Chapter 5.16 - Tystar16 Non-MOS Poly-Silicon ... - Berkeley Microlab

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TYSTAR 16
Non-MOS Poly-Silicon LPCVD Furnace
(tystar16)
1.0 Title
TYSTAR 16 Non-MOS Poly-Silicon LPCVD Furnace
2.0 Purpose
Tystar16 is used to deposit poly-crystalline silicon film, doped with phosphorus or un-doped. It can
process both 4” and 6” wafers. It can also be used to deposit undoped amorphous silicon film.
3.0 Scope
This chapter covers the general furnace description of TYSTAR 16, TYCOM and furnace operation
procedure, which includes process recipe loading, wafer loading/unloading, process status monitor,
labmember level problem diagnosis, and wafer cleaning requirements.
4.0 Applicable Documents
Revision History
4.1 TYTAN Diffusion Furnace System Instruction Manual (copy in Office).
4.2 TYCOM 9900 Microprocessor Control System Instruction Manual (copy in Office)
4.3 Material Safety Data Sheets for Silane (SiH4), Phosphine (PH3), and Nitrogen (N2) (copy in
Lobby).
5.0 Definitions & Process Terminology
5.1 Non-MOS Furnace: The wafers processed in this kind of furnaces may contain materials (thin
film, dopant, or contaminant) that are not compatible with the MOS processes. If CMOS devices
are processed in a Non-MOS furnace, the electric performance of the devices may be changed.
Wafers with metal films can be processed in Non-MOS furnaces only with Microlab manager’s
permission.
5.2 LPCVD: Low Pressure Chemical Vapor Deposition. The film deposition process is controlled by
the migration and reaction of the process gas on the wafer surfaces at low pressure, usually at
hundreds of milli-torr pressure. This method generates good film property and uniformity.
5.3 Poly-Silicon: The film consists of silicon grains with different crystal orientation.
5.4 Amorphous-Silicon: The film contains random silicon atoms without crystal orientation.
6.0 Safety
Follow general safety guidelines in the lab as well as the specific safety rules as per follow:
6.1 Electric Shock Hazard: TYSTAR furnaces utilize high electric power (high amperages) to
generate heat. Do not open the side panels or touch the high power electrical parts in the
furnace cabinet.
6.2 Chemical Hazard: Silane and Phosphine gases used in the deposition process are flammable
and/or toxic. Proper purge procedure should be followed if the process is aborted due to
equipment failure or human mistake, when the process gases are flowing.

tystar16 Chapter 5.16
6.3 Burn Hazard. Cantilevers, boats, and wafers coming out of the furnace are very hot. Wear face
shield when loading/unloading wafers. Proceed with caution. Avoid touching of any furnace
quartz ware to prevent burning of your hands and contamination of the furnace. No flammable
chemical, especially organic solvents should be in the load station when the tube is open.
6.4 All new recipes must be checked by the process staff, before they can be used on any TYSTAR
furnaces. Customized recipes should be stored on the labmember’s diskette, not the standard
diskettes.
7.0 Statistical/Process Data
7.1 Microlab web page.
7.2 Problem and comment section under equipment section of the wand.
7.3 Enable message for individual TYSTAR furnace.
8.0 Available Process, Gases, Process Notes
8.1 Wafer cleaning requirements before loading into TYSTAR furnaces
8.1.1 Photo-resist on the wafer surface must be stripped first in PRS3000 bath of Sink5,
Technics-c, or Matrix, and then cleaned in Sink8 piranha bath. New wafers can skip this
step.
8.1.2 All wafers then cleaned in Sink6 piranha bath. Wafers just unloaded from an MOS
furnace can be loaded into another furnace without further cleaning. Wafers just
unloaded from a Non-MOS furnace can be loaded into another Non-MOS furnace too.
8.1.3 Transfer clean wafers into a blue wafer transfer box. Do not take the TEFLON cassette
with wafers to the furnace directly to prevent contamination of the cassette.
Available Processes
8.2 Phosphorus doped poly-silicon LPCVD.
8.3 Low phosphorus doped poly-silicon LPCVD for stress adjustment.
8.4 Un-doped poly-silicon LPCVD.
8.5 Un-doped amorphous silicon LPCCD.
Available Gases
8.6 Nitrogen (N2): Used to purge out room air after wafer loading and process gases after deposition.
It is also used to vent the tube up to the atmosphere pressure, and process pressure control.
