Download PDF - International Solid-State Circuits Conference
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COMMITTEES<br />
HIGH-PERFORMANCE DIGITAL SUBCOMMITTEE(continued)<br />
Hugh Mair, Texas Instruments, Dallas, TX<br />
Takashi Miyamori, Toshiba, Kawasaki, Japan<br />
Stefan Rusu, Intel, Santa Clara, CA<br />
Nobuo Tamba, Hitachi, Tokyo, Japan<br />
Jinn-Shyan Wang, Chung Cheng University, Chia-Yi, Taiwan<br />
Thucydides Xanthopoulos, Cavium Networks, Marlboro, MA<br />
IMAGERS, MEMS, MEDICAL AND DISPLAYS SUBCOMMITTEE<br />
Chair: Daniel McGrath, Eastman Kodak, Rochester, NY<br />
Farrokh Ayazi, Georgia Institute of Technology, Atlanta, GA<br />
Jan Bosiers, DALSA Professional Imaging, Eindhoven, Netherlands<br />
Iliana Chen, Analog Devices, Wilmington, MA<br />
Timothy Dennison, Medtronic, Minneapolis, MN<br />
Boyd Fowler, Fairchild Imaging, Milpitas, CA<br />
Christoph Hagleitner, IBM, Rüschlikon, Switzerland<br />
Reid Harrison, University of Utah, Salt Lake City, UT<br />
Hiroyuki Hirashima, Sharp, Nara, Japan<br />
Makoto Ikeda, University of Tokyo, Tokyo, Japan<br />
Oh-Kyong Kwon, Hanyang University, Seoul, Korea<br />
Yong-Hee Lee, Samsung Electronics, Seongnam, Korea<br />
Kofi Makinwa, Delft University of Technology, Delft, Netherlands<br />
Jun Ohta, Nara Institute of Science & Technology, Nara, Japan<br />
Albrecht Rothermel, University of Ulm, Ulm, Germany<br />
Johannes Solhusvik, Aptina Imaging, Oslo, Norway<br />
Hirofumi Sumi, Sony, Kanagawa, Japan<br />
Roland Thewes, Qimonda, Neubiberg, Germany<br />
Ian Underwood, University of Edinburgh, Edinburgh, United Kingdom<br />
LOW-POWER DIGITAL SUBCOMMITTEE<br />
Chair: Wanda Gass, Texas Instruments, Dallas, TX<br />
Raj Amirtharajah, University of California, Davis, CA<br />
Fumio Arakawa, Hitachi, Tokyo, Japan<br />
Kazutami Arimoto, Renesas, Hyogo, Japan<br />
Tzi-Dar Chiueh, National Taiwan University, Taipei, Taiwan<br />
Jos Huisken, Holst Centre, IMEC-NL, Eindhoven, Netherlands<br />
Ram Krishnamurthy, Intel, Hillsboro, OR<br />
Lawrence Loh, MediaTek, Hsinchu City, Taiwan<br />
Steffen Paul, Universität Bremen, Bremen, Germany<br />
Raney Southerland, ARM, Austin, TX<br />
Thomas Tomazin, Mediatek, Austin, TX<br />
Pascal Urard, STMicroelectronics, Crolles, France<br />
Kees van Berkel, ST-NXP Wireless, Eindhoven, Netherlands<br />
Alice Wang, Texas Instruments, Dallas, TX<br />
Yiwan Wong, Samsung Electronics, Gyeonggi-Do, Korea<br />
Ramchan Woo, LG Electronics, Seoul, Korea<br />
MEMORY SUBCOMMITTEE<br />
Chair: Hideto Hidaka, Renesas Technology, Hyogo, Japan<br />
Jinhong Ahn, Hynix Semiconductor, KyoungKi-do, Korea<br />
Mark Bauer, Numonyx, Folsom, CA<br />
Dae-Seok Byeon, Samsung Electronics, Gyeonggi-Do, Korea<br />
Joo Sun Choi, Samsung Electronics, Gyeonggi-Do, Korea<br />
Shine Chung, TSMC, Hsinchu, Taiwan<br />
Roberto Gastaldi, Numonyx, Brianza, Italy<br />
Heinz Hoenigschmid, Qimonda, Neubiberg, Germany<br />
Kazuhiko Kajigaya, Elpida Memory, Sagamihara, Japan<br />
Hideaki Kurata, Hitachi, Tokyo, Japan<br />
Nicky C.C. Lu, Etron Technology, Hsinchu, Taiwan<br />
Sreedhar Natarajan, TSMC, Kanata, Canada<br />
Harold Pilo, IBM, Essex Junction, VT<br />
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