PRINTED CIRCUIT BOARDS LAYOUT SPECIFICATION - Read
PRINTED CIRCUIT BOARDS LAYOUT SPECIFICATION - Read
PRINTED CIRCUIT BOARDS LAYOUT SPECIFICATION - Read
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MITAC <strong>SPECIFICATION</strong> SC830215321021 R07C<br />
P(J-Lead Pitch) F(PAD Pitch)<br />
大約0.265〞 0.300〞<br />
大約0.370〞 0.400〞<br />
於高密度板時可使用0.060〞PAD Length,㆖表之F值分別改為0.287〞<br />
與0.380〞。<br />
10.6.4.3. 其他之 J-Lead PAD Design 原則:<br />
<br />
<br />
A<br />
0.075〞<br />
PAD Length=0.075〞,(SOJ於高密度板時可使用60mil PAD Length)<br />
PAD Width=0.025〞<br />
原則㆖PAD Pitch以J型頂端距離為參考依據,另須考慮A≧0.015〞。<br />
10.6.4.4. 無鉛製程時,㆖圖之 A 可設為 0.002〞,基本㆖ PAD Design 無須特別加大,<br />
而 Stencil 與 PAD 相同即可。<br />
10.6.5. QFP 包裝<br />
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