8.7 Silane (SiH4): Source of the silicon in the film.
8.8 Phosphine (PH3): Used for phosphorus doping. The phosphine gas used in the Microlab is a 50%
SiH4/ 50%PH3 mixture, for all the furnaces. There are two MFC’s installed in TYSTAR16: PH3HI
(0 – 10 sccm), PH3LO (0 - 3 sccm).
Process Notes
8.9 TYSTAR16 is a non-MOS furnace that is mainly used for MEMS devices. The electric property of
the silicon film deposited may be compromised by the contaminants form previous runs. If you
are making MOS devices, you should use TYSTAR 10 instead.
8.10 All the standard poly-silicon processes run at 615ºC, and the standby at 550ºC. The maximum
operating temperature is 650ºC and the minimum is 450ºC.
8.11 To process glass wafers, you should wait the furnace to cool down below 550ºC after you load
the appropriate recipe. It allows the furnace to cool down uniformly.
8.12 Do not leave the furnace door open for over 30 minutes. It will generate a large temperature
gradient that may crack the quartz tube. If you need more time, e.g. you drop a wafer and need to
get another one, you should close the door manually, then abort the recipe. When you are ready
again, re-start the recipe again.
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tystar16 Chapter 5.16
Processing Glass/pyrex Substrate in Tystar16 Furnace (below 550ºC)
Undoped amorphous poly can be deposited on borofloat glass/Pyrex substrates in Tystar16 in a
designate boat. The Loading temperature is often set at the same temperature as deposition
temperature at or below 550ºC, which is below melting temperature of the borofloat glass. Do not
exceed process temperatures of 550ºC, and use the dedicated borofloat glass boat at the station to
process your glass/pyrex wafers. Replace one of the boats in the tube with the designated borofloat
boat for your process.
16FUPLYA recipe can be used at typical deposition temperature of about 525ºC to deposit the
amorphous poly film. This can produce 700 - 1300 Å/hr of amorphous poly film (according to previous
labmember reports). Please, refer to MOD 31 in Chapter 1.3 of the lab manual for more detailed
information on Pyrex/borofloat glass cleaning/processing in the VLSI area of the Microlab.
9.0 Overall Furnace Operation
9.1 General TYSTAR Furnace Information
The TYSTAR Furnace consists of three basic modules: Load Station Module, Furnace Module,
and Source Cabinet Module. Microlab labmembers have access to the Load Station Module in
the clean room area. The other two are in the Tylan service chase. Only Microlab staff with proper
training have access to these two modules due to potential hazards.
The Load Station Module houses a laminar flow unit with HEPA filter for clean air distribution. A
Boat Loader Unit opens/closes the furnace door and pulls-out/pushes-in the cantilevers with
wafer boats sitting on top. The operation can be automatically controlled by a process recipe, or
manually using the ROP (see Section 9.3).
The Furnace Module consists of a quartz process tube, thermal couples, and heating elements. It
is divided into three zones: Load, Center, and Source. The temperature is controlled through a
PID electronic board (DTC). All the control parameters can be set in the process recipe. The
volume of the quartz tube is approximately 45 liters. The process gas flows into the tube from the
Source end and vented through the holes on the Load end.
The Source Cabinet Module contains several Mass Flow Controllers (MFC) that regulate the
process gas flows. An electronic gas control system MFS 460 coordinates all the MFC and
interlocks for safe operation.
9.2 TYCOM Terminal
The TYCOM Terminal controls/monitors all the TYSTAR Furnace operations. It consists of a CPU
with two floppy disk drives, a CRT monitor and a keyboard. Disk drive #2, on the right side, is
used for viewing and loading of recipes. The auxiliary drive is used for copying diskettes. The
standard recipes for an individual furnace are stored on a floppy diskette labeled with the furnace
name, e.g. TYSTAR1. The floppy disk used has a special format. Please ask staff if you need one
to store your customized recipes.
9.2.1 TYCOM Commands
TYCOM CPU only recognizes CAPITAL letters only. You can use the numerical key pad
on the right hand side of the keyboard to enter numbers. However, do not use the [Enter]
key on the numerical key pad. It will cause error when loading a recipe.
