EPP Europe P2.2022

Issue 11 | 2022
www.epp-europe.eu
Electronics
Production &
Test
Industry News
IPC: Likelihood of 2023
recession in Europe is
increasing
» Page 13
Tradeshow + Events
Sustainability to take centre
stage at Electronica 2022
» Page 14
W
PCB + Assembly
Remove insoluble particulate
efficiently and sustainably with
vapor degreasing
» Page 22
Interview
“We do not offer a machine,
but a ready-made
application”
Daniel Schultze,
Tresky
» Page 6
COVER FEATURE
SMT at its best
Overcoming
the challenges of
conformal coating
inspection
» Page 16
Thickness
measurement
for transparent
materials

Led by experience. Driven by curiosity.
Cheetah EVO
The standard for X-ray inspections
in SMT, semiconductors and labs.
See you at electronica
Booth A3.462
yxlon.comet.tech

» EDITORIAL
» EDITORIAL
Dear readers,
Dear readers,
European semiconductors get a boost
The semiconductor shortage is not going away anytime soon – at least
European Seeing according with semiconductors new a eyes recent study get by a IPC boost (page 12). As one of the regions hit
The According semiconductor hardest Proust, by the shortage “the scarcity, real is voyage not the going EU of has, discovery away unsurprisingly, anytime consists soon not announced – in at seeking least plans to
according new landscapes boost to a its recent but microchip in study having by research new IPC (page eyes.“ and 12). The manufacturing articles As one of this the (page regions issue 6). explore Fitting, hit too,
hardest various new that by the ways one scarcity, of of the seeing the bloc‘s EU – from leading has, using unsurprisingly, semiconductor machines announced able producers to examine plans has hidden to just opened
boost solder its joints a microchip new (page high-tech 40), research or chip measure and factory manufacturing the depth Austria of (page transparent 6). 10). Fitting, materials too,
that (page one 16), of to the giving bloc‘s a leading familiar semiconductor component a new producers purpose has via just a simple opened
a change new high-tech Inspecting circuit chip design factory advanced (page in 46). Austria packaging (page 10).
It is crucial that inspection and quality assurance methods keep up with
Inspecting Securing the demands supply advanced of more packaging complex packages. Our cover story reveals how one
It Industry is crucial provider experts that inspection (IPC, of 3D page measurement-based and 13) and quality economists assurance inspection agree methods that equipment inflation keep up has with in Europe
demands is at range a record of of more new high. complex systems In such which, packages. a difficult it says, Our economic cover drastically story climate, minimize reveals it is how vital the one number of
developed a
the
provider that the unidentified industry of 3D measurement-based maintains defects close (page control 16). inspection of its equipment supply chains. has The developed article a
range on page of 8 new explores systems how which, increased it says, digitalisation drastically minimize could make the all number the difference.
Four defects heads (page are 16). better than one
of
unidentified
With consumers demanding ever more lightweight devices, manufacturers
Four Protective heads are always layers are looking better for than new one ways to create more compact electronic
With As conformal consumers circuits. coatings Could demanding become teamwork ever more more help widespread, the lightweight industry it devices, is achieve essential manufacturers
this to faster? ensure The article
are conformal always coating looking page 26 inspection for reveals new ways how (CCI) to four processes create companies more are compact reliable. worked together electronic Our cover to story develop an
circuits. (page 16) efficient Could examines teamwork method a new help of series solder the of industry paste systems printing achieve which, in this the faster? manufacturer cavities The of article LED says, leadframes.
on provide page accurate 26 reveals 2D how and four 3D inspection companies of worked transparent together materials. to develop an
efficient Productronica method of solder paste 2021printing in the cavities of LED leadframes.
“Driving The sustainable industry has welcomed progress” the in news Munich that the world’s leading international
Productronica Highlighting trade both fair for the 2021 electronics role of electronics development as a driver and production of sustainable will technologies,
industry place and has the planned welcomed development from the 16 of news sustainable to 19 that November the automotive world’s in Munich, leading technologies, international Germany (page 14).
be able to take
The
trade this year’s fair for Electronica electronics event development EPP looks Europe set to and will live production of up course to its motto will be there be (page able – why to 14). take not drop by
place as planned from 16 to 19 at November Stand 281 in in Munich, Hall 2, Germany to say ‘Servus’! (page 14).
EPP Europe will of course Don‘t forget be there to – visit why our not website drop by
Visit our (epp-europe.eu) website , to say (epp-europe.eu) ‘Servus’! to stay up to stay date up to
date with industry the latest news industry and trends. news and
trends. (epp-europe.eu) to stay up to
See you in news Munich! and trends.
Industrie
BEYOND
BEYOND
The
network of
expertise
for industry
17 media brands for all major
sectors of industry
Information, inspiration and
We have been electrifying and fascinating
networking for professionals
customers for 100 years. We connect tech
and industry executives
We have been logies electrifying with people. and Are fascinating ready to go. our Searchi
customers Practical for for solutions. 100 knowledge years. Making We spanning connect complex technologies
all with media Together people. channels: Are with ready our Trade customers, go. journals, Searching we turn
matters sim
for solutions. websites, breakthroughs Making events, complex newsletters,
into megatrends. matters simple. Worldwide
Together whitepapers, with our customers, webinars we turn
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new standards in sustainable production -
>> Yesterday, tomorrow and beyond.
reliably and with foresight.
>> Yesterday, tomorrow and beyond.
Sophie Siegmund
Sophie Online Siegmund Editor EPP Europe
Online Editor redaktion.eppe@konradin.de
EPP Europe
Online Editor EPP Europe
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EPP Europe » 11 | 2021
GLOBAL. media.industrie.de AHEAD. EPP Europe
SUSTAINABLE.
» 11 | 2022 2021 3

» CONTENTS 11 | 2022 28. YEAR OF PUBLICATION
COVER FEATURE
Overcoming
Koh Young explains
the challenges
how its new 3D inline
DPI equipment
of CCI
» Page 16
can conduct
2D and 3D inspection of
transparent materials.
Source: Koh Young
NEWS & HIGHLIGHTS
Interview
Daniel Schultze, Managing Director of Tresky
“We do not offer a machine, but a ready-made application” 6
Industry News
8 reasons to embrace supply chain digitalisation
Should you make your supply chain digital? (Rebound) 8
Biden signs US Chips and Science Act into law 11
Infineon signs supply agreement with II-VI for SiC wafers 12
ODU launches website for mass interconnect interfaces 12
IPC: Likelihood of 2023 recession increasing 13
TRADE SHOWS & EVENTS
Electronica 2022, 15-18 November
Sustainability to take centre stage at Munich expo 14
COVER FEATURE
Koh Young examines the future of dispensing inspection
Overcoming the challenges of CCI 16
PCB & ASSEMBLY
Product Updates – PCB + Assembly 21
Removing insoluble particulate from semiconductors
Vapor degreasing explained (MicroCare) 22
Product Updates – PCB + Assembly 25
Processing larger PCBs with precision
More flexibilty in solder paste printing (ASMPT) 26
Product Updates – PCB + Assembly 29
Case study: Soldering systems in practice
It all began with a coffee machine… (Kurtz Ersa) 30
Product Updates – PCB + Assembly 34
TEST & QUALITY ASSURANCE
Product Updates – Test + Quality Assurance 38
Automatic x-ray inspection (AXI)
What are AXI systems capable of in 2022? (Göpel) 40
Product Updates – Test + Quality Assurance 44
Solid-state modules for test applications
Lower leakage current with T-circuit MOSFETs (Omron) 46
COLUMNS
Editorial 3
Imprint/List of advertisers 50
4 EPP Europe » 11 | 2022

Vapor degreasing: almost all semiconductor
wafers require cleaning to remove contamination
caused by the manufacturing process
» Page 22
Source: Microcare
Advanced Tilt and
Rotate Dispensing
Technology that provides
reduced wet out areas,
improved capillary flow
for underfill and enables
dispensing on the side walls
or around tall components.
NEW!
Electronica
15 – 18 November,
Munich
Boasting a wide and varied programme
of supplementary conferences
and forums, this year’s fair will
highlight today’s most pressing topics:
from electromobility through smart
energy, to power electronics and
sensors.
Programmable articulation of both axes
in sub-degree increment for total flexibility
Together in Process Perfection
FOLLOW US:
LinkedIn:
bit.ly/36aMJh1
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@EPPmagazine
Learn more at www.itweae.com
A division EPP Europe of Illinois » 11 Tools | 2022 Works 5

NEWS & HIGHLIGHTS » Interview
Interview with Daniel Schultze, Managing Director of Tresky
“We do not offer a machine,
but a ready-made application”
Tresky manufactures die bonding systems for high mix–low volume
production programmes. Managing Director Daniel Schultze explains
why the company places particular focus on the development and
production of fully-automatic machines.
EPP Europe: Tresky is one of about eight companies
in the world that offer fully automatic die
bonding machines for the electronics and semiconductor
industries. You specialise in high-precision
bonding of high mix–low volume production
programmes with emphasis on single laser, laser
bars and sensor technology. How did this corporate
focus come about?
Daniel Schultze: The initial impulse to begin this
work came through close cooperation with customers
such as Jenoptik, and regular contact with universities
and research institutes. It is an alliance
which benefits both parties. We had already built up
a knowledge of the area by developing appropriate
solutions for various tasks. This expertise enables us
to develop a custom-fit solution for almost any
problem a customer has. We start in CAD and can
react very flexibly to their requirements. All the
while, we maintain close ties with universities because
of their research capacities. If research and industrial
development work together from the outset,
something good usually comes out of it.
EPP Europe: Can you give an example of this
kind of collaboration?
Daniel Schultze: We are currently in the process
of evaluating a research project in collaboration with
Kiel University of Applied Sciences and other
partners to develop new modules for sintering highand
low-power components. These components are
used in the e-mobility sector, in e-cars, e-bikes and
e-motorbikes; but they can also be found in wind
turbines and high-voltage converter modules, in
smart refrigerators and military applications. Developments
in the field of autonomous vehicles, along
with the phasing out of fossil fuels, are driving the
development of this technology, as these sectors
require specific types of electronics.
Bild: Tresky
Daniel Schultze is the managing director of Tresky, a placement systems manufacturer
based in Hennigsdorf near Berlin, Germany
EPP Europe: You refer to your company as a
‘total solution provider’. What do you mean by this?
Daniel Schultze: Companies based in Germany, a
high-wage paying country, cannot compete with
Asian manufacturers. The German market is therefore
not attractive to companies that want to pro-
6 EPP Europe » 11 | 2022

duce machines in high quantities with as few adjustments
as possible. We do not see ourselves merely as
machine builders, but as a solution-oriented partner
for our customers. After all, we can offer an extremely
broad field of knowledge and high level of
flexibility. We put the expertise of our engineers at
the disposal of our customers whenever they require
a customised system. We are able to take specific
requirements into account and, because we have a
thorough understanding of our customers’ applications
and target markets, they really benefit from
our mechanical engineering and application experience.
We also attach great importance to service and
maintain close contact with our customers. This enables
us to upgrade the machines we develop, regardless
of their configuration, with a wide range of
options - even many years later. Since our machines
are flexible and modular in design, product or technology
changes can be made at any time using appropriate
applications and extensions. Our service
technicians are also available to provide assitance if
required. Satisfied customers who appreciate us and
recommend us to others are far more important to us
than a quick sale.
Widest selection
of electronic
components
In stock and ready to ship
“Satisfied customers who
appreciate us and recommend us
to others are far more important
than a quick sale”
Daniel Schultze, Managing Director of Tresky
EPP Europe: You believe in the maxim: ‘it is not
the big that eat the small, but the fast that eat the
slow’. What is Tresky‘s vision for the future?
Daniel Schultze: It is clear that our die-bonders are
in demand. This was evident even during the recent
pandemic. Electronics continued to be produced during
this time despite fragile and expensive supply
chains. Our high level of flexibility enables us to continue
developing interesting technologies, and we
are expanding. We would like to move to larger
premises before the end of the year and hire more
people. It is, however, difficult to find qualified employees.
For this reason, we are in contact with various
universities and Fraunhofer Institutes, and offer
support to students with their undergraduate and
master‘s theses. Our goal is to connect potential employees
with Tresky at an early stage in their careers.
mouser.com
www.tresky.de
EPP Europe » 11 | 2022 7

» NEWS & HIGHLIGHTS
8 reasons to embrace supply chain digitalisation
Should you make your supply
chain digital?
While it is true that that industries across all sectors are embracing digitalisation, many
supply chains continue to be held back by their outdated approach. Here, Jeff Brind, Chief
Information Officer at independent electronic components distributor Rebound Electronics,
looks at some of the key reasons you should make your supply chain digital.
Source: Rebound Electronics
Rebound says its global team can offer real-time global market intelligence from a single
point of contact
In such uncertain times, any change that increases
the predictability, visibility and reliability of the
flow of goods and materials in the electronics manufacturing
supply chain can only be a positive one. If,
however, you are still unsure about whether acrossthe-board
digitalisation is really necessary, here is
some food for thought...
1. Digital supply chains are more
resilient
Digitalisation can increase visibility throughout
your entire supply chain, which makes it easier to
identify risk at every point of the supply chain and
respond before delays occur. Supply chains that invest
in automation and new technology are also
more resilient in times of disruption because they are
less reliant on physical labour and certain processes
can continue outside of working hours.
2.Digital means increased
visibility
Visibility is increased in a digital supply chain, and
this brings more than just increased resilience. Endto-end
visibility and transparency are increased
without the need for user input, instead using lowcode
automation platforms to provide access to realtime
information to all businesses involved. This information
can include manufacturing progress reports,
location of parts and delivery status, meaning
supply chains can work to more accurate timeframes.
The electronic components distributor also offers climate-controlled certified warehousing in Europe and Asia
Source: Rebound Electronics
8 EPP Europe » 11 | 2022

