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Download PDF - International Solid-State Circuits Conference

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F4: Ultra-Low-Voltage Circuit Design<br />

FORUMS<br />

Organizer: Rajeevan Amirtharajah, University of California, Davis, CA<br />

Committee: Tzi-Dar Chiueh, National Taiwan University, Taipei, Taiwan<br />

Ram Krishnamurthy, Intel, Hillsboro, OR<br />

Jos Huisken, IMEC, Eindhoven, Netherlands<br />

Siva Narendra, Tyfone, Portland, OR<br />

Steffen Paul, Universität Bremen, Bremen, Germany<br />

Pascal Urard, STMicroelectronics, Crolles, France<br />

Alice Wang, Texas Instruments, Dallas, TX<br />

Low-power CMOS design has relied heavily on VDD scaling, in the past, to exploit the<br />

quadratic dependence of dynamic power and the exponential dependence of leakage<br />

power on voltage. Today, leading-edge low-voltage designs are pushing FET operation<br />

into the weak inversion and subthreshold regimes. Investigators around the world are<br />

reporting circuits at voltages between 180mV and 700mV that offer performance that<br />

could support a range of applications in wireless sensors, mobile phones, biomedical<br />

devices, and ultra-mobile PC's. However, these circuits are highly sensitive to variations<br />

in temperature and process. Ultra-low-voltage circuits will be increasingly challenging to<br />

design as feature sizes shrink. Current trends indicate nominal supply voltages are<br />

unlikely to be reduced much below 1V, transistor threshold voltages will likely remain<br />

between 0.3 and 0.4V to manage subthreshold leakage, and effects such as random<br />

dopant fluctuation will increase the spread in transistor parameters, all of which create<br />

difficulties in designing robust circuits at low VDD. This forum brings together leading<br />

experts to describe future challenges in ultra-low-voltage design, to explore ultra-lowvoltage<br />

circuit techniques, and to stimulate thinking about prospects for future ultralow-voltage<br />

high-volume products.<br />

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