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tystar16 Chapter 5.16
DI DI
Commands Function Example
DI RE recipe name
Displays the recipe directory of the
diskette in Drive #2
Displays the content of a recipe on the
diskette in Drive #2
DI RE 16SDPLYA
LO recipe name # Load a recipe to a TYSTAR furnace LO 16SUPLYA 16
DI ST #
DI DE #
DI AL #
Displays current status of a TYSTAR
furnace (see Section 9.2.2 below)
Displays the system configuration of a
TYSTAR furnace
Displays previous process alarms of a
TYSTAR furnace
DI ST 16
DI DE 16
DI AL 16
9.2.2 Display Furnace Status
When you use DI ST commands, the CRT monitor displays the status of the TYSTAR
furnace. This information is very important, especially for equipment problem diagnosis.
The following example is used to explain the information labmembers should know. The
furnace status to be displayed is TYSTAR16 with recipe 16STNBYA loaded but not
running (Idle state).
07/05/02 16:30:32
*=DISABLED
TUBE STATUS PROCID ET STEP TIME-TO-
GO
STEP ET
016 READY 16STNBYA 00:00:00 0000 00:00:00 00:00:00
OUTPUTS RELAYOUT RELAYIN INPUTS
N2VAC = 0.0 N2VAC = OFF DNTLK = OFF TEMPL = H 752.3 0880
N2BKFL = 250.0 N2BKFL = ON ANTLK = OFF TEMPC = G 751.0 0726
SIH4 = .0 SIH4 = OFF BNTLK = OFF TEMPS = L 747.2 0744
PH3HI = .0 PH3HI = OFF VNTLK = OFF CALIBL = 752.1
PH3LO = .0 PH3LO = OFF GNTLK = OFF CALIBC = 750.9
PRCPR = .0 PRCPR = OFF CCIN6 = ON CALIBS = 747.3
SPEED = .0 VACUUM = ON BPOUT = OFF
ANAO8 = .0 CCOUT8 = OFF N2PRSAL = OFF
TEMPL = 600.0 PREPH3 = OFF N2VAC = G 249.9
TEMPC = 600.0 PRESPA = OFF N2BKFL = G 0.0
TEMPS = 600.0 CCOUT11
=
OFF SIH4 = G 0.2
CCOUT12
=
OFF PH3HI = G 0.0
CCOUT13 OFF PH3LO = G 0.0
=
DTCENA = ON PRCPR = G 246.3
LOAD = OFF
UNLOAD = OFF
The following sections explain the above display in details.
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tystar16 Chapter 5.16
9.2.2.1 Display Header (first 4 rows)
The first row shows the current Data and Time stored in TYCOM CPU. The
second row indicates that any INPUT or OUTPUT followed by an * on the display
is disabled. None of the INPUT and OUTPUT of TYSTAR 1-4 is disabled.
On the third and fourth lines:
TUBE - - - - - - - - - - TYSTAR furnace #.
STATUS - - - - - - - - READY (idle, recipe loaded but not running)
RUN (recipe running)
HOLD (recipe hold at certain step)
STNBY (no recipe loaded, indicate power
failure)
PROCID - - - - - - - - Recipe ID, stated in the first line of the recipe, usually the
same as the recipe file name.
ET - - - - - - - - - - - - Total time elapsed since the process starts.
STEP - - - - - - - - - - Current recipe step.
TIME-TO-GO - - - - -Time left to run in the current step.
STEP ET - - - - - - - -Time elapsed in the current step.
9.2.2.2 OUTPUTS – Process parameter settings sent from TYCOM CPU to a TYSTAR
furnace.
N2VAC, N2BKFL, SIH4, etc - - - - Process gas flow settings
SPEED - - - - - - - - - - - - - - - - - - - Boat pull-out/push-in speed settings.
TEMPL, TEMPC, TEMPS - - - - - - Temperature settings for Load, Center, and
Source Zone
ANAO8 - - - - - - - - - - - - - - - - - - - -Available for future use.
9.2.2.3 RELAYOUT – Commands sent from TYCOM to al TYSTAR furnace to turn on/off
Contact Closure Switches.
N2VAC, N2BKFL, SIH4, etc - - - Turn on/off the NUPRO valves of individual
process gas. If off, no process gas flows
regardless what the flow setting is.
PRCPR - - - - - - - - - - - - - - - - - - Turns on/off the process pressure control.
PRCPR and N2VAC can not be turned on at
the same time. When PRCPR is turned on,
N2VAC becomes a slavery for the pressure
control.
