TFDU4203 Integrated Low Profile Transceiver Module for Telecom ...

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TFDU4203Vishay SemiconductorsRecommended Circuit DiagramSD8SDGND5, 6 GNDRXD3RXDTXDVccR1C1R27 TXD4 V CC1, 2 IRED Cathode18199Recommended Application Circuit ComponentsComponent Recommended Value Vishay Part NumberC1 4.7 µF, 16 V 293D 475X9 016B 2TR15 Ω maxThis is a recommendation for a combination to start with to exclude power supply effects.Optimum, from a costs point of view, to work without both.Temperature Derating DiagramAmbient Temperature (°C )9085807570656055502.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.018097Operating Voltage [V] at duty cycle 20 %Figure 1. Temperature Derating DiagramThe temperature derating diagram shows the maximumoperating temperature when the device is operatedwithout external current limiting resistor. A powerdissipating resistor of 2 Ω is recommended from thecathode of the IRED to Ground for supply voltagesabove 4 V. In that case the device can be operated upto 85 °C, too.Document Number 82542Rev. 1.6, 04-Oct-06www.vishay.com199
TFDU4203Vishay SemiconductorsRecommended Solder ProfilesSolder Profile for Sn/Pb SolderingTemperature (°C)260240220200180160140120100806040200195352...4 °C/s240 °C max.160 °C max.120 s...180 s2...4 °C/s10 s max. at 230 °C90 s max.0 50 100 150 200 250 300 350Time/sFigure 2. Recommended Solder Profile for Sn/Pb solderingLead (Pb)-Free, Recommended Solder ProfileThe TFDU4203 is a lead (Pb)-free transceiver andqualified for lead (Pb)-free processing. For lead (Pb)-free solder paste like Sn (3.0 - 4.0) Ag (0.5 - 0.9) Cu,there are two standard reflow profiles: Ramp-Soak-Spike (RSS) and Ramp-To-Spike (RTS). The Ramp-Soak-Spike profile was developed primarily for reflowovens heated by infrared radiation. With widespreaduse of forced convection reflow ovens the Ramp-To-Spike profile is used increasingly. Shown below in figure3 and 4 are VISHAY's recommended profiles foruse with the TFDU4203 transceivers. For moredetails please refer to the application note“SMD Assembly Instructions”(http://www.vishay.com/docs/82602/82602.pdf).A ramp-up rate less than 0.9 °C/s is not recommended.Ramp-up rates faster than 1.3 °C/s coulddamage an optical part because the thermal conductivityis less than compared to a standard IC.Wave SolderingFor TFDUxxxx and TFBSxxxx transceiver deviceswave soldering is not recommended.StorageThe storage and drying processes for all VISHAYtransceivers (TFDUxxxx and TFBSxxx) are equivalentto MSL4.The data for the drying procedure is given on labelson the packing and also in the application note"Taping, Labeling, Storage and Packing"(http://www.vishay.com/docs/82601/82601.pdf).Temperature/°C19532Temperature/°C2752502252001751501251007550252802602402202001801601401201008060402002 °C...3 °C/sT ≥ 255 °C for 10 s....30 sT ≥ 217 °C for 70 s max90 s...120 s30 s max.70 s max.0 50 100 150 200 250 300 350Time/sFigure 3. Solder Profile, RSS RecommendationT peak = 260 °C max1.3 °C/sTime above 217 °C t ≤ 70 sTime above 250 °C t ≤ 40 sPeak temperature T peak = 260 °C< 4 °C/sFigure 4. RTS RecommendationT peak = 260 °C2 °C...4 °C/s< 2 °C/s00 50 100 150 200 250 300Time/sManual SolderingManual soldering is the standard method for lab use.However, for a production process it cannot be recommendedbecause the risk of damage is highlydependent on the experience of the operator. Nevertheless,we added a chapter to the above mentionedapplication note, describing manual soldering anddesoldering.www.vishay.com200Document Number 82542Rev. 1.6, 04-Oct-06
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