NEWS & HIGHLIGHTS «
3. Digital supply chains have a
competitive advantage
A digitalised supply chain can give manufacturers
an advantage over competitors because it enables
them to manufacture products more efficiently and
deliver a better service for the end user. Increased visibility,
traceability and communication throughout
the supply chain results in fewer supply issues, and
automated warehousing processes help to create
products much quicker and with a reduced risk of
error.
4. You can generate data-driven
plans
Digitalising your supply chain gives you access to
more data and more opportunities to put that data
to good use. For example, analytics and data visualisation
can benefit activities such as demand forecasting.
Combining intelligent algorithms and historical
data allows you to predict customer trends, giving
you more time to source the components to meet
All products are subject to the
same meticulous inspection
procedures underpinned by
industry-standard certification
Source: Rebound Electronics
The Gateway to
a Smart Factory
Solutions
‹ Process control by KY
realtime monitoring
‹ User-friendly library
manager for local
access to global
database
Koh Young Europe GmbH
Industriegebiet Süd E4
63755 Alzenau
Tel. +49 (0)6188 9935663
E-mail: europe@kohyoung.com
www.kohyoung.com
‹ Improvement of
processes through
verified measurement
data
EPP Europe » 11 | 2022 9

» NEWS & HIGHLIGHTS
Source: Rebound Electronics
“We owe our success to the drive and determination of our team which ensures we meet and exceed
the level of service our clients have expected of us for the past 19 years,” says Rebound
Source: Rebound Electronics
Digitalisation can help prevent supply chain problems
About the author
Jeff Brind is the Chief
Information Officer at
Rebound Electronics,
a privately-owned
independent electronic
components distributor
experienced in supply
chain management.
that future demand. This is particularly useful for
orders that use hard-to-source components and
those that are currently experiencing a shortage.
5. Warehouses are more efficient
A digitalised warehouse is more operationally efficient
through the use of AI systems, automation and
improved access to data. AI systems can work out
the shortest, most efficient walking routes through
the warehouse and they can also be used to better
position the inventory for ease of access to the most
popular parts. Robotics can be used for loading and
unloading pallets, moving cargo and more, resulting
in a far more streamlined warehouse.
6. It is easier to manage
inventory
Digital stock management is more
efficient and less susceptible to human
error. Stock levels can be monitored remotely
and in real time, and parts or
compontents can be automatically ordered
once stock drops below a set
level.
With traditional ordering methods, it
is easy to underorder or miss a delivery
date, which could result in the loss of a
sale if a product is out of stock. On the
other hand, overordering can result in
excess stock that could become obsolete
and need offloading, and at the least
will result in additional storage costs.
7. Transit becomes more efficient
Cloud-based GPS and BLE asset tracking increases
the availability of data for supply chains, providing
real-time insights into the status and location of assets,
even when they are in transit. The efficiency of
the fleet can also be drastically improved by analysing
route efficiency and traffic conditions.
8. Labour can be used more
effectively
By investing in automation technology, employees
can be put to work more efficiently. Automation programs
can take over many menial and administrative
tasks (and even complete them outside of business
hours), while employees can focus on the more complex
tasks that only they can do, meaning that more
important work can be completed during a typical
shift.
Employees also won’t have to work longer hours to
complete these routine tasks, where increased fatigue
could increase the occurrence of costly errors.
To sum up...
Digitalisation is essential for any manufacturing
business that wants to remain competitive in the
modern climate. As these benefits demonstrate, the
question is not ‘should you make your supply chain
digital?’, but ‘how soon can you start?’.
reboundeu.com
10 EPP Europe » 11 | 2022

Boost for U.S. semiconductor industry
Biden signs U.S. Chips and Science Act into law
President Biden has signed an Executive Order to facilitate
the implementation of the bipartisan Chips
and Science Act. The long-awaited piece of legislation
which includes measures to provide USD 52
billion dollars to the country‘s semiconductor industry
to mitigate supply shortages and boost domestic
manufacturing of chips. Sometimes known just as
the Chips Act, the new policy is aimed at
strengthening U.S. science and technology innovation,
but also addresses concerns that the country
is too reliant on Asian manufacturers of chips. After
months of revisions, the bill passed the Senate on 27
July and was approved by the House of Representatives
on 28 July in a vote of 243-187. President
Biden signed it into law on 25 August 2022.
In addition to billons of dollars of subsidies, the
legislative measures include the provision of billions
of dollars worth of tax incentives to chipmakers to
encourage them to build semiconductor fabrication
plants or ‘fabs’ in the United States rather than elsewhere.
In January, Intel revealed plans to build $20
billion chip plant near Columbus, Ohio but postponed
its ceremonial address at the site in July while it
waited for Congress to pass the Chips Act.
The U.S. currently accounts for 12% of global semiconductor
manufacturing; in 1990, its share was
37%. Speaking on 26 July in a meeting with CEOs
and Labor Leaders on the importance of passing the
bill, President Biden said, “America invented the
semiconductor. It’s time to bring it home.”
Source: Pixabay
8 processes
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EPP Europe » 11 | 2022 11

» NEWS & HIGHLIGHTS
New strategic partnership for semiconductor material
Infineon signs supply agreement with II-VI for silicon carbide wafers
The skyrocketing growth of the electric vehicle (EV) market is driving demand for SiC-based power
electronics in EV drivetrains, onboard battery charging units, and charging infrastructure, explained II-
VI in a press release
Source: II-VI Incorporated
Angelique van der Burg, Chief Procurement
Officer at Infineon
Source: Infineon
Infineon Technologies AG has signed a
multi-year supply agreement with U.S.
optical materials and substrate manufacturer
II-VI Incorporated for 150 mm silicon
carbide (SiC) wafers. With the agreement,
the chipmaker secures further access
to the strategic semiconductor material
to meet the strong increase in customer
demand. As strategic partners, II-VI
and Infineon will also collaborate in the
transition to 200mm SiC diameter wafers.
“SiC compound semiconductors set new
standards in power density and efficiency.
We are leveraging them to deliver on our
strategy of decarbonization and digitalization,”
said Angelique van der Burg, Chief
Procurement Officer at Infineon. “Infineon
is increasing investments in its SiC
manufacturing capacity to meet the
rapidly growing demand from our customers.
We are pleased to add II-VI to our
strategic supplier base and grow our
business together.”
“Infineon, as a market leader in power
semiconductors, is an important partner
for us,” said Sohail Khan, Executive Vice
President, New Ventures & Wide-Bandgap
Electronics Technologies at II-VI. “Our
highly specialized products are now helping
Infineon provide innovative electronic
components to key customers worldwide.”
Infineon expects its SiC semiconductor
sales to grow by more than 60
percent on average per year, reaching approximately
$1 billion by mid-decade.
www.infineon.com; ii-vi.com
New website for growing product segment
ODU launches online offering for mass interconnect interfaces
A leading suppliers of connector systems ODU has
launched a new website for its mass interconnect interfaces
product portfolio. These are now presented on
their own website www.odu-interconnect.com.
Just as in the development of its ODU-MAC Black-Line
mass interconnect interfaces, the company says it
wanted to make things as easy as possible for the user
with the new website. Thanks to its user friendly design,
the technology provider says, anyone who requires information
can get to it quickly and efficiently.
Contact technology
The company’s mass interconnect systems are mainly
used for testing printed circuit boards and electronically
assembled components. “What is decisive in this regard?
Reliable measurements and great flexibility,” the
company said in a statement. “Unsurprisingly, ODU‘s
contact technology is convincing … due to its high reliability.
Equally important is the individual configuration
of interfaces, for which the modular connectors
are ideally suited.”
“It was the next logical step to offer our own mass interconnect
interface,” said Tobias Eder, product manager
at ODU.
Continuous product enhancement
To meet the needs of as many applications as possible,
ODU says its portfolio is constantly being expanded. The
latest extension is a so-called electronics housing,
which can be used as an alternative to the adapter. It
allows connectors to be attached to the rear panel for
individual test requirements. At the same time, the
housing protects electronic components and cables.
www.odu-interconnect.com
12 EPP Europe » 11 | 2022

NEWS & HIGHLIGHTS «
QUALITY
PIEKTRAINING.COM
IPC September Economic Outlook Report
Likelihood of 2023 recession in U.S. and Europe is increasing
According to IPC’s September 2022 economic outlook
report, the economic picture in the United
States continues to dim and the likelihood of a recession
next year continues to increase. The U.S.
economy is expected to expand just 1.6 percent in
2022, less than half as fast as the 3.9 percent growth
projected at the start of the year. Next year, the
economy is slated to expand just 0.6 percent, down
from an expected 2.6 percent growth. A recession in
the United States next year is not a foregone conclusion,
but the probability has increased.
Europe
The picture in Europe is decidedly dimmer, IPC continued.
The Russian invasion of ASSEMBLY Ukraine continues to
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put tremendous pressure on the global economy, but
the impact is especially pronounced in Europe. Europe
reported annual inflation of 9.1 percent in August,
another new high for the continent. Moreover,
pressures continue to mount and Europe will see a
few more months of new inflationary highs.
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AND
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TRAINING COURSES
“Right now, all eyes
are on inflation,” said
Shawn DuBravac IPC
chief economist and
report author. “Whereas
inflation has likely
peaked in the U.S.,
that is not the case in
Europe, and likelihood
of a recession in Europe
next year is high.
When the prospect for
growth is limited, it does not take much to push an
economy into recession.”
PROGRAMS
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In addition TRAINING
to DuBravac‘s observations, the report
WIRING
AND
CABLE SPECIAL
also provides U.S. and European data on economic
growth, employment, consumer sentiment, manufacturers’
sentiment (PMI), manufacturing capacity utilization
and end markets for electronics.
ipc.org
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Europe reported annual
inflation of 9.1
percent in August, another
new high for the
continent. Moreover,
pressures continue to
mount and Europe will
see a few more months
of new inflationary
highs, IPC said
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Source: Pixabay
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EPP Europe » 11 | 2022 13

Source: Messe München
Visitors will encounter smart energy everywhere at Electronica 2022, as electronics also has a key role to play in the energy transition
Electronica 2022, 15-18 November, Messe München
Sustainability to take centre
stage at Munich expo
In the four years since Electronica last took place in person, the industry (not to
mention the world) has undergone some seismic changes. Boasting a wide and
varied programme of supplementary conferences and forums, this year’s fair
will highlight today’s most pressing topics: from electromobility through smart
energy to power electronics and sensors.
Expectations are high for this year’s Electronica
event. The last time the trade fair was held in
real life, it attracted a record 80,000 visitors from
over 80 countries. Skipping over the expo’s purely virtual
outing at the height of the pandemic in November
2020 (which still managed to attract over 8200
participants), this year‘s edition looks set to be just as
popular. “Exhibitors, top decision makers and thought
leaders want to discuss innovations and trends in
person again at last and they’re already looking
ahead to the Fall with confidence,” said Dr. Reinhard
Pfeiffer, Deputy CEO of Messe München. “For them,
electronica is the world’s most important industry
get-together and the only one this year that seamlessly
covers the complete spectrum of electronics.”
Companies from over 40 countries, ranging from
start-ups to global corporations, will come together
across 13 halls to present products and solutions, and
exchange ideas about the future of the industry.
“Driving sustainable progress”
The motto for this year’s event is cleverly worded.
In addition to a strong emphasis on electronics as a
driver of sustainable technologies, the development
of sustainable automotive (or ‘driving’) technologies
themselves will also be in focus. As well as electromobility,
key topics at the expo will include smart
energy, industrial electronics and sensors – many of
which will be discussed in depth at the supplementary
conferences and forums.
The issues and challenges in the field of microelectronics
will be addressed separately at the co-located
event Semicon Europa, recognized as one of
the largest international trade fairs for semiconductor
manufacturing in Europe.
Smart energy
Recent events mean that the question of how we
attain energy sustainably is perhaps more pressing
than ever before. The 2022 show will highlight the
vital role of electronics technologies in the transformation
of energy infrastructures.
Smart energy refers to intelligent technologies and
solutions aimed at achieving efficient production,
distribution, use and storing of energy, across the entire
value chain. According to a study by the IMARC
Group, the global market for smart energy is expected
to increase at a compound annual growth
rate (CAGR) of 9.82 percent from USD 138.8 billion
in 2021 to USD 247.8 billion by 2027. Analysts ident-
14 EPP Europe » 11 | 2022