VACUUM - - - - - - - - - - - - - - - - Open/close the gate-valve between the
process tube and the vacuum pump.
PREPH3 - - - - - - - - - - - - - - - - - An extra safety valve for PH3. It needs to be
ON for either PH3HI or PH3LO to flow.
PRESIH4 - - - - - - - - - - - - - - - - An extra safety valve for SiH4. It needs to be
ON for SiH4to flow.
DTCENA - - - - - - - - - - - - - - - - - Turns on the DTC board for furnace
temperature control. Every recipe must have
DTCENA = ON statement in step 0001.
LOAD/UNLOAD - - - - - - - - - - - - LOAD = ON pulls the boat cantilever out,
UNLOAD=ON pushes it back into the furnace.
LOAD and UNLOAD should not be on the
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tystar16 Chapter 5.16
same time. The boat speed is controlled by
the SPEED under OUTPUT (Section 9.2.2.2).
CCOUT8, 11, 13, PRESPAR- - - Available for future use.
9.2.2.4 RELAYIN – Contact Closure Sensor inputs from a TYSTAR furnace to TYCOM
CPU. When a process is running after the furnace door closes, only
BPIN ( and H2ORDY and TAPERDY for wet oxidation) should be
ON. All other RELAYIN should be OFF.
DNTLK - - - - - - - - - - - - - - - - - Door Interlock. When ON, indicates the furnace
door is not properly closed, and no process gas
will flow.
ANTLK - - - - - - - - - - - - - - - - - - Above Atmosphere Pressure INTERLOCK. It
turns ON when the pressure in the process tube
is above 1 atm. When ON, it shuts off all
process gases, including N2.
BNTLK - - - - - - - - - - - - - - - - - - Blow Process Pressure INTERLOCK. It turns
ON when the pressure in the process tube is
above 2 Torrs, which is the maximum reading
for the pressure manometer. When ON, it shuts
off all process gases, except N2.
VNTLK - - - - - - - - - - - - - - - - - Vacuum System Failure INTERLOCK. It turns
ON when the vacuum pump fails. When ON, it
shuts off all process gases, except N2. Make
sure VNTLK is OFF before running any
LPCVD process.
GNTLK - - - - - - - - - - - - - - - - - - Gate Valve INTERLOCK. It turns ON when the
gate valve, between the process tube and the
vacuum pump, closes. It should stay OFF during
a process run except in the wafer
loading/unload, leak check, and venting steps.
When ON, it shuts off all process gases, except
N2.
CCIN6 - - - - - - - - - - - - - - - - - - Available for future use.
BPOUT - - - - - - - - - - - - - - - - - Boat cantilever at OUT position.
N2PRSAL - - - - - - - - - - - - - - - Low Nitrogen Pressure Alarm. When ON, all
NUPRO valves close (except N2 ) and no
process gas will flow.
9.2.2.5 INPUTS – Actual Temperature and Gas Flow readings from furnace thermal
couples and mass flow controllers.
TEMPL, TEMPC, TEMPS - - - - Actual temperature readings of Load, Center,
and Source zones. A letter (H, G, L) in front of
the temperature reading indicates whether the
temperature is in the tolerance band set in the
recipe. The 4-digits number, follows the
temperature reading, represents electric power
sent to each zone. The maximum power is 4095.
CALIBL, CALIBC, CALIBS - - - Calibrated temperature readings. If these
readings differ from TEMPL, TEMPC, TEMPS
by 2ºC, the process temperature may not
stabilize. Report the problem on the WAND.
N2BKFL, SIH4, PH3HI, PH3LO-Actual process gas flows. A letter (H, G, L) in
front of the flow reading indicates whether the
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tystar16 Chapter 5.16
flow is in the tolerance band set in the recipe. If
no tolerance is set, it is assumed that the
tolerance is infinite, and the letter G appears all
the time.
PRCPR - - - - - - - - - - - - - - - - - -Actual pressure in the process tube. A letter (H,
G, L) in front of the flow reading indicates
whether the flow is in the tolerance band set in
the recipe. If no tolerance is set, it is assumed
that the tolerance is infinite, and the letter G
appears all the time
N2VAC - - - - - - - - - - - - - - - - - - The N2 flow for PRCPR control. N2VAC is
injected into the system between the process
tube and the vacuum pump. It will not dilute the
process gas concentration. However, if the
reading is zero, the PRCPR can not be
controlled anymore.
