CEAC-2022-06-June

Techline
Advantest Introduces Industry’s First
Flexible DUT Interface Enabling
Increased Parallelism on V93000 EXA
Scale Test Systems
TOKYO (GLOBE NEWSWIRE) — Leading semiconductor test
equipment supplier Advantest Corporation has launched its
DUT Scale Duo interface for the V93000 EXA Scale SoC test
systems, enabling the industry’s highest level of parallelism
for testing advanced semiconductors. With this revolutionary
interface, the usable space on DUT boards and probe cards
is increased by 50 percent or more while wafer probe and
final-test set ups can accommodate component heights that
are more than three times taller.
In today’s testing environments, the number of devices that
can be tested in parallel is most often limited by the component
space on the probe card or DUT board, not by available
tester resources. With fast-growing market segments including
automotive, mobile and RF devices trending toward
higher site counts, the need for more space on DUT boards
for IC testing is becoming critical. In addition, leading-edge
wafer probers and final-test handlers require more area
on printed circuit boards to provide the most cost-efficient
solutions, from single wafer touch-down capabilities in wafer
probing to massively parallel final testing across 32 sites or
more.
Advantest offers the industry’s first DUT interface with the
capability to adapt either to the existing standard DUT board
or probe card size or to switch to the new, significantly larger
size. Using a unique sliding mechanism, users can effortlessly
switch back and forth between both formats to adapt to
specific application requirements.
Along with the new interface, a new super-stiff extended
bridge achieves superior deflection performance in direct-probing
set ups. The unit’s universal design gives it the
versatility to support a wide range of applications including
digital and RF device testing.
With its sophisticated sensing capabilities, the extended
bridge delivers the industry’s best planarity and high manufacturing
yield, ensuring highly accurate positioning and
verification of probe card clamping.
“Our new DUT Scale Duo enables the next stepping in parallelism
while embodying Advantest’s continuing emphasis
on system compatibility by allowing users to utilize their
existing DUT boards and probe cards with a new interface,”
said Advantest’s General Manager and EVP, Jürgen Serrer. “In
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| Chief Engineer
Adventest’s new DUT Scale Duo interface for its V93000 EXA Scale SoC test
systems extends DUT board space for high-volume testing and is compatible
with existing DUT boards
addition to protecting customers’ investments, our approach
to delivering the most efficient test solutions also offers flexibility
and simplifies fleet management on the test floor.”
The new interface’s performance has been verified by pilot
customers before device ramp up for high-volume manufacturing.
“The DUT Scale Duo interface supports us to unleash the
next step in test cell efficiency, enabling more productive use
of test assets,” stated Renie de Kok, test technology manager
for docking and interfacing at NXP® Semiconductors.
“The co-development of DUT Scale Duo exemplifies the strategic
collaboration between Advantest and NXP, paving the
path for a future proof EXA Scale platform,” added Marty
Kampes, test technology manager for ATE at NXP Semiconductors.
DUT Scale Duo is expected to be broadly available by the
middle of this year.