TRADE SHOWS & EVENTS «
ified the growing demand for intelligent electricity
grids—“smart grids”—as a main driver of this growth.
Power electronics are also of high importance
when it comes to energy saving. According to a study
by the European Center for Power Electronics (ECPE),
more than a quarter of electrical energy could be
saved through the use of modern power electronics.
Visitors will encounter smart energy everywhere at
Electronica 2022. The Power Electronics and Embedded
Systems Forums, which runs across 4 days
(15–18 November) will cover the whole spectrum of
power electronics. Exhibitors in the field of electricity
supply, such as those providing transformers,
electricity supplies, supply units and batteries, will be
located in Hall A4.
Electromobility
Electronica 2022 will also shed light on the mega
trends that are transforming the automotive industry,
such as autonomous driving, connectivity, electrification
and digitalization.
Exhibitors in the field of car chips will include
Bosch, Infineon, NXP, Renesas, Samsung, STMicroelectronics
and Texas Instruments. NXP will present
its S32Z and S32E processors, an expansion of its
S32 automotive platform for real-time processing of
domain and zone controlling, security processing and
vehicle electrification. And fair visitors will also have
the chance to become acquainted with Infineon’s
multi-core SoCs from its Tc4x family which covers a
broad spectrum of automotive applications, from
electric mobility, ADAS and connected cars to AI.
Industrial electronics
This year’s event will also highlight the role of industrial
electronics as an enabler of digital transformation.
The goal of Industry 4.0 is to digitalize
and network production along the entire value chain
using intelligent industrial electronics and the most
up-to-date communication technologies.
Industrial semiconductors, IIoT sensors, smart sensors
and digital twins are just some of the technologies
that will be spotlighted by exhibitors this year.
The IIoT & Cyber Security Forum, held in Forum
Hall B4 on November 16–17, will illustrate how industrial
applications can be made even more intelligent
thanks to concepts like Industrial IoT (IIoT), artificial
intelligence (AI) and 5G.
Sensors
As the leading data supplier, sensors produce the
raw material used in digitalization systems throughout
the entire value chain in virtually all industrial
segments. They are indispensable components in
every smartphone as well as devices like fitness
trackers, drones, virtual-reality headsets, smartwatches
and smart sensor nodes for the Internet of
Things (IoT). Indeed, no matter if you are talking
about smart cities, smart energy, smart homes, smart
health or smart factories, you will always find sensors
hidden beneath the term ‘smart’.
Manufacturers of all kinds of sensors from the ubiquitous
MEMS through sensors used specifically in
automotive and medical technology, to industrialgrade
sensors will attend Electronica 2022. Visitors
will also be able to see how smart sensors can optimize
their company value creation during the Embedded
Platforms Conference on November 16,
2022, as well as at the IIoT & Cyber Security Forum.
Hardware developers will not want to miss the Electrical
Connectors & Measurement Technology
Forum held in Hall 3 on 17 November, which will
cover technological highlights and trends in sensors
and measurement technology.
Supplementary event programme
Electronica is traditionally complemented by a
comprehensive array of conferences, forums and
special events. Organizers say this year’s supporting
programme will focus on knowledge transfer and interpersonal
exchanges with experts.
The Automotive Conference on 14 November will
comprise around 18 presentations, and focus on the
transformation of cars into intelligent IoT devices
with electric drive systems.
On November 16, the Embedded Platforms Conference,
which will also last one day, will concentrate
on the challenges and solutions surrounding
the embedded systems of the future. Across around
35 presentations on three parallel stages, experts
will be addressing subjects ranging from power electronics
and supply, across AI and sensors, through to
communications and software.
Last of all to take place is the Wireless Congress
2022. Systems & Applications, organized by WEKA,
will be the meeting point for the international wireless
community from November 16 to 17. The event
will concentrate on the latest developments and the
practical application of wireless technology.
World Ethical Forum
New this year is the World Ethical Electronics
Forum (WEEF) taking place on 15 November. This
event will address questions including: what does
ethical conduct mean for electronics companies?
What guidelines, structures and concepts promote
fair play in our industry?
electronica.com/en/
EPP Europe » 11 | 2022 15

COVER STORY » CCI SOLUTIONS
Thickness
measurement
for transparent
materials
ANZ_KOHYOUNG_epp_europe_316x207_3__01_2209_4c.indd 1 20.09.22 12:52
Koh Young examines the future of dispensing inspection (DPI)
Overcoming the
challenges of CCI
16 EPP Europe » 11 | 2022

AT A GLANCE
In this article, Koh Young
details the importance of
accurate CCI and
measurement, and explains
how its new 3D in-line DPI
equipment can conduct
2D and 3D inspection of
transparent materials.
Conformal coatings protect electronics
from moisture, debris, and corrosion.
They also add mechanical stability to
help reduce failures and improve an
electronic device’s reliability when it is
exposed to harsh environments. But
what happens if a coating is defective
or simply too thin? Koh Young discusses
the challenges of conformal coating
inspection (CCI) and how its latest
Neptune series can help.
A
conformal coating is a transparent protective
film with a thickness of around 50um applied
to a PCB to protect the board and its components
from corrosion (caused by vibration, temperature
changes, and so on) and from the environment. It is
used on parts that need to offer increased product
reliability via dustproofing and waterproofing. As
conformal coatings significantly reduce the chance
of circuit failure due to moisture, they are now being
increasingly applied to products which necessitate a
high level of reliability. There are various coating
methods used today including dipping, brushing, and
spraying. Selective spraying methods that only coat a
specific area are also being more widely used.
In addition to conformal coatings, various other
dispensing technologies such as underfill and overcoating
are emerging in the market. Underfill redistributes
the thermomechanical stress created by
the coefficient of thermal expansion mismatch between
the silicon chip and organic substrate and is
often applied to BGAs and CSPs in semiconductors
or during SMT processes. In some medical applications,
a droplet-shaped coating needs to be
placed on the pad, in a process known as overcoating,
and the height of this droplet needs to be
measured. Indeed, as this example makes clear,
some dispensing applications now also require specific
inspection processes.
EPP Europe » 11 | 2022 17

COVER STORY » CCI SOLUTIONS
The overlay of reference signal and measurement signal creates a convergence signal caused by reflections at the refraction lines.
The distance between the convergence peaks is the height of the material.
Source: Koh Young
3D inspection
Until recently, 2D inspection was all that was
required for conformal coating inspection; now however,
there is rising demand for 3D inspection. This
has come about because it is necessary to ensure the
coating attains a particular thickness. If the conformal
coating is applied too thinly, the parts that
require protection may not be sufficiently shielded.
If, on the other hand, the coating is applied too
thickly, the unnecessary stress this adds to the board
can cause side effects such as bubbles and cracks.
“Proper coating thickness is very
important to ensure the quality of a board
yet 3D thickness inspection is not easy
because the coating itself is transparent.”
IPC recommends a thickness of between 30um and
130um depending on the type of conformal coating.
Proper coating thickness is very important to ensure
the quality of a board, yet 3D thickness inspection is
not easy because the coating itself is transparent.
Biggest inspection challenges
So, what are the biggest challenges when it
comes to coating inspection? Conformal coatings
are done using different materials meaning that, in
some cases, the coating thickness and UV color
may be different – even for the same type of board.
As conventional 2D CCI (conformal coating inspection)
systems inspect according to the UV color,
and are susceptible to the board environment, this
can lead to a high rate of 2D false calls. In order to
solve these problems, it is also necessary to continuously
draw and set the region of interest (ROI).
Finally, as explained above, because the conformal
coating is itself transparent, 3D thickness measurement
using existing inspection technology becomes
a challenge. In the case of IC components, for instance,
we find that, because the coating flows
down, it remains thin on top of the leads but
relatively thick in between them because it has gathered
here.
In the case of underfill, there is a need to check the
fillet height using 3D. Accurate measurement is difficult
due to the steep slope of the fillet. Although, it
looks black, underfill may, in some cases, have some
transparency. Before curing especially, it is even
18 EPP Europe » 11 | 2022

The LIFT measurement principle.
The sample is scanned by an IR
laser beam. The signal is split
into a reference signal and a
measurement signal (beam
splitter). The overlay of both
signals returns to the detector.
Source: Koh Young
more transparent. With a level of transparency like
this, there is no guarantee that the 3D shape is of the
correct height or not, as the light is slightly transmitted
when it is reflected. As such, it is difficult to
obtain reliable 3D data with existing CCI technology.
Currently, in order to ensure the reliability of 3D
measurements, some boards must be destroyed.
The Neptune series
To help overcome these challenges, Koh Young has
launched the Neptune series for conformal coating
inspection. The tabletop Neptune T and the inline
Neptune C+ machine. The tabletop machine is optimized
for thickness measurement, and the Neptune
C+ is the industry‘s first 3D in-line DPI, (Dispensing
Process Inspection) system, which is able to offer
both the 2D and 3D inspection of various transparent
materials.
In addition to 2D conformal coating inspection,
Neptune C+ also provides solutions for various areas
that undergo 3D inspection. As explained above, in
existing 2D CCI, defects are detected using only the
UV brightness color, leading to frequent false calls.
Bubble detection is, for instance, an area with a very
high false call rate.
In order to minimize this false call rate, Koh Young
employs an image-based machine learning-algorithm
for bubble detection. First, bubble images from
the field are collected, and classified by bubble shape
based on the collection of images, in order to continuously
enhance the bubble detection engine. The
“It is difficult to obtain reliable 3D data
with existing CCI technology.”
Neptune C+ thus enables customized bubble detection
according to bubble classification. For example,
some customers may wish to class a bubble that occurs
far away from the lead as not defective, while
others prefer to classify any bubble – no matter
where it is detected – as a defect.
User-friendly software
Programming that was difficult with existing CCI
systems has also been made easier by our userfriendly
software. The user interface is very intuitive
and easy to use. Everything from recipe creation to
result review is possible in one piece of software.
EPP Europe » 11 | 2022 19

COVER STORY » CCI SOLUTIONS
Source: Koh Young
The Neptune C+ enables customized bubble detection according
to bubble classification
Source: Koh Young
Koh Young CCI systems deliver tomographic information by area inspection meaning
the image shown on the right in which multiple layers of fluid structure can be clearly
seen can be acquired
Zusammenfassung
Eine Beschichtung schützt Elektronik vor Feuchtigkeit,
Schmutz sowie Korrision und sorgt so für
zuverlässige Funktion der Baugruppen selbst in
rauen Umgebungen. Um eine einwandfreie
Beschichtung zu garantieren, sind innovative
Testsysteme zur Qualitätssicherung notwendig.
Résumé
Un revêtement protège l'électronique de l'humidité,
de la saleté ainsi que de la corrosion et assure de
cette façon un fonctionnement fiable des modules,
même dans des environnements difficiles. Afin de
garantir un revêtement parfait, des systèmes de
test innovants sont nécessaires pour assurer la
qualité.
Резюме
Покрытие защищает электронику от влаги,
грязи и коррозии и тем самым обеспечивает
надежную работу узлов даже в тяжелых
условиях окружающей среды. Для
обеспечения безупречного покрытия
необходимо использовать инновационные
испытательные системы для гарантии
качества.
Drawing the ROI is also very simple using a rectangle,
circle, polygon, and so on. After selecting a
type of inspection, the user need only to draw an
ROI, and the inspection process is ready to go.
Most importantly, Koh Young’s systems provide the
most accurate and reliable 3D inspection regardless
of the surface condition of transparent materials.
Unlike other CCIs, the Neptune can inspect within 3
minutes without any damage to the board. Existing
CCI systems normally measure the height by adjusting
the position of this reference mirror, but our
technology does this by adjusting the frequency.
Also, instead of inspecting only one point, our CCI
systems deliver tomographic information by area inspection.
As such, the image shown above is acquired,
and as you can see, multiple layers of fluid
structure can be clearly seen.
DPI beyond CCI
Our Neptune C+ can perform 2D and 3D inspection
of conformal coatings, as well as 3D inspection of
underfills and overcoatings. Currently, it offers a
measurement range of 10 microns to 3.5 mm for
these transparent materials, in the absence of refraction.
Moreover, just to briefly explain the hardware,
it has a 12M pixel camera and 15um. There is not
much difference in size from the existing SPI and AOI
systems, but in the case of the Neptune C+ we also
have a flipper-type ready system so there may be
some differences in PCB thickness and machine
weight.
www.kohyoung.com
20 EPP Europe » 11 | 2022

MK Versuchsanlagen
PCB maker acquires Danish PCB solutions provider
Icape Group acquires Møn Print
Global technology distributor of printed circuit boards, Icape
Group, has acquired Møn Print, a major supplier of PCB solutions
in Denmark. The company, which has been active in the
industry for over 50 years, will be known as Icape Denmark.
According to a press release, the purchase price was €0.7 million,
although this may be subject to additional payments depending
on the company‘s 2022 and 2023 results. In 2021, the
Danish company generated annual net sales of DKK 9.4 million
(EUR 1.27 million) and EBIT of DKK 0.7 million. The Group expects
Møn Print‘s annual sales to grow by slightly more than
10% and its EBIT margin to significantly improve in 2022.
“We are thrilled to welcome within our Group such a renowned
player in Denmark and Northern Europe, strengthening our position
in this region,” Cyril Calvignac, Icape Group‘s CEO, stated in
the release. “This acquisition is in line with our ambitious external
growth strategy, as announced during our IPO, in order to
consolidate our global leadership in the PCB distribution
through now 29 subsidiaries worldwide. This strategic operation
enables us to offer a close proximity to our industrial customers
by joining forces with a local player, guaranteeing a high quality
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“With Icape Group, we expect to be one of the leading PCB suppliers in
Denmark,” said Tina Pedersen, CEO of Møn Print
of service. It is with enthusiasm that we will share our knowhow
with Møn Print which will benefit from the complete range
of high value-added services of [the] Group. We are confident to
complete several other acquisitions by the end of the year, with
the same objective of generating commercial and purchasing
synergies, in line with our profitable growth objectives.”
“Icape Group is a great structure with local offices in many
countries, and with more than 600 employees around the world,”
said Tina Perdersen, CEO of Møn Print. “Thanks to its organization,
network, global strategy, and proven processes, [it] became
a major player in the PCB industry. We are happy to integrate
such a serious, dedicated, and successful company to look
ahead with confidence for our customers. With Icape Group, we
expect to be one of the leading PCB suppliers in Denmark,”
Icape Denmark will continue to operate from the Møn Print facility
in Stege with its current team, which will be reinforced by
the Icape Group’s local sales engineers in the country.
www.icape-group.com
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info@mk-versuchsanlagen.de
EPP Europe » 11 | 2022 21
www.mk-versuchsanlagen.de

» PCB & ASSEMBLY
Removing insoluble particulate from semiconductors
Vapor degreasing explained
Vapor degreasing is an efficient and sustainable way of removing contaminants,
like insoluble particulate, from semiconductor wafers and components.
In so doing, it helps to ensure their later reliability and operability, as Senior
Chemist at MicroCare, Elizabeth Norwood, explains.
Semiconductor manufacturing typically
takes place in cleanrooms to protect the
complex chips from contamination. But
almost all semiconductor wafers need
some cleaning during manufacture to reticulate
accumulates on the wafer surface,
it can interfere with and degrade
deposited films that come later. It can
also cause shadowing during lithography,
reduce contact exposure resolution or
create an uneven surface that could result
in cracking during exposure.
Particulate is also a common contaminant
found on FOUPs (Front Opening Unified
Pods) used for wafer transferring. So,
the FOUPs should also be cleaned to prevent
FOUP-to-wafer contamination.
Particulate is not soluble in traditional
cleaning fluid, so it must be removed by
either chemical or mechanical means.
There are various ways to clean semiconductors
and FOUPs. One is via vapor degreasing
with specialty particulate displacement
fluids.
Source: Microcare
Vapor degreasing combines cleaning, rinsing and drying in one step to optimize throughput time
Demand for sophisticated, complex
electronics is rising. But the intricate
nature of these assemblies, which
include delicate semiconductor wafers,
can cause a reliability risk if post-etching
cleaning is not performed well. Contaminants
must be removed without damage
or alteration to the wafers. Failure to remove
these impurities could cause etching,
corrosion or pitting, resulting in poor
semiconductor operability and reliability,
Cleaning semiconductors
move contamination resulting from the
manufacturing process. Contaminants
come from many sources including chip
transport, handling, storage and manufacturing.
Soils vary and can include dust,
fingerprints, oils and water.
One of the most common semiconductor
contaminants is particulate. This comprises
dust particles, skin flakes, fibers
and other process contaminants. Particulate
contamination comes from the air,
from the abrasion of moving parts, from
clothing, or from dirty, unfiltered etching
fluids. These particles either electrostatically
bond to the substrate or they get
trapped in the wafer substrate geometry.
Particulate impacts wafer performance
in different ways. For example, as par-
What is vapor degreasing?
Vapor degreasing is a closed-loop system
with two components: a vapor degreaser
and particle displacement fluid.
Most vapor degreasing systems are toploading
batch-style cleaning machines
with two compartments: the boil sump
and the rinse sump. In the boil sump, a
batch of parts including FOUPs, MOSFETS
Almost all semiconductor wafers require cleaning
to remove contamination caused by the
manufacturing process
Source: Microcare
22 EPP Europe » 11 | 2022