9.2.3 Display Process Alarms
There is no special abort sequence for the TYSTAR LPCVD Furnace. To make sure that
your process completes without any problem, the labmember should check the process
run history by enter DI AL # command at TYCOM terminal. Due to the limited memory of
the TYCOM CPU, the alarm history clears if the memory is full.
9.2.4 WAND/TYCOM Interface
Some TYCOM commands can be executed through WAND remotely.
9.2.4.1 Under WAND main menu, select E (Equipment Communication). Then press the
space bar to select t (Tylan furnace interface. The TYCOM COMMUNICATION
sub-menu will be displayed.
9.2.4.2 Under the TYCOM COMMUCATION sub-menu, press d (Display Status) to
display TYSTAR furnace status. Same as DI ST # command on TYCOM
terminal.
9.2.4.3 Under the TYCOM COMMUCATION sub-menu, press D (Display Definition
Table) to display TYSTAR furnace configuration. Same as DI DE # command on
TYCOM terminal.
9.2.4.4 Under the TYCOM COMMUCATION sub-menu, press R (Recipes) for some
recipe related commands.
Press c to copy a recipe (must be on the diskette currently in TYCOM CPU disk
drive #2) to the root directory of your Microlab root directory.
Press d to display the directory of the diskette currently in TYCOM CPU disk
drive #2. Same as DI DI command on TYCOM terminal.
Press l to display a recipe content on the diskette currently in TYCOM CPU disk
drive #2. Same as DI RE recipe-name command on the TYCOM terminal.
9.2.5 Other TYCOM Commands
There are several commands such as: RU, HO, CO, AC, and AB that should be executed
at the ROP for safety reasons. Please refer to Section 9.3.6 for the details of these
commands.
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tystar16 Chapter 5.16
9.3 Remote Operating Panel (ROP)
Every TYSTAR furnace has a Remote Operating Panel (ROP) that is located next to its Load
Station Module. The ROP is used to perform all the process operation after recipe loading at
TYCOM terminal. It consists of a schematics, a LED display panel, several LED lights, and
buttons. Their functions are explained in the following sections. See Figures & Schematics for a
schematic of the ROP.
9.3.1 Furnace Schematics – On the left up corner of the ROP. It shows the process gas
plumbing of the furnace.
9.3.2 Furnace Zone LED – Below the schematics. There are three LED for three zones of the
furnace. One flash on the LED means one electric current pulse flows through the
heating element of the furnace zone.
9.3.3 Boat Control – Under the furnace zone LED, there are 6 square buttons for manual boat
in/out control. Use this manual control only when the furnace is idle (the LED Display
Panel reads READY, Section 9.3.5 below). The following sub-sections describe how to
pull-out/push-in furnace door and boat cantilevers.
9.3.3.1 Press [Manual] once if the LED on the button is off.
9.3.3.2 Select the boat speed by pressing either [Fast] or [Slow].
9.3.3.3 Press [In] to push-in the furnace door and boat cantilevers. Press [Out] to pullout.
You need to press the button continuously otherwise the boat stops moving.
9.3.4 Hardware Alarm – To the right of the Boat Control Buttons, there are two Alarm Cause
LED, OT and SCR. Both of them are hardware temperature control alarms. If either one
is on, press the [Alarm Ack] button below them to silence the alarm, then contact staff
immediately. During non-office hours, abort process, then report problem on WAND.
9.3.5 LED Display Panel and Numerical Pad – On the right center of the panel, there is a LED
display panel and a Numerical pad. The LED Display Panel cycles through the following
furnace information when the [7|Status] button on the numerical pad is pressed.
Process Status
READY – Idle status, recipe loaded but not running (holding at step 0001 of the
recipe)
END – Process ends, Alarm sounds. Press [Alarm Ack] to silence the alarm and
return to READY status.
STNBY- standby status, recipe lost due to power failure or furnace computer reset.
A recipe needs be loaded, otherwise the furnace cools down with all gases shut off.
Recipe Name: The Process ID that appears on the first line of the recipe. Usually the
same as the recipe file name.
STEP: The current step number of the running recipe.
Time: Time to go in current process step (HH:MM:SS)
Temperature: Average temperature of the three furnace zones.
