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Strains and stresses in GaN heteroepitaxy – sources and ... - Laytec

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Stress x thickness (GPa µm)<br />

2.5<br />

2.0<br />

1.5<br />

1.0<br />

0.5<br />

0.0<br />

-0.5<br />

-1.0<br />

-1.5<br />

150 mm <strong>GaN</strong>-LED on Si<br />

concave bow<strong>in</strong>g from heat<strong>in</strong>g<br />

seed layer<br />

LT-AlN <strong>in</strong>terlayers<br />

cool<strong>in</strong>g<br />

0 50 100 150 200 250<br />

Time (m<strong>in</strong>)<br />

MQW<br />

Cracked LED structure on 150 mm Si<br />

σ~0.23 GPa

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