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Topologically Defined Neuronal Networks Controlled by Silicon Chips

Topologically Defined Neuronal Networks Controlled by Silicon Chips

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CHAPTER 2. NETWORKS OF DEFINED TOPOGRAPHY<br />

Substrate adsorbed material (SAM): This method is based on the adhesive properties of the trophic<br />

factors that adhere very well to poly-L-lysine coated substrates, forming a robust layer of growthpromoting<br />

proteins [79, 124]. Lymnaea brains are incubated directly in the culture chamber at 2brains/ml<br />

medium for 72h. Before plating the neurons, the brains are removed and the supernatant is either diluted<br />

1:1 or completely replaced <strong>by</strong> defined medium. The growth factors attached to the bottom of the<br />

chamber are sufficient to promote vigorous neurite outgrowth.<br />

Layers of SAM are also used to grow topologically defined networks with a technique described in<br />

2.3.1. However, SAM is incompatible with extracellular recording <strong>by</strong> transistors. The adsorbed proteins<br />

form a cushion on the chip surface, there<strong>by</strong> increasing the distance between transistor and neuron,<br />

obstructing a successful neuron-silicon coupling.<br />

Co-culture: The drawbacks of the aforementioned methods can be avoided if neurons and brains are<br />

cultured together, with the ganglionic rings added after the neurons are plated. This allows the neurons<br />

to adhere tightly to the uncovered sticky poly-L-lysine coated surface of the substrate, while the growth<br />

factors are delivered directly to the medium without any loss. As no proteins are present at the time<br />

neurons are placed and secretion starts only after brains are added to the medium, neuronal outgrowth<br />

is delayed for about one day compared to the other methods. The overall success of the co-culture is<br />

not affected <strong>by</strong> this.<br />

2.2.3 Cleaning of substrates<br />

Before neurons were plated, the substrates had to be cleaned, sterilized and coated with poly-L-lysine.<br />

The two latter steps, being rather simple, are described in appendix A, whereas cleaning is discussed<br />

here since it turned out to be problematic. It must be aggressive enough to reliably remove tissue and<br />

debris from previous cell cultures, yet mild enough so as not to affect the substrates. As substrates became<br />

more sophisticated, the demands on the cleaning procedure increased as revealed <strong>by</strong> the following<br />

list:<br />

Glass coverslips: Round cover glasses (diameter 30mm, thickness 1, Assistent) were treated with<br />

acidic and alkaline detergent in an ultrasonic cleaner at 80 ◦ C according to a procedure adapted from<br />

[34] (for details see appendix A). The coverslips were only used once.<br />

Substrates with topographic structures: Topographic structures consist of polyimide or SU-8 polyester<br />

photoresist processed onto glass coverslips and oxidized silicon wafers, see subsection 2.3.2. Due<br />

to internal stress and a different thermal expansion coefficient than the underlying substrate, the resist<br />

layers peel off upon prolonged sonication and temperature shocks. To meet these new requirements,<br />

the previously described procedure was modified. While the time the substrates were immersed in the<br />

detergents was not altered, the temperature was reduced to 50 ◦ C and the overall sonication time was<br />

limited to 5min. Preheated water was used for rinsing to avoid thermal shock. The method allowed<br />

substrates to be recycled five times before the resist began to peel off, but was efficient enough to reliably<br />

remove tissue and dirt in the pits and grooves of the topographic structures.<br />

Transistor chips: Transistor chips are rather complex devices with many different materials (SiO2,<br />

polyester resist, silicone adhesive and PMMA) exposed to the cell culture and thus to subsequent cleaning.<br />

For a detailed description of the chips refer to subsection 3.3.2 and fig. 3.6.<br />

Without the topographic structures, removal of tissue and debris would be easy; mild detergent and<br />

Q-tips for a slight scrubbing are sufficient for conventional chips [49]. However, feature sizes down<br />

to 14µm render the mechanical cleaning of the chips here difficult. There are no brushes with bristles<br />

that fit in the narrow grooves. Methods solely based on chemical treatment are problematic though,<br />

because they either are too aggressive to the device or the results are not satisfactory, with impurities<br />

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