Do not press other numeric buttons which are designed for the industrial manufacturing
use. If press by mistake, the LED display panel may not function properly. Press [Clear],
then [7/Status] button to clear this problem.
9.3.6 Process Operation Buttons – There are four buttons, on the right side of the ROP, for
process control. Their function and corresponding TYCOM commands are listed in the
following table.
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tystar16 Chapter 5.16
ROP button TYCOM command Function
[Recipe|Run] RU # Run the loaded recipe
[Hold|Clock] HO # Hold the process at current recipe step
[Alarm|Ack] AC #
Silence the process end alarm, returns the furnace to READY
Skip to next process step (works only IF ALMACK=ON GOTO
#### is in the current process step)
[Abort] AB # Abort the current process, the furnace skip to END state
9.4 Available Recipes
9.4.1 16SDPLYA: Standard phosphorus doped poly-silicon recipe.
9.4.2 16SUPLYA: Standard un-doped poly-silicon recipe.
9.4.3 16VDPLYA: Variable phosphorus doped poly-silicon recipe. Labmember needs to
specify the phosphine flow (0-10sccm).
9.4.4 16VTPLYA: All the process parameters (temperature, pressure, and gas flows) are
variable.
9.4.5 16SUASIA: Standard un-doped amorphous silicon recipe. Deposition temperature is
500 °C
9.4.6 16VTASIA: Variable temperature amorphous un-doped silicon recipe.
9.5 Processing a run (Loading recipe and wafers)
Venting The Process Tube to Atmosphere Pressure
9.5.1 Under normal condition, TYSTAR 16 should be running the standby recipe when not
being used. Check that all the interlocks are off.
9.5.2 Press [Alarm Ack] twice within 5 seconds. The venting process starts and the N2BKFL
ramps up to 5000 sccm. If the N2BKFL does not ramp up, report on WAND. Do not use
the furnace.
9.5.3 Wait 12 minutes. The tube finishes the venting process and the recipe ends. The alarm
will sound and the ROP displays END. Press [Alarm Ack] to silence the alarm and return
the ROP status to READY.
Loading a Recipe
9.5.4 Enable TYSTAR 16 on the WAND.
9.5.5 Insert the recipe diskette labeled TYSTAR 16 into floppy drive #2, right hand side of
TYCOM CPU.
9.5.6 If you are not sure of the recipe name, enter DI DI at TYCOM Terminal to display the
recipe directory.
9.5.7 Enter LO recipe-name #, then press the [enter] key.
9.5.8 Enter the process parameters when prompted. You can use the numeric key pad on the
keyboard. Do not use the [enter] key on the right end of the numeric keypad. TYCOM
does not recognize that key, and will not load the recipe.
9.5.9 TYCOM Terminal displays RECIPE LOADED SUCCESSFULLY if there no error in the
recipe and parameter entries.
(Do not use TYCOM command RU # to start the process, because someone may be
loading/unloading wafers on another furnace of the same bank. Besides, it is
recommended that you check the ROP to make sure the recipe is loaded into the
furnace.)
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tystar16 Chapter 5.16
Load wafers and run a process recipe
9.5.10 Go to the front of the load station module of the TYSTAR furnace. Press [7|Status] button
on the ROP to make sure the furnace is at READY state and the recipe name is correct.
9.5.11 Put on the face shield. Then press [Recipe|Run] button. The furnace door will open and
the wafer boats come out. The door will close automatically after 20 minutes. If the boats
start moving in and you need more time loading wafers, press [Alarm Ack] button on the
ROP before the door closes, the boats will move out again and you have another 20
minutes.
9.5.12 Open the cover of the closed boat with the special fork located on the clear side panel on
the end of the furnace. Wait a few minutes for the dummy wafers to cool. Use the non-
MOS vacuum wand to unload the same number of dummy wafers that you are going to
replace with your process wafers. Do not use the slots on both ends of the boat.
9.5.13 Load the your process wafers using the non-MOS vacuum wand. All the wafers should
be loaded with flat up for better wafer support and consistent run-to-run results.
9.5.14 Do not wear poly gloves over clean room gloves when loading/unloading wafers. The
poly gloves usually are too big and slippery. The tips of the poly glove may melt on the
hot quartz ware and cause contamination, which is hard to notice, because it is colorless
and transparent. The poly gloves should be used at sinks and other room temperature
operations only.
