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INTERNATIONAL TECHNICAL PROGRAM COMMITTEE<br />
European Members (continued):<br />
Carlo Samori, Politecnico di Milano, Milano, Italy<br />
Christoph Sandner, Infineon Technologies, Villach, Austria<br />
Joseph Shor, Bar Ilan University, Ramat Gan, Israel<br />
Jan Van Sinderen, NXP Semiconductors, Eindhoven, The Netherlands<br />
Stefano Stanzione, IMEC-NL, Eindhoven, The Netherlands<br />
Vojkan Vidojkovic, Intel Mobile Communications, Duisburg, Germany<br />
Piet Wambacq, imec, Heverlee, Belgium<br />
Refet Firat Yazicioglu, GlaxoSmithKline, United Kingdom and Belgium<br />
FAR EAST REGIONAL SUBCOMMITTEE<br />
ITPC FAR EAST REGIONAL CHAIR<br />
Tsung-Hsien Lin, National Taiwan University, Taipei, Taiwan<br />
ITPC FAR EAST REGIONAL VICE-CHAIR<br />
Atsuki Inoue, Fujitsu, Kawasaki, Japan<br />
ITPC FAR EAST REGIONAL SECRETARY<br />
Sungdae Choi, SK Hynix Semiconductor, Icheon, Korea<br />
Hyeon-Min Bae, KAIST, Daejong, Korea<br />
Jonathan Chang, TSMC, Hsinchu, Taiwan<br />
Yoon-Kyung Choi, Samsung, Hwaseong, Korea<br />
Jun Deguchi, Toshiba, Kawasaki, Japan<br />
Guang-Kaai Dehng, Mediatek, Hsinchu, Taiwan<br />
Minoru Fujishima, Hiroshima University, Hiroshima, Japan<br />
Hiroshi Fuketa, AIST, Ibaraki, Japan<br />
Yuan Gao, ASTAR, Singapore<br />
Jin-Man Han, Samsung Electronics, Hwasung, Korea<br />
Takashi Hashimoto, Panasonic, Fukuoka, Japan<br />
Chun-Huat Heng, National University of Singapore, Singapore<br />
Zhilian Hong, Fudan University, Shanghai, China<br />
Fu-Lung Hsueh, TSMC, Hsinchu, Taiwan<br />
Chih-Ming Hung, MediaTek, Taipei, Taiwan<br />
Makoto Ikeda, University of Tokyo, Tokyo, Japan<br />
Tetsuya Iizuka, University of Tokyo, Tokyo, Japan<br />
Chewnpu Jou, TSMC, Hsinchu, Taiwan<br />
Uksong Kang, Samsung, Hwaseong, Korea<br />
Atsushi Kawasumi, Toshiba, Kawasaki, Japan<br />
Chulwoo Kim, Korea University, Seoul, Korea<br />
Jaeha Kim, Seoul National University, Seoul,Korea<br />
TaeChan Kim, Korea University, Korea<br />
Tae Wook Kim, Yonsei University, Seoul, Korea<br />
Takashi Kono, Renesas, Tokyo, Japan<br />
Tai-Cheng Lee, National Taiwan University, Taipei, Taiwan<br />
Paul Liang, MediaTek, Hsinchu, Taiwan<br />
Kyoo Hyun Lim, FCI, Seongnam, Korea<br />
Mahesh Mehendale, Texas Instruments, Bangalore, India<br />
Takahiro Miki, Renesas Electronics, Tokyo, Japan<br />
Philip Mok, HKUST, Clear Water Bay, Hong Kong<br />
Masato Motomura, Hokkaido University, Sapporo, Japan<br />
Shuichi Nagai, Panasonic, Osaka, Japan<br />
Makoto Nagata, Kobe University, Kobe, Japan<br />
Yoshiharu Nakajima, Japan Display, Kanagawa, Japan<br />
Byeong-Gyu Nam, Chungnam National University, Daejeon, Korea<br />
Hideyuki Nosaka, NTT, Atsugi, Japan<br />
Yusuke Oike, Sony, Atsugi, Japan<br />
Kenichi Okada, Tokyo Institute of Technology, Tokyo, Japan<br />
Kohei Onizuka, Toshiba, Kawasaki, Japan<br />
Jaejin Park, Samsung Electronics, Hwasung, Korea<br />
Woogeun Rhee, Tsinghua University, Beijing, China<br />
Seung-Tak Ryu, KAIST, Daejeon, Korea<br />
Bing Sheu, National Chiao Tung University, Hsinchu, Taiwan<br />
Chun Shiah, Etron, Hsinchu, Taiwan<br />
Yasuhisa Shimazaki, Renesas, Tokyo, Japan<br />
Hyunchol Shin, Kwangwoon University, Seoul, Korea<br />
Youngmin Shin, Samsung, Hwansung, Korea<br />
Makoto Takamiya, University of Tokyo, Tokyo, Japan<br />
Seng-Pan U (Ben), University of Macau, Taipa, Macau<br />
Alice Wang, MediaTek, Hsinchu, Taiwan<br />
Yuu Watanabe, Denso, Tokyo, Japan<br />
Peter Chung-Yu Wu, National Chiao Tung University, Hsinchu, Taiwan<br />
Yong Ping Xu, National University of Singapore, Singapore<br />
Hisakatsu Yamaguchi, Fujitsu Laboratories, Kawasaki, Japan<br />
Long Yan, Samsung Electronics, Hwaseong, Korea<br />
Takefumi Yoshikawa, National Institute of Technology, Nagano College, Nagano, Japan<br />
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