Bild: Microcare
Particulate contamination comes from the air,
from the abrasion of moving parts, from clothing,
or from dirty, unfiltered etching fluids
(Metal Oxide Semiconductor Field-Effect
Transistors) or other semiconductor components
are immersed in the heated fluid
for cleaning. Often, agitation helps enhance
the cleaning fluid’s effectiveness.
This is done by leveraging the boiling action
of the cleaning fluid, adding vibrating
ultrasonic energy or using a spray
wand to loosen the particulate off the
substrate. Once cleaned, the parts mechanically
transfer to the rinse sump. The
parts rinse in pure, uncontaminated fluid
or inside the fluid vapors themselves. The
components come out cool so they are
immediately ready for use or for the next
stage of processing. Unlike the commoner
aqueous cleaning, vapor degreasing combines
cleaning, rinsing and drying in one
step to maximize takt time. It takes as
little as 6–20 minutes per batch.
Moreover, vapor degreasers typically
have a smaller footprint than aqueous
cleaners. The systems take up less valuable
production space and, because vapor
degreasing cleaning is a simple, predictable
and repeatable process, it is easy to
qualify and validate for cleanroom use.
Good particle displacement
The displacement cleaning fluids used
inside vapor degreasers have chemical
and physical properties that are advantageous
to particle displacement and help
accelerate the cleaning process. Small
particles can be difficult to remove from
wafers since strong electrostatic forces
exist between the particles and the wafer
substrate. A particle adheres to the substrate
through adhesion forces, whether
it is an electrostatic charge or Van der
Waals force. This adhesion creates a friction
force parallel with the surface: static
friction if the particle is not moving, dynamic
friction if it is. To remove the contaminant,
the cleaning fluid must reduce
the thickness of the laminar boundary
layer, break the bond and allow the particles
to release from the substrate.
Some displacement fluids are a mixture
of hydrofluoro-olefin (HFO) and ethanol
that removes fine particulate down to the
micron or even sub-micron range. The alcohol
component forms hydrogen bonds
at the fluid-substrate interface, reducing
the intermolecular forces between the
particle and the substrate. This allows the
particulate to lift more easily from the
substrate.
Plus, the fluorocarbon-based fluids are
synthetically derived, allowing for a
higher purity level than traditional hydrocarbon-based
cleaning fluids. These
ultra-pure fluids dry quickly and completely
without leaving spots or residue
behind.
High density & low viscosity
Particulate displacement fluids are
dense: typically, 20–40% heavier than
water and 50% heavier than alcohol.
They also have a lower viscosity than IPA
(Isopropyl Alcohol), water or water with
surfactant additives. The combination of
the higher density and the lower viscosity
About the author
Elizabeth Norwood is a
Senior Chemist at MicroCare,
which offers precision cleaning
solutions. She has been in
the industry more than 25
years and has a BS in Chemistry
from the University of St.
Joseph. Norwood researches,
develops and tests cleaningrelated
products. She currently
has one patent issued
and two pending for her
work. For more information,
visit www.microcare.com.
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EPP Europe » 11 | 2022 23

» PCB & ASSEMBLY
FOUPs and other storage facilities should
be cleaned to prevent cross-contamination
of the wafers
Source: Microcare
of the hydrofluoro-olefin fluids results in
greater drag forces acting on the particles.
This makes it easier to dislodge the
particulate from the substrate. The particles
push away from the substrate and
wash away, dispersing into the cleaning
fluid.
Low boiling point
Particle displacement fluids are lowboiling
with typical boiling points between
40˚C/105˚F and 65°C/165°F. This
minimizes the risk of damage to wafers
and other delicate components. Vaporization
displacement fluids (below 100°C)
are aggressive enough to remove the particles,
yet won’t damage the substrate,
including composite materials. They are
compatible with most hard plastics, ceramic,
glass and metal.
Low boiling fluids also allow the vapor
degreaser to run more efficiently. And
since vapor degreasing cleans and dries in
one step, there is no need for blowers, air
knives or any other drying method that
uses power. This translates into less fossil
fuel consumption, lower carbon emission
and reduced greenhouse gas output. All
with the added benefit of energy cost
savings.
Environmentally friendly
Environmentally-friendly HFO-based
displacement fluids replace higher GWP
(Global Warming Potential) hydrofluorocarbon
(HFC) and hydrofluoroethers
(HFE)-based fluids. They also are better
for the environment than high ODP
(Ozone Depleting Potential) solvents like
CFC-113, HCFC-141b, HFC-225 and 1,1,1
trichloroethane. They meet strict regional
air quality regulations and many are not
considered HAPs (Hazardous Air Pollutants).
Many fluids are accepted by key
environmental and governmental regulatory
agencies in the United States and
most countries around the globe. They
meet global environmental directives including
the European F-Gas and REACH
(Registration, Evaluation, Authorisation
and Restriction of Chemicals) legislation.
Environmentally sustainable
Vapor degreasing with particle displacement
fluids uses no water, conserving
this precious non-renewable resource.
In addition, the process doesn’t produce
wastewater that requires specialty filtration
or treatments before disposal.
Another environmental benefit of particle
displacement through vapor degreasing
is its suitability for recycling. The
displacement fluid is used for hundreds of
cycles before it requires refreshing or replacing.
Additionally, the vapor degreaser
concentrates the contaminants as it
works. This reduces waste generation and
lowers hazardous waste disposal costs.
Wrapping up
Particle contamination is detrimental
to intricate semiconductors and silicon
wafers. Removing contamination is essential
to ensuring their performance.
Vapor degreasing using particle displacement
fluid not only ensures semiconductor
cleanliness, it also addresses environmental
and regulatory concerns.
Companies looking for help with displacement
cleaning should partner with
an expert that has displacement fluid and
vapor degreasing expertise. They can conduct
on-site audits or perform in-lab
tests with sample wafers to ensure cleaning
success. Based on the wafer substrate
and the particulate, these specialists can
recommend, or engineer, the fluids and
processes that achieve the best results.
www.microcare.com
Zusammenfassung
Die Entfernung von Verunreinigungen bei komplexen Halbleitern
und Silizium-Wafern ist durch Dampfentfettung mit Partikelverdrängungsflüssigkeit
gewährleistet und berücksichtigt zudem Umweltaspekte
sowie gesetzliche Vorgaben.
Résumé
L'élimination des impuretés dans le cas de semi-conducteurs complexes
et de plaquettes de silicium est assurée par un dégraissage à
la vapeur avec un liquide de déplacement des particules. Elle tient
également compte des aspects environnementaux et des exigences
légales.
Резюме
Удаление загрязнений в случае сложных полупроводников и
кремниевых пластин осуществляется методом паровой
очистки с использованием вытесняющей жидкости, при этом
учитываются аспекты охраны окружающей среды и
требования законодательства.
24 EPP Europe » 11 | 2022

Rework technologies
PDR launches integrated solder
paste print part system
Source: PDR
The system mounts to
all Evolution Series
rework platforms for
vertical lift utilizing
the Integrated Vacuum
Pick Up Feature/
Gram Force placement
settings.
PDR, a manufacturer of BGA rework systems, test and X-ray inspection
systems, has introduced a new ‘Integrated Solder Past
Print Part System’ for rework. The company said the tools are
designed to work with all its Evolution Series rework systems.
“Treated with high durability carbon nanotube technology for
superior paste-to-component release, the new print part system
offers superior paste printing to component results with
minimal effort,” the company said. “Key to the success of any
print part operation is the ability of the print part fixture to
supply correct and equal pressure to the component when
undergoing the pasting operation. [Our] exclusive design offers
a hands-free/tool-free calibrated pressure nest to ensure constant
and direct pressure is achieved, thus providing superior
paste application and deposition, virtually eliminating the need
for re-prints.”
www.pdr-rework.com
Reflow oven technology
24-channel profiling option from KIC
The new option consists of two
12-channel SPS units, paired
together and run as a single
24-channel profiler inside of a
new thermal barrier.
Source: KIC
KIC has introduced a
new Dual Profiling option
for Profiling Software
2G and SPS
Smart Profilers, allowing
up to 24 thermocouple locations in a single profile run for
temperature profiling measurements. This added value is key
for customers who require more sample locations on some of
their products, but still want to use their profiler on smaller
boards requiring less. Dual profiling allows this flexibility. Using
the Profiling Software 2G application, a user can ‘pair’ two
standard 12-channel SPS Smart Profilers together, and they
will function as a single profiler.
www.kicthermal.com
EPP Europe » 11 | 2022 25

» PCB & ASSEMBLY
Processing larger PCBs with precision
More flexibility in solder
paste printing
The DEK TQ solder paste printer by ASMPT is known, even by the world’s
most demanding electronics manufacturers, for its ability to deliver
maximum precision and speed within a compact footprint. The updated
DEK TQ L model adds flexibility into the mix. Able to process boards
of up to 600 mm x 510 mm, the new system fits seamlessly into the
company’s non-proprietary Open Automation concept.
With an alignment accuracy of ±12.5 microns
@ 2 Cmk and a certified wet accuracy of
±17.0 microns @ 2 Cpk, the DEK TQ platform is one
of the most precise paste printers on the market, enabling
it to print pads for 0201 (metric) components
and other modern ultra-fine-pitch applications. Featuring
the same level of positioning accuracy and
process stability as its forerunner, the new DEK TQ L
delivers significantly enhanced performance within a
footprint that is only slightly larger (1.3m x 1.5m
rather than 1m x 1.3m). All DEK TQ printers can also
be combined to operate in tandem by positioning
two machines back-to-back: doubling the line’s
printing capacity without increasing its length.
Source: ASMPT
The new printing platform from ASMPT
(right) offers more flexibility and is
able to process circuit boards measuring
up to 600mm x 510mm.
26 EPP » 11 | 2022

Versatile format
The biggest difference in the DEK TQ L compared to
the earlier model is the significant increase in the
size of the boards it is able to process. The new system
is suitable for PCBs measuring up to 600mm x
510mm (approx. 23.6“ x 20“) - a 90 percent increase
compared to the DEK TQ. At 560mm x 510mm (approx.
22“ x 20“), the DEK TQ L’s printable area has
also grown by more than 78 percent. This generous
production format offers electronics manufacturers
new degrees of freedom. Not only can they print
larger PCBs but, with the speedy three-stage conveyor,
they can also process three substrates with a
length of up to 345 millimetres in one pass.
Off-belt speed with linear drives
ASMPT has also employed linear motors throughout
the DEK TQ L. This off-belt concept improves not
only the machine’s precision and repeat accuracy, it
also helps it deliver high processing speeds with a
core cycle time of 6.5 seconds or less with the threestage
conveyor. The innovative clamping system, a
more advanced printhead and the NuMotion controller
with fiberoptic cabling (developed by ASMPT)
further contribute to improvements in production
speed.
The high-speed understencil cleaning system also
operates with its own linear drives, which makes it
twice as fast as conventional systems. Additionally,
depending on the board size, the cleaning system
can be equipped with three different sizes of fabric
rolls that can be changed quickly and easily.
Zero-line-stop philosophy
The new platform‘s printers are designed to run for
more than eight hours without user intervention. For
normal cleaning cycles, a 22-meter fabric roll is long
enough for a whole shift, and the seven-litre cleaning
fluid tank requires a refill only after eight hours
or longer. The cleaning agent is applied (from above
via a dispenser) onto the board area being processed,
significantly reducing consumption. The pivot design
ensures coplanary contact with the stencil underside
for maximum cleaning quality.
To minimize manual assists, an optional paste
management system with automatic paste dispenser
and integrated paste height control with individually-configurable
warning and stop thresholds is
available. Also available to facilitate non-stop printing
is the optional Dual Access Cover, whose laterally
movable portion provides full access to the paste
cartridge so that it can be replaced while the main
cover stays closed and the printer keeps operating.
The three-stage transport system means that while a board is being printed, the one
previously processed is moved out and the following one is loaded
Needs-oriented automation
The DEK TQ L printer has been designed to fit in
with ASMPT’s Open Automation approach. This costoptimized
alternative to the fully-automated shop
floor has proved successful in electronics production.
By allowing users to automate existing lines and
processes in stages according to their needs, the
company offers a variety of solutions for step-bystep
automation for the new platform (based on ROI
considerations). As Jens Katschke, Senior Process
Solutions Manager at ASMPT, explains, “the various
automation options for the latest generation of DEK
TQ printers enable SMT manufacturers to design an
Integrated Smart Factory in accordance with their
own ideas without having to depend on a specific
equipment manufacturer.”
Customers who opt for the additional Smart Pin
Placement feature can also benefit from fewer manual
assists. The system operates with two pin sizes
(4mm and 12mm in diameter). In the DEK TQ L, the
magazine holds up to 60 pins and the system automatically
verifies the position and the height of each
pin after setting it. This prevents any single pin
which is perhaps minimally elevated by dirt on the
table from damaging the entire assembly.
Automation options for the Integrated Smart Factory
go even further. Together with the WORKS Process
Expert software, the Process Lens SPI system
partners with the DEK TQ L to form a system that is
as productive as it is functional. It provides the
printer with continuous feedback about the print
quality and can even modify settings on the system,
allowing the printing process control and optimization
functions to run autonomously. It can even
take process data from third-party systems into ac-
Source: ASMPT
EPP Europe » 11 | 2022 27

