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Grounding & Shielding for EMC<br />

Summary<br />

Grounding and shielding are two of the most<br />

effective techniques for combating EMI.<br />

This three-day course is designed for engineers,<br />

technicians, and operators, who need an<br />

understanding of all facets of grounding and shielding<br />

at the circuit, PCB, box, equipment and/or system<br />

levels. The course offers a discussion of the trade-offs<br />

for EMI control through grounding and shielding at all<br />

levels. Hardware demonstrations of the effect of<br />

various compromises and resulting grounding and<br />

shielding effectiveness are provided. The<br />

compromises that are demonstrated include aperture<br />

and seam leakage, and conductor penetrating the<br />

enclosure. The hardware demonstrations also include<br />

incorporating various "fixes" and illustrating their<br />

impact. Each attendee will receive a copy of Bill Duff’s<br />

new text, Designing Electronic Circuits for EMC.<br />

Instructor<br />

Dr. William G. Duff (Bill) received a BEE degree<br />

from George Washington University, a<br />

MSEE degree from Syracuse University,<br />

and a DScEE degree from Clayton<br />

University.<br />

He is internationally recognized as a<br />

leader in the development of engineering<br />

technology for achieving EMC in<br />

communication and electronic systems. He has more<br />

than 40 years of experience in EMI/EMC analysis,<br />

design, test and problem solving for a wide variety of<br />

communication and electronic systems. He has<br />

extensive experience in applying EMI mitigation<br />

techniques to "fix" EMI problems at the circuit,<br />

equipment and system levels.<br />

Bill is a past president of the IEEE EMC Society and<br />

a past Director of IEEE Division IV, Electromagnetics<br />

and Radiation. He served a number of terms on the<br />

EMC Society Board of Directors. Bill has received a<br />

number of IEEE awards including the Lawrence G.<br />

Cumming Award for Outstanding Service, the Richard<br />

R. Stoddard Award for Outstanding Performance and a<br />

"Best Paper" award. He was elected to the grade of<br />

IEEE Fellow in 1981 and to the EMC Hall of Fame in<br />

2010. Bill has written more than 40 technical papers<br />

and 5 books on EMC. He also regularly teaches<br />

seminar courses on EMC. He is a NARTE Certified<br />

EMC Engineer.<br />

What You Will Learn<br />

• Examples Of Potential EMI Threats.<br />

• Safety Grounding Versus EMI Control.<br />

• Common Ground Impedance Coupling.<br />

• Field Coupling Into or out of Ground Loops.<br />

• Coupling Relationships.<br />

• EMI Coupling Reduction Methods.<br />

• Victim Sensitivites.<br />

• Shielding Theory.<br />

• Electric vs Magnetic Field Shielding.<br />

• Shielding Compromises.<br />

• Trade-offs Between Shielding, Cost, Size,<br />

Weight,etc.<br />

January 31 - February 2, 2012<br />

Columbia, Maryland<br />

May 1-3, 2012<br />

Columbia, Maryland<br />

$1795 (8:30am - 4:00pm)<br />

"Register 3 or More & Receive $100 00 each<br />

Off The Course Tuition."<br />

Course Outline<br />

1. Introduction. A Discussion Of EMI Scenarios,<br />

Definition Of Terms, Time To Frequency Conversion,<br />

Narrowband-Vs-Broadband, System Sensitivities.<br />

2. Potential EMI Threats (Ambient). An Overview<br />

Of Typical EMI Levels. A Discussion Of Power Line<br />

Disturbances And A Discussion Of Transients,<br />

Including ESD, Lightning And EMP.<br />

3. Victim Sensitivities And Behavior. A<br />

Discussion Of Victim Sensitivities Including Amplifier<br />

Rejection, Out-Of-Band Response, Audio Rectification,<br />

Logic Family Susceptibilities And Interference- To-<br />

Noise Versus Signal-To-Noise Ratios.<br />

4. Safety Earthing/Grounding Versus Noise<br />

Coupling. An Overview Of Grounding Myths, Hard<br />

Facts And Conflicts. A Discussion Of Electrical Shock<br />

Avoidance (UL, IEC Requirements), Lightning<br />

Protection And Lightning Rods And Earthing.<br />

5. Ground Common Impedance Coupling<br />

(GCM). A Discussion Of Practical Solutions, From PCB<br />

To Room Level. An Overview Of Impedance Of<br />

Conductors (Round, Flat, Planes), Class Examples,<br />

GCM Reduction On Single Layer Cards, Impedance<br />

Reduction, DC Bus Decoupling And Multilayer Boards.<br />

6. GLC Reduction Methods. A Discussion Of<br />

Floating And Single-Point Grounds, Balanced Drivers<br />

And Receivers, RF Blocking Chokes, Signal<br />

Transformers And Baluns, Ferrites, Feed-Through<br />

Capacitors And Opto-Electronics.<br />

7. Cable Shields, Balanced Pairs And Coax. A<br />

Discussion Of Cable Shields And Compromising<br />

Practices, Shielding Effectiveness, Field Coupling,<br />

Interactions Of Ground Loops With Balanced Pair<br />

Shields, Comprehensive Grounding Rules For Cable<br />

Shields, Flat Cables And Connector And Pigtail<br />

Contributions To Shielding Effectiveness.<br />

8. Cable-To-Cable Coupling (Xtalk). A Discussion<br />

Of The Basic Model, Capacitive And Magnetic<br />

Couplings, A Class Example And How To Reduce<br />

Xtalk.<br />

9. Understanding Shielding Theory. An Overview<br />

Of Near-Field E And H, Far-Field, How A Metal Barrier<br />

Performs And Reflection And Absorption.<br />

10. Shielding Effectiveness (SE) Of Barriers. A<br />

Discussion Of Performance Of Typical Metals, Low-<br />

Frequency Magnetic Shields, Conductive<br />

Coatings/Metallized Plastics And Aircraft Composites<br />

(CFC).<br />

11. Box Shielding. Leakage Reduction., Calculation<br />

Of Apertures SE, Combination Of Multiple Leakages,<br />

SE Of Screen Mesh, Conductive Glass, Honeycombs,<br />

Component Penetrations (Fuses, Switches, Etc.), And<br />

EMI Gaskets.<br />

54 – Vol. 109 Register online at www.ATIcourses.com or call ATI at 888.501.2100 or 410.956.8805

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