WEARABLE/IMPLANTABLE

SESSION 1
Plenary Session — Invited Papers
Chair: Anantha Chandrakasan, Massachusetts Institute of Technology, Cambridge, MA
ISSCC Conference Chair
Associate Chair: Kevin Zhang, Intel, Hillsboro, OR
Monday February 1 st , 8:30 AM
FORMAL OPENING OF THE CONFERENCE
8:30 AM
1.1 Moore’s Law: A Path Forward 8:45 AM
William M. Holt, Executive Vice-President and General Manager,
Technology and Manufacturing Group, Intel Corporation, Hillsboro, Oregon
Moore’s Law has served as the guiding principle for the semiconductor industry for 50 years.
But now there are growing concerns and doubts over the vitality of Moore’s Law going
forward, given the scaling challenges we face. This talk will directly address those concerns
and explore future opportunities for the industry. We will present the scaling benefits for
power, performance, and cost using specific product and design examples based on
state-of-the-art 14nm CMOS technology, for applications ranging from high-performance
computing down to ultra-low-power mobile applications. In additional to the scaling path of
CMOS technology beyond 14nm, this talk will also discuss some leading technology options
on the horizon beyond CMOS and their potential design benefits in advancing Moore’s Law
well into the future. Novel 3D heterogeneous integration schemes and new memory
technologies will be discussed for their potential in optimizing the memory hierarchy and
addressing bandwidth challenges in processor performance and power.
1.2 Three Pillars Enabling the Internet of Everything: Smart Everyday 9:20 AM
Objects, Information-Centric Networks, and Automated Real-Time
Insights
Sophie V. Vandebroek, Chief Technology Officer, Xerox Corporation, Norwalk, CT
When smart everyday objects, information-centric networks, and automated real-time insights
work in concert a “perfect storm” of functionality emerges, one which will disrupt entire
industries: Gartner predicts that the global economic value of the Internet of Everything (IoE)
will be $1.7T in 2020. But, even more important will be the inevitable improvements to human
society that IoE enables: personalized healthcare and education, agile urban mobility, efficient
energy usage, and much more.
This talk will provide examples of how each of the three pillars of IoE relies on electronics:
(1) printed hybrid logic and sensor circuits using organic inks and inks embedding microchips
to create smart 2D labels and to manufacture 3D personalized Internet-connected objects;
(2) information-centric network protocols and hardware (for example, CCNx®) to increase
the Internet’s versatility, reduce its traffic congestion, improve security, and simplify
application development; and (3) machine-intelligence software and deep-learning chips to
create real-time insights and automate processes at the “edge” of the IoE network.
The three pillars of IoE will be illustrated through examples from healthcare and transportation.
A number of unique challenges and opportunities for general-purpose and custom chip
designs will be highlighted.
ISSCC, SSCS, IEEE AWARD PRESENTATIONS
9:55 AM
BREAK
10:20 AM
12