EPP Europe P2.2022

G3VM-21MT reference design board testing result (DUT: FJH1100)
above a specified threshold, and this end-of-life moment
is not easy to predict or evaluate.
Alternative solid-state relays provide incomparable
electrical endurance and, when used with semiconductors,
do not suffer from mechanical contact wear.
There is thus no need for maintenance. Nonetheless,
there are still some performance trade-offs when
using these alternative relays. These are summarised
in the table on p. 56.
Leakage current – a barrier to
adoption?
Though used advantageously in many applications
in test equipment, MOSFET relays, like reed relays,
are stretched to their limits by increasingly demanding
test requirements. Despite boasting exceptional
reliability and tiny packages, to meet the needs of
the T&M industry, they must also deliver in terms of
performance. One of the most critical ratings for
semiconductor components is leakage current. During
DC parametric testing in automatic test equipment
(ATE), for example, minimizing leakage current
at the test line is a key factor to ensure accurate
measurement. Increasing drain-source voltage results
in increased leakage currents. This creates issues
with performance values. In circuit designs
where multiple lines are used, such as semiconductor
devices switching various DUTs and measurement
pins, MOSFET relays can reach their limit.
Are T-modules the solution?
Using T-circuit solid-state modules, however, it is
possible to address leakage current issues associated
with MOSFET relays. These modules are based on a
T-circuit built on three MOSFET pairs (as shown in
A T-circuit configuration
can dramatically
reduce leakage current
from MOSFET relays
Source: Omron Electronic Components Europe
Source: Omron Electronic Components Europe
EPP Europe » 11 | 2022 47