EPP Europe P2.2022

» CONTENTS 11 | 2022 28. YEAR OF PUBLICATION
COVER FEATURE
Overcoming
Koh Young explains
the challenges
how its new 3D inline
DPI equipment
of CCI
» Page 16
can conduct
2D and 3D inspection of
transparent materials.
Source: Koh Young
NEWS & HIGHLIGHTS
Interview
Daniel Schultze, Managing Director of Tresky
“We do not offer a machine, but a ready-made application” 6
Industry News
8 reasons to embrace supply chain digitalisation
Should you make your supply chain digital? (Rebound) 8
Biden signs US Chips and Science Act into law 11
Infineon signs supply agreement with II-VI for SiC wafers 12
ODU launches website for mass interconnect interfaces 12
IPC: Likelihood of 2023 recession increasing 13
TRADE SHOWS & EVENTS
Electronica 2022, 15-18 November
Sustainability to take centre stage at Munich expo 14
COVER FEATURE
Koh Young examines the future of dispensing inspection
Overcoming the challenges of CCI 16
PCB & ASSEMBLY
Product Updates – PCB + Assembly 21
Removing insoluble particulate from semiconductors
Vapor degreasing explained (MicroCare) 22
Product Updates – PCB + Assembly 25
Processing larger PCBs with precision
More flexibilty in solder paste printing (ASMPT) 26
Product Updates – PCB + Assembly 29
Case study: Soldering systems in practice
It all began with a coffee machine… (Kurtz Ersa) 30
Product Updates – PCB + Assembly 34
TEST & QUALITY ASSURANCE
Product Updates – Test + Quality Assurance 38
Automatic x-ray inspection (AXI)
What are AXI systems capable of in 2022? (Göpel) 40
Product Updates – Test + Quality Assurance 44
Solid-state modules for test applications
Lower leakage current with T-circuit MOSFETs (Omron) 46
COLUMNS
Editorial 3
Imprint/List of advertisers 50
4 EPP Europe » 11 | 2022