TFDU4203 Integrated Low Profile Transceiver Module for Telecom ...
TFDU4203 Integrated Low Profile Transceiver Module for Telecom ...
TFDU4203 Integrated Low Profile Transceiver Module for Telecom ...
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<strong>TFDU4203</strong>Vishay SemiconductorsRecommended Solder <strong>Profile</strong>sSolder <strong>Profile</strong> <strong>for</strong> Sn/Pb SolderingTemperature (°C)260240220200180160140120100806040200195352...4 °C/s240 °C max.160 °C max.120 s...180 s2...4 °C/s10 s max. at 230 °C90 s max.0 50 100 150 200 250 300 350Time/sFigure 2. Recommended Solder <strong>Profile</strong> <strong>for</strong> Sn/Pb solderingLead (Pb)-Free, Recommended Solder <strong>Profile</strong>The <strong>TFDU4203</strong> is a lead (Pb)-free transceiver andqualified <strong>for</strong> lead (Pb)-free processing. For lead (Pb)-free solder paste like Sn (3.0 - 4.0) Ag (0.5 - 0.9) Cu,there are two standard reflow profiles: Ramp-Soak-Spike (RSS) and Ramp-To-Spike (RTS). The Ramp-Soak-Spike profile was developed primarily <strong>for</strong> reflowovens heated by infrared radiation. With widespreaduse of <strong>for</strong>ced convection reflow ovens the Ramp-To-Spike profile is used increasingly. Shown below in figure3 and 4 are VISHAY's recommended profiles <strong>for</strong>use with the <strong>TFDU4203</strong> transceivers. For moredetails please refer to the application note“SMD Assembly Instructions”(http://www.vishay.com/docs/82602/82602.pdf).A ramp-up rate less than 0.9 °C/s is not recommended.Ramp-up rates faster than 1.3 °C/s coulddamage an optical part because the thermal conductivityis less than compared to a standard IC.Wave SolderingFor TFDUxxxx and TFBSxxxx transceiver deviceswave soldering is not recommended.StorageThe storage and drying processes <strong>for</strong> all VISHAYtransceivers (TFDUxxxx and TFBSxxx) are equivalentto MSL4.The data <strong>for</strong> the drying procedure is given on labelson the packing and also in the application note"Taping, Labeling, Storage and Packing"(http://www.vishay.com/docs/82601/82601.pdf).Temperature/°C19532Temperature/°C2752502252001751501251007550252802602402202001801601401201008060402002 °C...3 °C/sT ≥ 255 °C <strong>for</strong> 10 s....30 sT ≥ 217 °C <strong>for</strong> 70 s max90 s...120 s30 s max.70 s max.0 50 100 150 200 250 300 350Time/sFigure 3. Solder <strong>Profile</strong>, RSS RecommendationT peak = 260 °C max1.3 °C/sTime above 217 °C t ≤ 70 sTime above 250 °C t ≤ 40 sPeak temperature T peak = 260 °C< 4 °C/sFigure 4. RTS RecommendationT peak = 260 °C2 °C...4 °C/s< 2 °C/s00 50 100 150 200 250 300Time/sManual SolderingManual soldering is the standard method <strong>for</strong> lab use.However, <strong>for</strong> a production process it cannot be recommendedbecause the risk of damage is highlydependent on the experience of the operator. Nevertheless,we added a chapter to the above mentionedapplication note, describing manual soldering anddesoldering.www.vishay.com200Document Number 82542Rev. 1.6, 04-Oct-06
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