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3D pixel detector

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Conclusions and 2008 Plans<br />

<strong>3D</strong>Si project formed and approved as ATLAS upgrade project<br />

Tests with <strong>3D</strong>+FE-I3 chip completed and promising:<br />

S/N estimated before and after irradiation<br />

Time walk under control with moderate extra power<br />

Radiation Hardness proven with neutrons and IR laser source:<br />

IRRADIATED <strong>3D</strong>-<strong>pixel</strong> assembly (1x10 15 p/cm 2 ) under bias tested at RT in the beam<br />

WORKED! More tests after bonding mystery solved…<br />

ACTIVE EDGE PROCESSING : standard in Stanford and SINTEF, will be implemented<br />

at CNM, IceMOS, IRST<br />

ALL COMMERCIAL PARTNERS COMPLETED FIRST BATCH<br />

CNM / Barcellona-Valencia<br />

IceMos/Glasgow<br />

IRST/Trento<br />

SINTEF/Stanford<br />

First common test beam completed in October 2007 – data being analysed<br />

PLANS:<br />

Test beam period requested for 1 week in June and 1 in November 2008<br />

Irradiations and tests will be performed at CERN (common lab-space) and Institutes<br />

OVERALL PROGRESS ENCOURAGING!!!

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