3D pixel detector

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Outline • Progress at the fabrication facilities • Lab characterization • Measurements w/ATLAS FE-I3 • Test beam program • Outlook
The 3DSi ATLAS Upgrade R&D Project Development, Testing and Industrialization of Full-3D Active-Edge and Modified-3D Silicon Radiation Pixel Sensors with Extreme Radiation Hardness Results, Plans. Proponents: C. Da Viá, S. Parker, G. Darbo Status: APPROVED Topics and goals of the R&D proposal: The primary goal is the development, fabrication, characterization, and testing, with and without the front-end readout chip, of Full-3D– activeedge and Mod-3D silicon pixel sensors of extreme radiation hardness and high speed for the the Super-LHC ATLAS upgrade and, possibly, the ATLAS B-layer replacement. A secondary goal is to start design work for a reduced material B-layer detector module using these sensors. FP420 is used as a test bench for the technology Participating ATLAS Institutions: 10 Bonn University, Freiburg University, University of Genova, Glasgow University, the University of Hawaii, Lawrence Berkeley National Laboratory, Manchester University, the University of New Mexico, Oslo University and the Czech Technical University. Fabrication Facilities: 4 CNM/Valencia, IceMOS/Belfast, IRST/Trento and SINTEF/Oslo. At present C. Kenney (Molecular Biology Consortium) and Jasmine Hasi (Manchester University), working at the Stanford Nanofabrication Facility, made all of the Full-3D sensors. For this project industrial companies will join the above mentioned institutions to study the feasibility of a large volume production in time for the upgrade.
Page 1: ATLAS 3DSi Sensors Project Status R
Page 5 and 6: Fabrication facilities: Overview Fu
Page 7 and 8: FBK-IRST (Trento, Italy) FIRST BATC
Page 9 and 10: SINTEF/Stanford (3DC Hawaii, Manche
Page 11 and 12: 3DSi basics - Radiation hardness
Page 13 and 14: Radiation Hardness tests with neutr
Page 15 and 16: Estimated S/N at 3.5x10 15 n/cm 2 a
Page 17 and 18: Data analysis By M. Mathes/Bonn Tes
Page 19 and 20: Test beam 2007 • Infrastructure f
Page 21 and 22: Active edge (Kenney 97) • DRIE tr
Page 23 and 24: Back-up slides

3D pixel detector

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