented in this analysis the major sources of correction would
lead to a +/- 10% correction on the manufacturing cost (if all parameters are cumulated)
• IC +/- 8%
• MEMS +/- 5%
• Packaging +/- 10%
• Test +/- 20%
• These results are open for discussion. We can re-evaluate this circuit with your
information. Please contact us:
© 2011 by SYSTEM PLUS CONSULTING, all rights reserved. Knowles SPU0409LE5H – MEMS Microphone 11