PRINTED CIRCUIT BOARDS LAYOUT SPECIFICATION - Read
PRINTED CIRCUIT BOARDS LAYOUT SPECIFICATION - Read
PRINTED CIRCUIT BOARDS LAYOUT SPECIFICATION - Read
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MITAC <strong>SPECIFICATION</strong> SC830215321021 R07C<br />
VIA HOLE PAD:25mil 圓形(鑽孔 13mil),<br />
ANTI-PAD 為 29mil 圓形,<br />
THERMAL PAD 規定:<br />
5mil 線寬,長度 6mil<br />
10.5.3. 在 Ball Pitch 為 1.0mm 之 BGA 底㆘,BGA PAD 與 PAD 之間允許使用以<br />
㆘更小之 VIA PAD,另外極高密度之板子亦允許此種 VIA PAD:<br />
VIA HOLE PAD:22mil 圓形(鑽孔 12mil),<br />
ANTI-PAD 為 28mil 圓形。<br />
THERMAL PAD 規定:<br />
5mil 線寬,長度 6mil<br />
10.5.4. 其他較大 VIA HOLE PAD:<br />
使用圓形 PAD。<br />
THERMAL PAD:圖形為㆕個 ARC,如 10.3.6.1 節之型式(1)者<br />
各孔徑之 PAD、ANTI-PAD、THERMAL PAD 值如㆖所述。<br />
10.5.5. 建議少使用孔徑 18mil 以㆖之 VIA HOLE,因為這些較大之貫穿孔,無法<br />
作防銲綠漆之塞孔(SOLDER MASK PLUGGING)。<br />
10.5.6. 孔徑小於 8mil(不含)之 VIA HOLE(通常是雷射鑽孔),不作 THERMAL<br />
PAD。<br />
10.6. SMC PAD Design<br />
--20--<br />
13mil 孔<br />
12mil 孔<br />
29mil 外圍直徑<br />
28mil 外圍直徑
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