MCP23017 - Microchip

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MCP23017/MCP23S17 NOTES: DS21952B-page 42 © 2007 Microchip Technology Inc.
APPENDIX A: REVISION HISTORY Revision B (February 2007) 1. Changed Byte and Sequential Read in Figure 1-1 from “R” to “W”. 2. Table 2-4, Param No. 51 and 53: Changed from 450 to 600 and 500 to 600, respecively. 3. Added disclaimers to package outline drawings. 4. Updated package outline drawings. Revision A (June 2005) • Original Release of this Document. MCP23017/MCP23S17 © 2007 Microchip Technology Inc. DS21952B-page 39
Page 1 and 2: Features • 16-bit remote bidirect
Page 3 and 4: 1.0 DEVICE OVERVIEW The MCP23017/MC
Page 5 and 6: 1.2 Power-on Reset (POR) The on-chi
Page 7 and 8: FIGURE 1-1: MCP23017 I 2 C DEVICE P
Page 9 and 10: 1.5 GPIO Port The GPIO module is a
Page 11 and 12: TABLE 1-6: CONTROL REGISTER SUMMARY
Page 13 and 14: 1.6.2 INPUT POLARITY REGISTER This
Page 15 and 16: 1.6.4 DEFAULT COMPARE REGISTER FOR
Page 17 and 18: 1.6.6 CONFIGURATION REGISTER The IO
Page 19 and 20: 1.6.7 PULL-UP RESISTOR CONFIGURATIO
Page 21 and 22: 1.6.9 INTERRUPT CAPTURE REGISTER Th
Page 23 and 24: 1.6.11 OUTPUT LATCH REGISTER (OLAT)
Page 25 and 26: 1.7.5 INTERRUPT CONDITIONS There ar
Page 27 and 28: 2.0 ELECTRICAL CHARACTERISTICS Abso
Page 29 and 30: MCP23017/MCP23S17 FIGURE 2-1: LOAD
Page 31 and 32: MCP23017/MCP23S17 TABLE 2-2: I 2 C
Page 33 and 34: FIGURE 2-6: SPI OUTPUT TIMING CS SC
Page 35 and 36: TABLE 2-4: GP AND INT PINS AC Chara
Page 37 and 38: 3.0 PACKAGING INFORMATION 3.1 Packa
Page 39 and 40: MCP23017/MCP23S17 28-Lead Plastic Q
Page 41: 28-Lead Plastic Shrink Small Outlin
Page 45 and 46: PRODUCT IDENTIFICATION SYSTEM MCP23
Page 47 and 48: Note the following details of the c

MCP23017 - Microchip

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