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Design of LCOS Microdisplay Backplanes for Projection Applications

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List <strong>of</strong> publications<br />

1. J. De Baets, A. Van Calster, J. Van den Steen, G. Van Doorselaer,<br />

D. Wojciechowski, G. Schols, and J. Witters, “<strong>Design</strong> <strong>of</strong> an x-Si active matrix<br />

<strong>for</strong> high resolution reflective displays,” in Proc. <strong>of</strong> the 15th Int. Display<br />

Research Conf., (Hamamatsu, Japan), pp. 477-479, SID, October 1995.<br />

2. J. Van den Steen, G. Van Doorselaer, J. De Baets, and A. Van Calster,<br />

“Custom design and system integration,” in Proc. <strong>of</strong> the 20th International<br />

Spring Seminar on Electronic Technology, Education and Research in<br />

Microelectronics (M. Lukaszewicz and M. Kramkowska, eds.), (Szklarska<br />

Poreba, Poland), pp. 263-266, June 1997.<br />

3. J. Van den Steen, N. Carchon, G. Van Doorselaer, C. De Backere,<br />

J. De Baets, H. De Smet, J. De Vos, J. Lernout, J. Vanfleteren, and<br />

A. Van Calster, “Technology and circuit aspects <strong>of</strong> reflective PNLC<br />

microdisplays,” in Proc. <strong>of</strong> the 1997 International Display Research<br />

Conference, (Toronto, Canada), pp. 195-198, SID, September 1997.<br />

4. M. Réczey, R. Dobay, G. Harsanyi, Z. Illyefalvi-Vitéz, J. Van den Steen,<br />

A. Vervaet, W. Reinert, J. Urbancik, A. Guljajev, C. Visy, and I. Barsony,<br />

“ASIC chip, hybrid multisensor, and package co-design <strong>for</strong> smart gas<br />

monitoring module,” in Proc. <strong>of</strong> the Intern’l Workshop on Chip Package Co-<br />

<strong>Design</strong>, (Zurich, Switzerland), pp. 132-139, IEEE, March 1998.<br />

5. G. Van Doorselaer, N. Carchon, J. Van den Steen, D. Cuypers,<br />

J. Vanfleteren, H. De Smet, and A. Van Calster, “A reflective polymer<br />

dispersed in<strong>for</strong>mation display made on CMOS,” in Proc. <strong>of</strong> the ICPS,<br />

(Antwerpen, Belgium), pp. 222-225, September 1998.<br />

6. G. Van Doorselaer, N. Carchon, J. Van den Steen, J. Vanfleteren,<br />

H. De Smet, D. Cuypers, and A. Van Calster, “Characterization <strong>of</strong> a paperwhite<br />

reflective PDLC microdisplay <strong>for</strong> portable IT applications,” in Proc. <strong>of</strong><br />

the 1998 International Display Research Conference, (Seoul, Korea), pp. 55-<br />

58, SID, September 1998.<br />

7. G. Van Doorselaer, B. Dobbelaere, M. Vrana, X. Xie, N. Carchon, J. Van<br />

den Steen, J. Vanfleteren, H. De Smet, D. Cuypers, and A. Van Calster, “A<br />

paper-white chip-based display MCM package <strong>for</strong> portable IT products,” in<br />

Proc. <strong>of</strong> the IMAPS'98, (San Diego, USA), pp. 543-547, IMAPS, November<br />

1998.<br />

8. G. Van Doorselaer, N. Carchon, J. Van den Steen, J. Vanfleteren,<br />

H. De Smet, D. Cuypers, and A. Van Calster, “A silicon based reflective<br />

polymer dispersed LC display <strong>for</strong> portable low power applications,” in Proc.

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