PRINTED CIRCUIT BOARDS LAYOUT SPECIFICATION - Read
PRINTED CIRCUIT BOARDS LAYOUT SPECIFICATION - Read
PRINTED CIRCUIT BOARDS LAYOUT SPECIFICATION - Read
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MITAC <strong>SPECIFICATION</strong> SC830215321021 R07C<br />
10.6.4. J-Leaded SMT PAD Design:<br />
10.6.4.1. PLCC 包裝(㆕邊腳數相同者):<br />
0.05〞<br />
--24--<br />
B<br />
A<br />
B<br />
C<br />
PAD SIZE‥25milX75mil<br />
SOLDER MASK‥35milX85mil<br />
PLCC20 PLCC28 PLCC44 PLCC52 PLCC68 PLCC84<br />
A 0.200" 0.300" 0.500" 0.600" 0.800" 1.000"<br />
B 0.074" 0.071" 0.073" 0.074" 0.073" 0.071"<br />
C 0.348" 0.442" 0.646" 0.748" 0.946" 1.142"<br />
10.6.4.1.1. PLCC 於無鉛製程時之 PAD Design 相同。<br />
10.6.4.2. SOJ 包裝<br />
SOJ 之 PAD Design:以兩排 J 形頂端之距離(P)作為設計之依據。<br />
<br />
<br />
P<br />
F<br />
PAD Length=0.075〞<br />
PAD Width=0.025〞<br />
W 1.5W
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