» PCB & ASSEMBLY
The Dual Access Cover option allows solder paste cartridges to be swapped out during operation, meaning fewer line stops
Source: ASMPT
count, for example from AOI systems at the end of
the line. The understencil cleaning process can also
be controlled automatically. It is no longer carried
out based on a rigid schedule, but only when the in-
Zusammenfassung
Für mehr Flexibilität in der Verarbeitung von großen
Leiterplatten wird ein neuer Lotpastendrucker vorgestellt,
der Boards von bis zu 600 mm x 510 mm mit
durchgängigem Automatisierungskonzept verarbeitet.
Résumé
Une nouvelle imprimante à pâte à braser est
présentée, pour plus de flexibilité dans le traitement
des grands circuits imprimés. Elle traite des cartes
allant jusqu’à 600 mm x 510 mm avec un concept
d’automatisation continu.
Резюме
Для обеспечения большей гибкости в обработке
больших печатных плат представлен новый
принтер для нанесения паяльной пасты,
позволяющий обрабатывать платы размером до
600 мм х 510 мм на основе концепции сплошной
автоматизации.
telligent quality management system recognizes,
based on measurements data, that a cleaning cycle is
needed.
Easy integration via open interfaces
Since open, non-proprietary and easily retrofittable
systems are major advantages of the Open
Automation concept, the new printer features
multiple interfaces and protocols. Examples include
the IPC-HERMES 9852 and IPC-CFX standards for
process data and ASMPT workflow solutions such as
the WORKS module Command Center, plant-wide
asset and maintenance management with Factory
Equipment Center, or the entire WORKS smart shop
floor management suite. Third-party systems and IT
systems such as MES or WMS solutions, extensive
remote support solutions, and many more are also
supported. With WORKS, for example, print jobs can
be programmed entirely offline.
Reference class
The precise printing, high process stability, small
footprint and flexible automation options of the new
solder paste printing platform have raised the bar.
Thanks to standardized, open interfaces, it is just as
easy to integrate the new high-speed printer into an
existing line as it is to combine it with machines
from other manufacturers or to automate the production
in stages. If you need to print large boards
with precision or want to make your production
more flexible, you should take a look at the DEK TQ L.
smt.asmpt.com
28 EPP Europe » 11 | 2022

Product Updates « PCB & ASSEMBLY
Integrated robotic solutions
Orbit One builds robot manufacturing cell
Swedish contract manufacturer of electronics
and electromechanics, Orbit One,
has announced that it has built a new
robot cell at its plant in Ronneby, Sweden.
The cell has been specially designed on
behalf of a large Swedish industrial company
in order to manufacture identification
and traceability solutions with builtin
analytical tools.
”We received an inquiry on whether we
could design an effective and sustainable
solution for their manufacturing.
Thanks to our fantastic cooperation with
the customer and the automation consultants
Spectrum Technology, we have
now built a unique solution, which is
fully operational,” said Vice President &
Chief Operating Officer at the OEM, Ulf
Karlsson.
”The robot cell has a fascinating complexity
and is unbelievably space-efficient.
It is fitted with three robotic arms
and requires only one operator. The cell
manufactures the entire unit and the
robot handles all steps from depanelisation
with laser, laser soldering, printed
circuit board testing, battery assembly for
plastic encapsulation and laser marking
The robot handles all steps from depanelisation with laser, laser soldering, printed circuit board testing,
battery assembly for plastic encapsulation and laser marking of the finished product,“ explained Ulf
Karlsson, Vice President and COO at Orbit One
of the finished product. The quality
requirements are extremely high and
casting is done with the maximum possible
accuracy. The robot cell configuration
delivers one product every 30 seconds,”
continued Karlsson.
”It is also gratifying that with this deal
we show that we can compete with lowcost
countries like China, for example,
thanks to our high technical expertise.
Manufacturing is also brought closer to
the customer, which is of utmost importance
during the development of complex
products, when close collaboration is essential
for the final result. The project
has also strengthened and improved our
own competence and competitiveness in
a manner that will benefit all our customers.”
www.orbitone.eu/news
Source: Orbit One
LPKF_RZ_LM_ANZ_Schneiden_188x88_EN.pdf - Oktober 6, 2022 x
Stress-free Cutting Services
Laser cutting of the smallest geometries with excellent
cutting quality and high flexibility of rigid and flexible PCBs.
Find out more: www.lasermicronics.com
electronica: November 15–18, Hall B1, Booth 219
LaserMicronics is a brand of LPKF Group:
LPKF Laser & Electronics AG Phone +49 (5131) 7095-0
EPP Europe » 11 | 2022 29

Source: ED&A
The ED&A site in
Kalmthout, Belgium
Case study: Ersa soldering systems in practice
It all began with a coffee machine…
Manufacturer of soldering systems Kurtz Ersa chronicles the history of its
customer ED&A, a Belgian developer and manufacturer of custom-made
electronic controllers, and explains how the company came to rely on Ersa
systems once it started its own manufacturing operations in 2012.
For over 40 years, ED&A has been developing and
producing customized electronic controllers for
consumer and industrial applications. The company,
based in Kalmthout, Belgium, is more than just a supplier,
describing itself as the “in-house electronics
department” for its customers. As part of a recent expansion
of its production capacity, the developer has
expanded its machinery portfolio with the addition of
an Ersa Versaflow 4/55 selective soldering system.
Source: ED&A
ED&A has been awarded a Factory of the Future
designation by Agoria/Sirris for the third time
Background
ED&A was founded in 1981 by
Agnes Francken and her husband
Flor D´Handschotter, who
was at that point working as a
teacher of electronics. The idea
to start a company was sparked
after a student’s father asked
Flor to develop a controller for a
coffee machine. Not content
with simply saying, “yes, let’s do
it”, he seized the opportunity
and founded his own business. It
took four years before the enterprise
hired its first two employees
– and both are still
within the company. Fast forward 37 years and ED&A
employs 110 people (50 in production) and reported
a turnover of over 25 million Euros last year. 20% of
business takes place in Belgium, the rest is for export.
In 2009, Gert D´Handschotter took over management
of the business from his parents.
Centrally located in Kalmthout with a production
area totalling 5,000m 2 , the company’s current focus
is on the development and production of custommade
electronics for innovative machine and appliance
manufacturers, such as makers of washing
machines, ventilation systems, heat pumps, coffee,
and baked goods machines.
In-house production
On 8 October 2012, ED&A took the groundbreaking
step of opening its own production facility with the
help of various systems, including a number of Ersa
soldering machines. Having previously outsourced all
its manufacturing, mainly to Belgium and Romania,
the decision to manufacture its own designs inhouse
was made after intensive evaluation and research.
The quality of the outsourced electronic assemblies
did not always meet requirements and an
increasing number of bottlenecks was affecting
production capacity.
30 EPP Europe » 11 | 2022

PCB & ASSEMBLY «
Source: ED&A
Source: ED&A
Part of the production opened in 2012: an Ersa stencil printer
View of the ED&A production – at the front: the Ersa Hotflow 3/14e reflow soldering system
One person was central to the transformation: Eric
Vets. Vets joined ED&A in November 2011, and
brought with him many years’ experience of electronics
production working for a large mobile phone
manufacturer where he had become very familiar
with Ersa systems (provided via Belgian representative
Smans NV). After one day on board, Eric and
the ED&A team went to the Productronica trade
show in Munich to see the Ersa portfolio up close.
Shortly afterwards, they ordered a Hotflow 3/14e reflow
machine, a Versaflow 3/45 selective machine, a
Versaprint 2 stencil printer and an HR 600 Rework
System. Driven by Eric, ED&A went on to invest in a
top-class machine park with state-of-the-art soldering
systems, which, among other things, enabled full
inline X-ray inspection of every PCB and comprehensive
digitization of production with traceability down
to the component level.
“Of course, it was a big challenge to begin an electronics
manufacturing operation from scratch – we
actually had zero experience until we started production
in the fall of 2012,” Gert D´Handschotter recalls.
“Eric and his extensive experience in electronics
manufacturing were worth their weight in
gold for ED&A, it was an absolute win-win situation
for everyone involved – otherwise it would have been
very difficult to get such a production up and running,”
says Tom Berx, Ersa Sales Manager responsible
for Belgium, the Netherlands and Luxembourg at the
time. Eric retired in 2017, but he, together with the
ED&A team, had initiated a development that allowed
the company to grow to its current size. “The local
support from the Smans team, who is not far away
with its headquarters in Turnhout, was invaluable,
especially at the beginning,” says D´Handschotter.
For every machine ED&A has ordered, quality has always
been the most important factor. This is where
Eric´s expertise came in, as he had had the most experience
with high-quality machines. “Our goal with
our own production was to become the leader in
terms of production quality in Belgium. We succeeded
in this, and the Ersa systems we ordered initially
and subsequently have contributed significantly
to this,” D´Handschotter adds.
More flexibility, more speed
Since starting its own production line, the company
has reduced lead times by more than 60%
while increasing product quality by a factor of 10
(compared to its previously outsourced manufacturing
model). A few years after starting, the selective
Versaflow 3 machine was exchanged for the larger
Versaflow 4 model with four solder pots and two flux
“After ten years, we have gotten to know
each other well, have a stable business
partnership and know what our teams
and systems are capable of – we are
looking forward to the next decade and a
strong continued cooperation.”
Gert D´Handschotter, Managing Director, ED&A
heads (at that time, the first system of its kind in
Belgium). The highly modular character of the large
4/55 machine offers a great deal of freedom of configuration
and meets high process and qualitative
productivity standards. This results in reliably repeatable
solder joints, as well as complete documentation
of all individual process parameters.
EPP Europe » 11 | 2022 31

» PCB & ASSEMBLY
Another such system was installed at the end of
February. This time, the company invested in a
Versaflow 4/55 with six solder pots with y/z-variable
double crucible, power convection and automatic
nozzle activation for processing PCBs with a maximum
size of 508 x 508 mm. Just recently, a service
technician from Ersa was on site at the company for
three days to help to, as D´Handschotter put it,
“breathe even more flexibility and speed into the
machine – whether in soldering or through appropriate
programming.” The machine operators, who are
up to date on selective soldering technologies, took a
lot away from this visit, learning from a technician
who has accompanied the machine since the start of
its development and knows it inside out, down to the
smallest screw. “The ED&A team is really fit [regarding]
the process and continuously wants to get even
more out of the machine, which of course benefits
the customer in the end,” says D´Handschotter.
“Factory of the Future”
This is something that has also been recognized
externally by the “Factory of the Future” designation,
which ED&A received for the third time this year (as
Zusammenfassung
Ein belgischer Entwickler und Hersteller von
kundenspezifischen elektronischen Steuerungen hat
zur gezielten Erweiterung der Produktionskapazitäten
den Maschinenpark um eine Versaflow
Selektivlötanlage erweitert.
Résumé
Un concepteur et fabricant belge de commandes
électroniques sur mesure a ajouté une ligne de
brasage sélectif Versaflow à son parc de machines
afin d’augmenter ses capacités de production de
manière ciblée.
Резюме
Бельгийский разработчик и производитель
индивидуально разрабатываемых систем
электронного управления в рамках
целенаправленного увеличения своих
производственных мощностей расширил свой
станочный парк станком для селективной пайки
Versaflow.
Source: ED&A
Managing Director Gert D´Handschotter (right) with Aad
Vermaat from Smans (Ersa agent in the Benelux since 2001)
well as in 2016 and 2019). The award, which stems
from an initiative by the Belgian technology association
Agoria & Sirris, evaluates “seven pillars of
transformation” every three years.
“Of course, we make sure that our colleagues and
engineers leave the manufacturing site once in a
while in order to stay up to date, or to take a look at
other productions,” says D´Handschotter. “For us, this
is a fundamental part of it. We cannot stand still if
we want to continue to be among the best in electronics
manufacturing in Belgium and beyond.
“A ‘factory of the future’ is not created by a great
machine park alone,” he adds. “This can only be realized
with the outstanding commitment of highly
motivated employees – and in cooperation with our
business partners at home and abroad.”
When ED&A now looks back, ten years later, to the
start of its own production, it is clear it has experienced
a massive surge in development. Whereas, at
that time, the company employed 25 to 30 people
and generated five million in sales, today’s workforce
numbers 110 and sales recently reached five times
that amount. The fact that it manufacturers its own
products means the company can respond to
changes more quickly and flexibly from the development
stage onwards. In the future, when new demands
pop up and a renewed SMD line investment is
on the cards once again, Ersa soldering systems will
at the top of the list for ED&A decision-makers.
“After ten years, we have gotten to know each
other well, have a stable business partnership and
know what our teams and systems are capable of –
we are looking forward to the next decade and a
strong continued cooperation,” says D´Handschotter.
www.edna.eu/en | www.kurtzersa.com
32 EPP Europe » 11 | 2022

