Design of LCOS Microdisplay Backplanes for Projection Applications

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CH1 - 40 Chapter 1 : Welcome to “Display World” glass plate and backplane by means of an align layer. The way to do this, however, is probably enough for another thesis. The dimension ratios in figure 1-10 were not taken into account for the sake of clarity; the following figures give a better understanding of the differences in order of magnitude: Align layer : nanometers LC layer and spacer thickness : 3 micrometers Backplane contact area : 100µm x100µm Backplane and CE thickness : 0.8mm Chip size : 2cm x 1.5cm Because it involves only a few steps, LC assembly seems relatively simple, yet many work very hard to get a robust, yield-effective LC technology. Many parameters control the properties of the thin layers and this makes LCs the subject of a branch of science on its own. The backplane steers the (average) orientation of the LC molecules and thus controls the amount to which the waves are affected. How the light waves are affected, depends on the type of LC layer they travel trough. The electro-optical effect is usually one out of the following list: polarization rotation effect, scattering effect or diffraction effect. CH1 - 40 Backplane connections Seal Spacers LC Counter electrode glass Cross-section Silicon chip Cross-section Align layer CE connection Figure 1-11: a first glance at an lcos micro-display The control electronics (figure 1-5) need to make electrical contacts with both the counter-electrode (CE) and the backplane. Room for this is provided with the overhanging areas of both the CE and backplane. Finally note that for mechanical robustness, it is absolutely necessary to mount this assembly onto a much more solid carrier and to provide an easy and reliable way to establish reliable connections. Figures 2-4 to -13 provide pictures of implementations – chapter two as a whole is about lcos technology. So, this is where my introduction to “Display World” ends and where the real presentation starts.
Chapter 2: Constraints from lcos technology CH2 - 41 Chapter 2: Constraints from lcos technology What constraints must be dealt with for the design of a micro-display backplane? This chapter describes the technological boundary conditions to live with; it is a collection of crucial background information. The topics cover panel assembly and IC processing technology. A first section “a designer’s perspective” summarizes the lcos product chain. The second section “lcos cell assembly technology highlights” discusses the constraints from cell assembly technology. The third section discusses constraints directly related to the Si processing itself. Stitching takes a particular place with the processing of very large dies. 2.1 An IC designer's perspective 2.1.1 A system flow and global constraints A simple organigram partitions an lcos system into three separate sub-systems (figure 2-1). The optical and electronic subsystems strongly relate to one another. The mechanical sub-system serves the purpose of providing mechanical robustness, along with a marketing ‘body’. It is not of primary concern here. Lcos panels actually form a bridge between the first two subsystems. The optimization of the optical sub-system is not treated in this thesis; rather a portion of the electronic sub-system is focused on. It is however impossible to consider the design of an lcos backplane chip without considering the relationships to the other components (in casu: the interface electronics and the optical engine architecture). This also reflects in the impact some global constraints have on both sub-systems. • general performance specifications (pixel count, frame rate, power…) • optical engine architecture (color architecture, component size…) • LC effect (pixel architecture, IC voltage requirements…) Electronic sub-system: “micro-display module” LCOS system: “LCOS RPTV, LCOS FP…” Optical sub-system: “optical engine” Mechanical sub-system: “the apparatus” Figure 2-1 : a simple organigram of a LCOS system CH2 - 41
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Design of LCOS Microdisplay Backplanes for Projection Applications

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