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Tests with the FE-I3 chip<br />
Bump bonded at IZM in 2006<br />
Mounted in Bonn<br />
Leakage currents<br />
before irradiation<br />
~325 pA/<strong>pixel</strong><br />
Noise vs<br />
Bias voltage<br />
Tests by E. Bolle, O. Rohne (Oslo) help from M. Garcia-Sciveres and K. Einweiler (LBL)
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