Adhesives manufacturer strengthens position in Thermal Interface Material (TIM) market
Henkel acquires Thermexit business from Nanoramic
Leading adhesive technologies provider Henkel has
acquired the Thermal Management Materials business
of Nanoramic Laboratories (Nanoramic) headquartered
in Boston, MA, USA, and marketed under
the brand Thermexit.
Nanoramic, known until 2018 as FastCAP Systems
Corporation, is an R&D company focused on developing
high-end energy storage and thermal management
technologies based on carbon composites. The
acquisition strengthens the company‘s position in
the growing Thermal Interface Material (TIM) market
and expands its offerings for applications in highgrowing
market segments that require specialized
know-how with regards to heat management in
electronics, including 5G infrastructure, semiconductors,
and power conversion for industrial and
automotive electronics.
The Thermexit portfolio includes patented, high-performance
thermal interface gap pads based on an innovative
nano-filler technology. This technology provides
unique materials with extremely high thermal
conductivity and excellent stability.
“Thermal management solutions are an important
growth technology within our materials portfolio
and play a major role to further drive innovations
with regards to global megatrends such as connectivity,
mobility and sustainability,” explained Jan-Dirk
Auris, Executive Vice President Henkel Adhesive
Technologies. “The acquisition of Thermexit complements
our existing portfolio with offerings in highgrowing
market segments to further create value for
our customers.”
www.henkel.com
Source: Henkel
The acquisition of the
Thermexit business
strengthens Henkel´s
position in the
growing markets for
Thermal Interface
Materials by expanding
its capabilities in
high-performance
segments.
By far the best
3D AOI solution
‹ 3D measurement capability at
the highest state of the art
‹ Side-View camera solutions
for expanded inspection
capabilities
‹ Auto programming based on
artificial intelligence
Koh Young Europe GmbH
Industriegebiet Süd E4
63755 Alzenau
Tel. +49 (0)6188 9935663
E-mail: europe@kohyoung.com
www.kohyoung.com
EPP Europe » 11 | 2022 33

PCB & ASSEMBLY » Product Updates
New ventilation management system enables energy savings of up to 50%
MK Versuchsanlagen introduces further developed wet workbench
Source: MK Versuchsanlagen
Frontal view of two MK wet workbenches with
different internals and connections
German special equipment manufacturer, MK Versuchsanlagen und
Laborbedarf has announced it has further developed its wet workbench.
The company says the applications of the wet workbench,
which it newly introduced two years ago, are extremely diverse. The
metal-free system is particularly suitable for use in the semiconductor
industry: substrate cleaning; and pre- and post-treatment of silicon
wafers, glass substrates and all other start and end products in these
fields.
The manufacturer says it developers have paid particular attention to
the intelligent ventilation management system, which enables energy
savings of up to 50 percent. Continuous monitoring of the wet workbench
ensures that the volume flow of the air introduced is automatically
adjusted. The control variables are controlled via dedicated PLC
modules. Possible control loops such as activity or particle monitoring
are individually defined and implemented, depending on the application.
Energy improvements for existing laboratories are also possible
- in many cases in the form of a so called ‘retrofit’.
mk-versuchsanlagen.de
Pressure-temperature sensor technology
ViscoTec debuts miniature flush pressure sensor
ViscoTec has announced the launch of the
world’s smallest flush pressure sensor
with a chemical – largely inert – pressure
membrane made of FFKM. The company
says the miniature sensor known as flowplus-SPT
M6 is also currently the only
sensor that achieves both pressure and
temperature measurement with an M6
thread as process connection and a sensor
body that is only 15.3 mm short.
The new sensor is able to measure the
pressures of the material to be dispensed
up to 40 bar at a temperature range from
5 to 50°C. It fits into the material outlet
of the manufacturer’s dispensing systems,
but can also be installed in other applications,
where its small design reduces
possible material losses due to dead
space-optimized components. Thanks to
its intuitive mechanics and short cable
length, integration into the company’s
own dispensers is quick and easy, so that
the sensor is immediately ready for process
data acquisition.
According to the company, the integrated
electronics convert the recorded pressures
and temperatures into an analog
voltage signal, which enables uncomplicated
and fast integration into control
systems such as a PLC. The low measurement
tolerance of only 2 % and the resulting
high measurement accuracy ensure
precise and, at the same time, simple
processing of the recorded measurement
data. In addition, possible cable breaks
can be detected via a drop in the pressure-dependent
voltage signal below 0.1 V
using the master-level control system.
“Thanks to its dust- and splash-proof design
(protection class IP54), the new sensor
operates confidently and reliably in
industrial environments even without the
attachment of further housing components,
the company said. The sensor body
is made of stainless steel and is therefore
largely resistant to the effects of every
conceivable material. Furthermore, the
measuring membrane made of FFKM is
significantly more resistant than conventional
membranes, which is reflected in
noticeably reduced maintenance and
spare parts costs. By means of a chemical
resistant, drag chain suitable sensor connection
cable, the smooth coupling with
ViscoTec controllers via a 4-pole M8
standard connection is possible.”
www.viscotec.de
The company says the miniature sensor known as flowplus-SPT M6 is also currently the only sensor
that achieves both pressure and temperature measurement with an M6 thread as process connection
and a sensor body that is only 15.3 mm short
Source: ViscoTec
34 EPP Europe » 11 | 2022

Dual-curing adhesive for medical device applications
Panacol develops first UV moisture-curing medical adhesive
the adhesive to cure while still in the dispensing needle. This offers the user
a wide process window. In addition, there are no blooming of frosting effects
on the plastics, which can occur when using cyanoacrylates.
Source: Panacol
The company says the UV acrylate is ideally suited for fixing
batteries on glucose sensors (corner bonding)
Industrial adhesives provider Panacol has developed
a new adhesive system certified for use in the medical
industry known as Vitralit UD 8050 MV F. The
company says that in addition to its primary curing –
UV crosslinking, the new adhesive also offers secondary
moisture post-curing. This means that components
in medical devices can be cured in a process-safe
manner and without thermal influence,
even if shadow zones are present in component cavities.
Two challenges commonly arise in medical applications
when bonding plastics or assembling PCBs
and FPCBs. Not every plastic is transparent, which
makes it difficult to cure UV adhesives in a processsafe
manner. In most cases, thermal post-curing is
relied upon. However, thermal curing often becomes
the second challenge. Not all electronic components
and plastics can be subjected to thermal stress. In
these cases, curing with heat is not a viable option.
Dual-curing
The primary curing of the new adhesive can be
carried out in seconds with UV or LED UV light. LED
curing units with a wavelength of 405 nm, such as
the LED Spot 100 IC from Hönle, are best suited here.
Secondary curing of the adhesive in the shadow
areas that are not reached by the UV/visible light
takes place through a moisture curing process.
Surface and atmospheric moisture react with the
adhesive to initiate a curing process. Unlike moisture
curing cyanoacrylates, the new adhesive can be processed
reliably because its primary curing is based on
UV crosslinking. Moisture in the air does not cause
Adhesion to different substrates
Vitralit 8050 MV F is certified according to ISO 10993–5/-10/-23 biocompatibility
testing. Since the dual-curing adhesive exhibits high adhesion to
many different substrates, it is the optimal solution for a wide variety of
bonding applications. The UV acrylate is ideally suited for fixing batteries
on glucose sensors (corner bonding). It can also be used as a glob top for
protecting SMD components. The adhesive will cure reliably and stress-free,
even in the shadow areas under the bonding wires. When used for structural
bonding, it can be applied between transparent and non-transparent
substrates. Bonding is accomplished in seconds with UV/visible light.
Shadowed areas will subsequently post-cure with moisture. Due to its high
ionic purity, the adhesive can be processed on metallized surfaces without
hesitation. For optical quality control of the bond, the material is additionally
equipped with fluorescent markers that can be excited with short-wave
light.
www.panacol.de
DISCOVER 1 STOP SMART SOLUTION
YSP10
Printer
YSi-SP
SPI
YRM20
Mounter
YRM20
Mounter
YRM20
Mounter
YRi-V
3D AOI
info-ymeim@yamaha-motor.de
+49 2131 20 13 520
smt.yamaha-motor-im.de
EPP Europe » 11 | 2022 35

PCB & ASSEMBLY » Product Updates
Benchtop solutions
Hot air rework system offers high thermal performance
The new system can
generate 900 watts of
heat with a maximum
temperature of 600 °C
Benchtop solutions provider and
member of the OK International
brand, Metcal, has announced
the launch of the new HCT-910
Hot Air Rework System. The
company says the system is accurate
and intuitive-to-use, with
high thermal performance capable
of meeting the full spectrum
of application requirements
needed for production
and rework in electronics manufacturing.
The new system can generate 900 watts of heat with
a maximum temperature of 600 °C, expanding the
capability of the HCT-910 beyond standard thermal
demand applications to higher thermal demanding
applications in military, defense, and aerospace,
using highly metalized circuit boards.
Source: Metcal
The system incorporates a novel control method
making it easy to quickly adjust the temperature and
airflow rates without looking away from the application.
In addition, a multi-color status light on the
hand-piece is a visual cue to the operator regarding
the “current status” of the unit.
“The hot air system improves the user experience significantly
by adding features such as ‘On-the-fly’
manual control which utilizes a single push-button
knob to adjust, control, and quickly toggle between
temperature and airflow. This intuitive design, in
combination with accurate temperature, and the
performance of the 900-watt heater, will improve
throughput while controlling a tight quality process,”
said Curtis Yamauchi, Product Manager at the company.
According to the company, it can be configured for
any worldwide standard voltage and power outlets.
metcal.com
Advanced robotic technology
Altus partner Promation USA launches robotic soldering platform
Altus Group has announced that its
partner, soldering systems specialist Promation
USA has launched an intelligent
robotic soldering platform called the
Panda 500 Series.
“The Panda 500 Series Intelligent Robotic
Soldering Platform is designed for manufacturers
seeking a high performance PC
based in-line soldering system,” the company
said. “Recently launched, the system
is already receiving attention from Altus’
customers and several early orders.”
“The robotic soldering momentum has
been building here in the UK and Ireland,
with many successful installations since
we partnered with Promation USA several
years ago,” said Joe Booth, Altus CEO.
“Things will be going up a notch with the
launch of the brand-new [soldering platform].
It is the most technologically advanced
robotic soldering system on the
market and incorporates much of the
customer feedback over the last years and
focuses on upcoming trends in electronics
manufacturing taking this proven production
process to a new level.
“This unit is PC based, with vision assisted
programming, barcode reading and automatic
barcode driven program selection.
It also includes fiducial recognition and
keymark capabilities to control production
risk and ensure the same high quality
Source: Altus
The company says the new platform is designed
for manufacturers seeking a high performance PC
based in-line soldering system
soldering every time. These new functionalities
come alongside the all-important
networkability and data export for
traceability which many customers in the
UK and Ireland have been requesting to
support their high-tech, high value production
requirements.
“The [new system] will be a game changer
for many of our customers and we are
looking forward to introducing it to our
network of clients in the coming months
as our first unit arrives soon.”
Following two years of research, the robotic
soldering system has been designed
with a number of key features to assist
electronics manufacturers. It has a
500mm x 500mm working area and is
equipped with the same proven 180W
power supply and N2 at tip and range
feeding mechanisms. It also includes a
new robotic end-effector design that uses
dual articulating arms that mimic the
human hand‘s dexterity. This allows the
soldering iron or solder material to be removed
independently from each another.
www.altusgroup.co.uk
36 EPP Europe » 11 | 2022

Selective soldering systems
Sasinno debuts fully automatic screen printer
Provider of selective soldering and turkey THT line
solutions Sasinno has announced the introduction of
its new H Series fully automatic screen printer. By
separating the cleaning unit from the CCD camera,
the company says the new printer minimizes the
motor load and improves positioning precision and
speed. Additionally, the double sliders ensure that
the printer head is accurate and stable while the
scraper runs back and forth.
The programmable printing head and motor controls
ensure precise PCB control. Additionally, the new
screen printer offers automatic conveyor width adjustment,
auto stencil cleaning (dry/wet/vacuum)
and automatic 2D paste inspection. The Windows 10
interface is simple to learn and programme.
www.sasinno.com
Source: Sasinno
According to the
company, the new
printer minimizes
the motor load and
improves positioning
precision and speed
by separating the
cleaning unit from
the CCD camera
Innovaon Quality Customer Support
PRECISION ASSEMBLY SMT FINAL DEVICE CLEANROOM
Electronics
Manufacturing
Services
Assembly of rigid or flex PCBs • Reliable soldering with N2 and vacuum soldering • Selecve soldering of TH
components with N2 • Solder Paste Inspecon (SPI) • Applicaon of underfill materials • Ultrasonic welding
of plasc parts • Laser cung machine • Laser engraving machine • Electrical tesng and programming
Funconal tests • Precise assembly of complex & high density PCBs • Assembly of 0201 • Assembly of fine
BGA, µBGA • Flip Chip – down to 80µm ball size • Final assembly of OEM products • Small and midsize series
Automated Opcal Inspecon (AOI) • X-RAY inspecon • Thermal cycle tests • Pull and Shear Tests
ISO 14644: Class 6/7 (US1000) cerfied clean rooms with microbiological control • Engineering test lab
Full traceability in the producon processes • eDMS (Electronic Document Management System) • ERP&MES
ISO 13485:2016, ISO 9001:2015 and ISO 14001:2015 cerfied
CENTILLION LTD.
ILIYA BESHKOV STR. 6A
1592 Sofia, Bulgaria
+359 2 439 88 80
cenllion@cenllion.eu
www.cenllion.eu
MEDICINE
AEROSPACE AND AVIONIC
PRECISION EPP Europe INDUSTRIAL » 11 | 2022 EQUIPMENT 37

TEST & QUALITY ASSURANCE » Product Updates
Increased test efficiency for automotive radar test chamber
Antenna test system gets new features
Global provider of test and measurement software, instruments
and systems Rohde & Schwarz has augmented its R&S
ATS1500C antenna test system with a new temperature test option
and a new feed antenna. The company says these additional
features enable temperature-controlled measurements in a
wide temperature range as well as parallel access to both polarizations,
increasing test efficiency and flexibility.
The movable R&S ATS1500C is a compact antenna test range
(CATR)-based chamber. It is designed to eliminate ghost targets
within the chamber during target simulation tests and includes
a highly accurate positioner for angular measurements.
The new temperature test option creates a temperature-controlled
enviroment for the radar under test and supports a wide
range from –40 °C to +85 °C. The heated or cooled air is provided
by an external thermal air stream system that supplies the
air to the temperature bubble mounted on the positioner. This
changes the temperature without affecting the chamber‘s
measurement performance. This feature makes it possible to
automate measurements at different temperatures without a
separate climatic chamber, which increases radar testing speed.
In addition, the new universal feed antenna, which supports 60
GHz to 90 GHz, can be added to the test chamber. The antenna
includes an orthomode transducer, which enables parallel access
Source: Rohde & Schwarz
to vertical and horizontal polarizations.
With these new options, developers can efficiently characterize
RF transmitters, calibrate antenna manifolds, measure antenna
patterns, test robustness against interference, check compliance
with regulations such as ETSI and FCC as well as plan testing
and calibration procedures for later mass production. The test
system is is used as a reference environment before porting the
procedures to a production tester.
www.rohde-schwarz.com
The antenna test
system can be used
for automotive radar
module development,
validation, calibration
and compliance
testing
Boost for AI electronic component analytics software provider
Cybord enters OEM partnership with Siemens Digital Industries Software
Source: Cybord
"With this solution, our customers can gain increased transparency
over their components, enabling them to reduce risk
through more comprehensive validation,“ Izik Avidan, Analytics
Business Unit Manager, Digital Manufacturing, at Siemens
Digital Industries Software, said
Developer of an inline AI electronic component
analytics software solution, Cybord,
has announced that it has signed a new
Original Equipment Manufacturer (OEM)
partnership with Siemens Digital Industries
Software. The company’s inline visual AI
solution will be offered as part of Siemens‘
manufacturing analytics solutions for elec-
tronics manufacturers. It can
be integrated as part of a
Manufacturing Execution System
(MES) system or as a standalone
solution.
“Our strong partnership with
Siemens amplifies the value
of [our] platform and expands
our market reach,“ said Zeev
Efrat, CEO of Cybord. “We are
looking forward to working
with Siemens to bring the
power of our combined solution
to electronics manufacturers
across the industry.”
“The Cybord SaaS solution helps fill a key
gap by providing electronics manufacturers
with an accurate and scalable way
to help confirm that all PCB components
are authentic and with satisfactory
quality,” Izik Avidan, Analytics Business
Unit Manager, Digital Manufacturing, at
Siemens Digital Industries Software, said.
This is even more necessary today with
manufacturers being forced to source
components from new or less-familiar
suppliers due to supply chain disruption.
“With this solution, our customers can
gain increased transparency over their
components, enabling them to reduce risk
through more comprehensive validation.”
About the solution
Cybord inline visual AI solution uses SMT
machines‘ component imaging for visual
verification and analyzes 100% of the
electronic components at production before
they are placed on the circuit board,
without changing SMT throughput. It is
available to production line operators and
electronics manufacturers, providing production
data analytics and verification to
all stakeholders.
www.cybord.ai
38 EPP Europe » 11 | 2022

New online offering for 4K digital inspection systems
Inspectis launches new website
Global manufacturer of 4K digital inspection
systems, Inspectis, has launched a
new website, www.inspect-is.com. The
new site includes all the company’s 4K
digital inspection for electronics, medical,
and other critical inspection applications.
In making the announcement, Alistair
Gooch, Marketing Manager, said, “If you
haven‘t looked at the Inspect-is.com
website recently, please do so now! It has
been completely replaced by a fresh,
modern and more effective one that presents
the Inspectis product range in a crisp
and clean presentation, providing richer
content and more easily accessible information.”
Much of the improvement, he adds, is
owed to the complete modernization and
revision of its structure behind the screen
that makes it more responsive and faster
The company says its new website is a complete ‘re-do’
for most users. “It also helps us create
greater visibility and improves traceability
of interest whilst complying to the latest
privacy rules,” Gooch said.
www.inspect-is.com
Source: Inspectis
Discover our latest
innovations at
Besuchen Sie uns auf der electronica
Viscom präsentiert vom 15. bis 18. November 2022 seine
neuesten Inspektionslösungen auf der Weltleitmesse
electronica in München. An unserem Messestand A3-642
zeigen wir Ihnen, wie höchste Qualitätsanforderungen in
der Elektronikfertigung zielgenau erfüllt werden – schnell,
präzise und rundum vernetzt. Eins unserer Highlights, auf
das Sie sich freuen können: das leistungsstarke 3D-AXI-
System iX7059 PCB Inspection XL.
15. bis 18. Nov. 2022 Booth: A3-642
EPP Europe » 11 | 2022 39

» TEST & QUALITY ASSURANCE
Automatic x-ray inspection (AXI)
What are AXI systems
capable of in 2022?
In modern SMT production lines, AXI systems are mainly used for fully-automatic
inspection of hidden solder joints that are not visible to an AOI system. For anything
that requires close to one hundred percent optical inspection coverage,
there is no getting around the use of both an AOI and an AXI device, as the
authors of this article explain. So what exactly can modern AXI systems do?
And why are they so important?
Source: Göpel electronic
In modern SMT production lines, AXI systems are used for the fully-automatic inspection of hidden solder joints not visible to an AOI system
An AXI system is absolutely comparable
to an AOI system – only the
images are not as beautifully colourful,”
jokes Andreas Türk, product manager AXI at
Jena-based testing and inspections solutions
provider Göpel Electronic. The company’s
most recent AXI systems offer a
wide array of features including fast-scanning
image acquisition; inspection programme
creation; industry 4.0 integration;
and, thanks to the digital predictive maintenance
concept, self-monitoring. In addition,
the systems are all connected within
one network. If an anomaly is found, data
from the SPI, AOI and AXI systems is displayed
together on the verification station.
This helps operators track down the source
of the fault (see image overleaf).
Image acquisition tech
The newest AXI systems are able not
only to scan assemblies vertically (socalled
2D) or at an oblique angle (socalled
2.5D) in order to inspect solder
joints, but also using a technique called
3D x-ray inspection. This technology
allows for the inspection of solder joints in
several layers and, as such, offers the hig-
hest degree of defect detection and coverage.
In part, it is the combination of all
three image acquisition technologies that
provides the best inspection result. Since
3D technology generates a synthetic 3D
image using several obliquely-captured
images (in a process known as image reconstruction),
the image acquisition time
is longer than when using conventional 2D
or 2.5D technologies. 3D systems with
flat-panel detectors struggle here because
the time for stop-and-go movement of
the axes is significantly longer than the
actual time required for image acquisition.
40 EPP Europe » 11 | 2022

Source: Göpel electronic
AXI text programme creationis similar to that of AOI. After the CAD data import, the image data sets required for tuning are recorded once. Further test
programme creation can then be carried out completely offline
"As a rule of thumb, when using eight oblique
images for a 3D image field, you can
expect an image acquisition time of about
3–5 seconds,“ explains Türk. Depending on
the image field size and the number of 3D
image fields required, this can add up, and
the acquisition time for a high-runner
product is too long. Göpel has come up
with a solution for this (see image below).
Cycle time reduction
The company‘s AXI system X Line 3D
relies on line detectors to keep image acquisition
time low. Several detectors take
2D, 2.5D and 3D X-ray images in parallel,
and in motion. This concept makes it
possible to inspect larger areas of the PCB
or complete multiple panels in 3D. In addition
to the image acquisition time, the
time for PCB handling, image processing
and optional MES export are included in
the total cycle time. For this reason, X
Line 3D systems have a three-chamber
principle. There are three PCBs in the system
at one time in inline mode. Once
image acquisition of the board has been
completed, it is immediately moved out
of the beam path into another chamber.
This is where post-processing takes place.
This reduces both total cycle time and
radiation exposure for the components
(see top two images overleaf).
Intelligent PCB handling
Over the years, the systems have also
become smarter in terms of PCB handling.
The PCBs that are inspected by AXI systems
vary in size, weight and friction coefficient,
among other things. In the past,
these differences were not taken into account
and PCBs were always transported
at the same belt speed. This can take up
valuable cycle time. For this reason, the X
Line 3D system belt transportation system
independently learns the optimal belt
speed by means of intelliFLOW. After an
automated teach-in process, the machine
stores the optimal transport parameters
specific to the inspection programme.
Usage-based maintenance
System downtime for maintenance
work is often problematic. At Göpel, systems
use a service & maintenance app
which creates usage-based maintenance
plans in advance and monitors the machine.
Self-diagnosis using predictive and
preventive maintenance management ensures
stable machine conditions and repeatable,
consistent performance. Every
key component of the machine is monitored
and a detailed maintenance summary
is generated. A preventive maintenance
plan reduces machine downtime
and therefore costs. On a practical level,
work no longer has to be carried out according
to scheduled maintenance cycles.
Instead, usage-related values (such as
kilometres travelled by the axes; pneumatic
strokes, and X-ray source radiation
hours) are monitored. These values are
given a warning and service threshold. If
the warning threshold is exceeded, preventive
maintenance can be initiated. The
app enables operators to simultaneously
monitor several machines. This makes
maintenance easier to plan and reduces
downtime.
Source: Göpel electronic
On the left, a 2D X-ray image of a BGA. Capacitors on the bottom
side reduce the inspection coverage. In the 3D slice image (right),
the capacitors are no longer visible. The BGA itself can be evaluated
in several layers
Matthias Müller is Public
Relations Manager
at Göpel electronic
Andreas Türk is
Product Manager AXI
at Göpel electronic
EPP Europe » 11 | 2022 41

» TEST & QUALITY ASSURANCE
The x-ray image chain
of the X Line 3D consists
of a maintenancefree
micro-focus X-ray
source and several line
detectors. Only the
printed circuit board is
moved in X and Y for
image acquisition.
The X-ray source is
mounted on a Z-axis.
The line detector
package is not moved
Source: Göpel electronic
Source: Göpel electronic
Three independent chambers in the system allow
image acquisition and post-processing (reconstruction,
saving measured values, MES and so on) to
take place in parallel- saving cycle time
Source: Göpel electronic
Human-machine interaction
Human operators will certainly continue
to be required in 2022, as the enhanced
human-machine concept demonstrates.
Consisting of light bars integrated
into the system‘s external design in the
corners of the exterior cladding, these enable
operators to check the statuses of
various systems easily and quickly and
even from a distance. This helps operators
to react quickly and avoid a line stoppage.
In basic operating modes, static colours
are used to indicate if machine is checking,
waiting, is in service mode or has a
fault. In the event of an error, a distinction
is also made between the left and
right sides of the machine. If there is a
problem with the PCB infeed on the lefthand
side, it lights up red. A lack of material
in the infeed or a PCB jam in the
outfeed is also signalled using coloured
lights. In addition to static colours, certain
functions are also represented by
animations. The x-ray source warm-up is
indicated by a progress bar, for example.
The results of the last ten inspected assemblies
can also, for instance, be displayed
in statistical form (see image to
the left).
Source: Göpel electronic
Time is money. The integrated light bars help to detect problems from a distance.
This helps to avoid downtime
The radiation dose
(kerma air) is calculated
in grays in the
offline programming
software Pilot AXI as
soon as the test
programme is created
Lower radiation exposure
Reducing the time that components are
exposed to radiation is becoming increasingly
important. The X Line 3D tries to
keep radiation exposure low in several
ways. Firstly, low-energy radiation components
that do not directly contribute to
imaging are reduced via filters in front of
the x-ray source. Secondly, the assembly
is transported out of the beam path onto
another belt module directly after the
image has been acquired in order to avoid
unnecessary radiation. Thirdly, the fact
that the image acquisition process has
very short exposure time minimises the
dwell time of the test specimen in the
beam path. This further reduces the components‘
radiation dose. The offline programming
software Pilot AXI has an inte-
42 EPP Europe » 11 | 2022

Zusammenfassung
Röntgensysteme müssen an Bedingungen wie zunehmende Miniaturisierung,
hohe Durchsätze in Verbindung mit engeren Produktionsprozessen
angepasst werden, um auch in Zukunft eine große Rolle im Bereich
der Bauteilinspektion zu spielen
Résumé
Les systèmes à rayons X doivent être adaptés à des conditions telles
que la miniaturisation croissante, les débits élevés associés à des processus
de production plus serrés, afin de continuer à jouer un rôle majeur
dans le domaine de l’inspection des composants.
Резюме
Рентгеновские системы необходимо адаптировать к таким
условиям, как растущая миниатюризация и высокая
производительность в сочетании со сжатыми производственными
процессами, чтобы они и в будущем продолжали играть большую
роль в области проверки компонентов.
AXI systems are connected to MES by our
own software team during delivery (see
images below).
Conclusion
Since the first manual and automatic
X-ray systems found their way into electronics
manufacturing, the industry has
experienced enormous technological
leaps forward. While system performance
continues to improve, test specimens are
becoming ever more miniaturised and thus
more difficult to inspect using conventional
methods. Additionally, high
throughputs and more closely-timed production
processes call for a tighter framework.
X-ray systems such as the X Line 3D
have been specifically adapted to these
conditions and will play a major role in
component inspection in the future.
Electronica, Booth A3.351
www.goepel.com
grated calculation tool for calculating the
radiation dose (see lower image on p.50).
Common defect display
The test results and measured values
generated by the AXI are stored in a central
database. These can be used by humans
to classify the defect as well as to
help optimise the entire process. Göpel‘s
Pilot Connect software is at the heart of
the central data storage. Here, the date
from the SPI, AOI and AXI are merged together
and can be jointly displayed on the
verification station Pilot Verify. Devices
from other manufacturers can also be
connected. The evaluation of automatically
detected anomalies is taken into
account to avoid common error displays.
Source: Göpel electronic
Combined SPI, AOI, AXI fault representation of a
lean solder joint. Left: overview image of the PCB
with marking of the defect position by crosshairs;
middle: SPI, AOI, AXI image of the faulty component;
right: SPI, AOI, AXI detailed image of the
individual solder joint including good comparison
image, additionally, an AXI/AOI error image in
different oblique views
EPP Europe » 11 | 2022 43
1794036-3.indd 1 06.10.22 10:04

TEST & QUALITY ASSURANCE » Product Updates
BGA rework systems
PDR debuts new integrated reball system
Manufacturer of BGA rework systems,
test and X-ray inspection systems, PDR
Rework Systems, has released a new integrated
reballing system for all PDR Evolution
Series Rework Systems.
The company’s latest reball system incorporates
both solder paste application and
reball sphere attach in one system, incorporating
advanced nano-technology for a
clean, high precision reball method for
rework.
The new system also incorporates an integrated
excess sphere recovery chamber
to capture excess spheres that can
easily be accessed on the reball
platform for later use, or to accelerate
the process when re-balling
multiple BGA’s concurrently.
Although made specifically to integrate
into the company’s own systems,
the new reball system can be used as
stand-alone device for any reballing application
where highly accurate reball applications
are required.
They are made of high-quality materials
and are manufactured with new, state-
The reball system incorporates both solder
paste application and reball sphere attach in
one system
of-the-art laser technology to ensure
highly accurate stencil fabrication and
ultra-smooth edge/bore finishes.
www.pdr-rework.com
Source: PDR Rework Systems
2.5 & 3D DFT automation solution software
Siemens introduces multi-die software for 2.5D and 3D IC
design-for-test tasks
Siemens Digital Industries Software has
introduced the Tessent multi-die software
solution to help customers dramatically
speed up and simplify critical design-fortest
(DFT) tasks for next-generation integrated
circuits (ICs) based on 2.5D and 3D
architectures. The company says the
technology paves the way for mainstream
adoption of 3D ICs.
As demand for smaller, more power efficient
and higher performing ICs continues
to challenge the global IC design community,
next-generation devices increasingly
feature complex 2.5D and 3D architectures
that connect dies vertically (3D IC)
or side-by-side (2.5D) so that they behave
as a single device. However, these approaches
can present significant challenges
for IC test, since most legacy IC
test approaches are based on conventional
two-dimensional processes.
The company says its multi-die software
is the industry’s most comprehensive DFT
automation solution for highly complex
DFT tasks associated with 2.5D and 3D IC
designs. It works seamlessly with Tessent
TestKompress Streaming Scan Network
software and Tessent IJTAG software,
which optimize DFT test resources for
each block without concern for impacts
to the rest of the design, thereby stream-
lining DFT planning and implementation
for the 2.5D and 3D IC era. Using the new
software, IC design teams can rapidly
generate IEEE 1838 compliant hardware
featuring 2.5D and 3D IC architectures.
“IC design organizations are seeing dramatic
spikes in IC test complexity due to
the rapid adoption and deployment of designs
featuring densely packed dies in
2.5D and 3D devices,” said Ankur Gupta,
vice president and general manager of
the Tessent business unit for Siemens
Digital Industries Software. “With
Source: Siemens Digital Industries Software
Using the new multi-die software, IC design
teams can rapidly generate IEEE 1838 compliant
hardware featuring 2.5D and 3D IC architectures,
the company explained
Siemens’ new [m]ulti-die solution, our
customers can be ready for the designs of
tomorrow, while slashing test implementation
effort and simultaneously optimizing
manufacturing test cost today.”
In addition to supporting comprehensive
test for 2.5D and 3D IC designs, the new
software solution can generate die-to-die
interconnect patterns and enable package
level test using the Boundary Scan
Description Language (BSDL).
“As the limits of traditional 2D IC design
approaches become increasingly clear
over time, more design teams are leveraging
the power, performance and form factor
advantages that 2.5D and 3D IC architectures
can deliver. But deploying these
advanced schemes in new design starts
without first establishing a DFT strategy
that acknowledges the inherent challenges
these architectures present can
raise costs and undermine aggressive
timelines,” said Laurie Balch, president
and research director for Pedestal Research.
“However, by evolving DFT technology
to keep pace with the rapid adoption
of multi-dimensional designs, EDA
vendors can play a key role in further enabling
global, mainstream adoption of
2.5D and 3D architectures.”
eda.sw.siemens.com/
44 EPP Europe » 11 | 2022

RF performance characterization
Test solution unveiled for on-wafer device characterization
Providers of test & measurement solutions, technology systems,
Rohde & Schwarz now offers a test solution for full RF performance
characterization of the DUT on-wafer. The solutions combines
its R&S ZNA vector network analyzer with engineering
probe systems from FormFactor. As a result, chipmakers can perform
reliable and repeatable on-wafer device characterization in
the development phase, during product qualification and in production,
the company explained.
The company supplies the ZNA vector network analyzer, which
characterizes all RF qualification
parameters at coaxial
and waveguide levels,
as well as frequency extenders
for application
ranges above 67 GHz.
FormFactor addresses the
wafer contact with manual,
semi-automated and fully
automated probe systems
including thermal control,
high-frequency probes,
probe positioners, and calibration
tools. The calibration
of the complete test
system, including the R&S
ZNA, is supported in the
FormFactor WinCal XE calibration
software.
In the test setup, the user
has access to all test capabilities
of the R&S ZNA
thanks to the fully calibrated
setup. Generic
S-parameter tests allow
characterization for filters
and active devices, but distortion,
gain and intermodulation
tests can also
be performed to qualify
power amplifiers. The fully
calibrated setups also allow
all results to be directly
taken from the VNA without
postprocessing as the
calibration data are applied
directly to the VNA. Frequency
extenders open up
sub-THz frequencies such
as Dband, currently in the
focus of 6G research.
www.rohde-schwarz.com
Source: Rohde & Schwarz
The company’s ZNA
performing onwafer
measurements
together with
FormFactor
SUMMIT200 probe
system
EPP Europe » 11 | 2022 45

» TEST & QUALITY ASSURANCE
Source: Omron Electronic Components Europe
The company says its G3VM-MT MOSFET module offers maintenance-free operation and a simplified design that saves on board space
Solid-state modules for test applications
Minimizing leakage current with
T-circuit MOSFETs
There have long been concerns about the performance of solid-state relays – particularly
with regard to leakage current – when used in test applications. Gabriel Sikorjak, Technical
Sales Manager at Omron Electronic Components Europe explains how the newest solid-state
modules address these technical drawbacks, and advocates for their wider adoption.
MOSFETs are superior to reed relays in many respects.
Those continuing to use traditional relays
because of their low current leakage are missing the
benefits offered by alternative solid-state components.
Benefits of MOSFET relays
MOSFET relays deliver substantial benefits for test
equipment. They take up less space on boards, offer
faster switching times, and provide longer service life
than traditional reed relays. Many applications also
benefit from the lower power requirements, stable
on-resistance and better resistance to shock/vibration
they provide.
One of the key benefits of MOSFET relays is their
package size. Reed relay packages, placed in high
volumes on PCBs, require much more space. Increasing
demands from the semiconductor industry, test
equipment with a more advanced design, and higher
integration needs all affect the number of inspection
channels. All these extra requirements are transferred
into a larger number of switching components.
Using more compact MOSFET relays can thus
make a huge difference in terms of the amount of
board space utilised.
Then there is the question of reliability which, in
turn, translates into operating life. In test applications,
reed relays need to be regularly maintained.
Mechanical relays have generally been preferred in
the semiconductor industry (as well as for other test
equipment) – in part due to their isolation characteristics.
They do, however, have a shorter lifespan due
to abrasion of the contacts – which reduces equipment
durability over time. When used intensively,
mechanical relays need to be regularly replaced –
pushing up maintenance costs. Moreover, replacement
is necessary as soon as contact resistance goes
46 EPP Europe » 11 | 2022

G3VM-21MT reference design board testing result (DUT: FJH1100)
above a specified threshold, and this end-of-life moment
is not easy to predict or evaluate.
Alternative solid-state relays provide incomparable
electrical endurance and, when used with semiconductors,
do not suffer from mechanical contact wear.
There is thus no need for maintenance. Nonetheless,
there are still some performance trade-offs when
using these alternative relays. These are summarised
in the table on p. 56.
Leakage current – a barrier to
adoption?
Though used advantageously in many applications
in test equipment, MOSFET relays, like reed relays,
are stretched to their limits by increasingly demanding
test requirements. Despite boasting exceptional
reliability and tiny packages, to meet the needs of
the T&M industry, they must also deliver in terms of
performance. One of the most critical ratings for
semiconductor components is leakage current. During
DC parametric testing in automatic test equipment
(ATE), for example, minimizing leakage current
at the test line is a key factor to ensure accurate
measurement. Increasing drain-source voltage results
in increased leakage currents. This creates issues
with performance values. In circuit designs
where multiple lines are used, such as semiconductor
devices switching various DUTs and measurement
pins, MOSFET relays can reach their limit.
Are T-modules the solution?
Using T-circuit solid-state modules, however, it is
possible to address leakage current issues associated
with MOSFET relays. These modules are based on a
T-circuit built on three MOSFET pairs (as shown in
A T-circuit configuration
can dramatically
reduce leakage current
from MOSFET relays
Source: Omron Electronic Components Europe
Source: Omron Electronic Components Europe
EPP Europe » 11 | 2022 47

» TEST & QUALITY ASSURANCE
Source: Omron Electronic Components Europe
Isolation and insertion loss characteristics for G3VM-21MT
the diagram on p. 55). This design facilitates a higher
degree of control over leakage current. As shown in
the diagram, the leakage current flows to the ground
via a central joint when the relay is in the OFF position
and the primary line is open. The result is a substantially
lower level of leakage from the DUT than in
a standard circuit configuration.
The technical construction centres on MOSFET
pairs and enables effective control of the leakage
current, delivering minimal levels of pA or even fA.
The Omron G3VM-21MT module, for instance, specifies
a maximum leakage current less than 1pA at
V OFF
20V. Real-world values are usually lower by a
factor of ten. This indicates that T-circuit solid-state
modules represent a real alternative to conventional
solutions provided by reed relays in terms of
measurement performance.
Reference design is encouraging
A reference design is available to help design engineers
evaluate the impact of transitioning from
reed relays to these new T-circuit solid-state modules.
The aim of this is to show the value of MOSFET
relays in standard and T-circuit configurations and
reed relays on the same board under identical conditions.
Comparison of measurement accuracy can be
achieved across mature mechanical reed relays,
MOSFET relays and the MOSFET T-module.
The reference design highlights further differences
between these options and reveals the value of the
T-module. The results (shown in the graph on p.55)
prove that levels of leakage current from T-module
and reed relays are almost same as the reference
value from the DUT diode.
Gabriel Sikorjak is European Technical
Sales Manager at Omron Electronic
Components Europe. He is
responsible for managing its Technical
Competence Center in Bratislava,
Slovakia. He joined the company in
2005 and has a degree in control and
automation engineering from the
Technical University in Kosice.
Source: Omron Electronic Components Europe
Comparison of reed relay characteristics with those of a typical solid-state relay
48 EPP Europe » 11 | 2022

The range of T-circuit
MOSFET relay modules
currently available
Source: Omron Electronic Components Europe
One of the key attributes of G3VM-MT modules is
their performance at higher frequency levels. While
continuing to offer reliability and durability like
other MOSFET relays, these modules also deliver
further positive characteristics at higher frequencies.
As shown in the diagram, results from the G3VM-
21MT confirm that a device with a high reliability,
small size and extremely low leakage can offer outstanding
RF performance. Its isolation performance
is less than –30dB at 1 GHz and the insertion loss is
more than –3dB (see graphs on p. 56).
The combination of benefits offered by MOSET relays
and mechanical relays mean the G3VM-MT
series is suited not only to ATE solutions, but is also
worth considering in other applications.
More than a component
With their T- circuit structure, Omron’s G3VM-MT
MOSFET modules demonstrate exceptionally low
leakage current, giving accurate measurements in all
types of test equipment. Their compact size (5mm x
3.75 mm x 2.7mm), achieved by incorporating the
MOSFETs into the module, allows for simpler PCB
board design owing to the elimination of crossovers
in PCB tracks and simplified wiring patterns. The device
is designed for surface mounting and offered in
SPST-NO form with ambient temperature ranges
above 100°C. New solutions include a high current
and high voltage model (as seen in the diagram and
graph above). Together, these specifications help
pave the way for wider use of T-circuit MOSFET relay
modules.
In summary, these modules offer maintenancefree
operation and a simplified design that saves
space on PCBs as well as great measurement performance:
contributing to industry progress and adding
value for the customer.
Electronica, Booth A3.538
components.omron.com
Zusammenfassung
Die Verwendung von MOSFET-Modulen bietet einen
wartungsfreien Betrieb zusammen mit einem vereinfachten
Design, welches Platz auf der Leiterplatte
spart bei gleichzeitig hervorragender Messleistung
zum Mehrwert für den Kunden.
Résumé
L'utilisation de modules MOSFET offre un fonctionnement
sans entretien ainsi qu'une conception
simplifiée qui permet d'économiser de l'espace sur
le circuit imprimé tout en fournissant d'excellentes
performances de mesure, ce qui constitue une valeur
ajoutée pour le client.
Резюме
Системы, работающие на основе модулей
MOSFET, не требуют обслуживания, имеют
упрощенную конструкцию, занимающую
меньше места на печатной плате, и
одновременно обеспечивают прекрасные
измерительные характеристики, что в
совокупности экономит время и средства
клиента.
EPP Europe » 11 | 2022 49

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ISSN 1618–5587
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50 EPP Europe » 11 | 2022

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& COURSES Jan. 21-26
CONFERENCE
& EXHIBITION Jan. 24-26
SAN DIEGO CONVENTION CENTER | CA
Advance in
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EPP Europe » 11 | 2022 51

Think Fast. See Small.
Next-gen multi-process inspector for
paramount speed, accuracy and ease of use.
NEW
5 Micron
Ultra-High Res
MRS Sensor
AOI
SPI
Visit CyberOptics and
smartTec at electronica –
Booth #A3.542
CMM
SQ3000 + All-in-One Solution
For improved yields and processes.
NEW
With all-in-one functionality for AOI, SPI and CMM applications to attain in-line coordinate measurements
much faster than a traditional Coordinate Measurement Machine (CMM) – in seconds, not hours.
Powered by Multi-Reflection Suppression (MRS) sensor technology, the new 5 Micron Ultra-High
Resolution MRS sensor offers unmatched accuracy by meticulously identifying and rejecting reflection
based distortions caused by shiny components and surfaces. The result is ultra-high quality 3D images,
high-speed inspection and metrology, and improved yields and processes.
Count on the SQ3000+ for superior performance for advanced applications including advanced
packaging, mini LED, advanced SMT applications for medical, military, aerospace, electronics,
008004/0201 solder paste inspection, socket metrology and other high-end CMM applications.
52 EPP Europe » 11 | 2022
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