9.5.15 After loading wafers and put the boat cover back, press [Alarm Ack] button on the ROP.
The boat will start moving into the furnace. If you want to add/remove or reposition wafers
before the door closes, press [Alarm Ack] once, the boat will move out again.
9.5.16 After the door closes completely, check the status of the furnace on the TYCOM
Terminal. If all interlocks are OFF, the process will continue automatically. You can also
monitor the status of the process run remotely (Section 9.2.4).
9.5.17 If the DNTLK keeps ON, the process will abort after a few minutes. Press [Alarm Ack]
button to silence the alarm. Check that the track and cable of the boat loader is cleared of
any obstacle. Press [Recipe|Run] button again. If problem continues, report on WAND for
boat loader problem.
During A Process Run
9.5.18 After the door closes, the recipe starts a multi-step pump/purge sequence. You can not
[Alarm Ack] through these steps. If you want to stop the process, press [ABORT], then
[Alarm Ack]. Load and run 16VENT recipe. Open the door manually (Section 9.3.3) to
unload your wafers.
9.5.19 After the pump/purge sequence, the recipe check the leak rate of the tube. If the tube
fails the leak check (50 mTorr/min), the process will go to vent steps. Afterwards, the
process ends and an alarm sounds.
9.5.20 After passing the leak check, the recipe starts temperature ramping and stabilization. If
the temperature does not stabilize after one hour, you can either press [Alarm Ack] to go
to the deposition steps, or abort the recipe (refer to Section 9.5.19 above).
9.5.21 After temperature stabilization, the tube will be pumped down before the process gases
flow. Deposition starts after process gas flow and pressure stabilization.
9.5.22 During the deposition, the TYCOM computer checks the temperature, gas flows, and
pressure all the time. If the process goes successfully, the process forwards to the
pump/purge steps (3 times). After that it holds at standby waiting for venting to
atmosphere pressure.
9.5.23 If one of the process parameter exceeds the tolerance set in the recipe, the deposition
stops and the process goes to the pump and purge steps with the temperature holding at
same deposition step. In this case, you can find a process staff to find out and/or correct
the problem, then resume the process. Or you can vent the tube to atmosphere pressure
and exam your wafers.
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tystar16 Chapter 5.16
Venting to atmosphere pressure to unload wafers
9.5.24 Press [Alarm Ack] twice. The tube starts venting. After 12 minutes, the process reaches
the last step, and the ROP displays END and the alarm beeps. Press [Alarm Ack] button
to silence the alarm and reset the furnace to READY state.
9.5.25 To unload your wafers, press [Recipe|Run] button again, and the boats will move out.
When the boats stop moving, wait a few minutes for wafers to cool down. Then use the
appropriate fork and vacuum wand to open the boat and unload your wafers to the quartz
boat on the cooling rack next to the furnace. The wafers may still be too hot for the plastic
wafer box. Replace the dummy wafers and the boat cover.
9.5.26 Press [Alarm Ack] button to move in the boats. After the door closes completely, press
[Abort] button, then [Alarm Ack], and the furnace returns to READY state. If you press
[Abort] before the door closes, the boats will stop moving and the door left open. Follow
Section 9.3.3 to close the door manually.
9.5.27 Load and run the stanby recipe from the TYCOM. Disable the TYSTAR furnace on the
WAND. Unload wafers from the cooling rack into wafer a box. You can leave when all the
interlocks turns off.
Special Instructions for Amorphous Silicon Deposition
9.5.28 Due to the low deposition rate of amorphous silicon process, it is advised that you
replace a close boat with an open boat. Use the special fork to remove the close boat
and place it on the assigned boat rack. Be very careful because the boat with the dummy
wafers are heavy and hot. Use another fork to place the open boat onto the same
location of the closed boat.
9.5.29 Follow the same wafer loading/unloading procedures for the closed boat (Sections 9.5.10
– 9.5.22). Note that the spacing between your process wafers will affect the deposition
rate and uniformity.
9.5.30 After your process finishes, replace the open boat with the close boat. Make sure the
close boat is sit exactly at the original location on the cantilevers.
10.0 Troubleshooting Guidelines
10.1 VNTLK is ON.
10.1.1 The pump has problem. Do not use the furnace. Report on WAND.
10.2 Door will not open/Boat loader stuck
10.2.1 Make sure that the tube have been properly vented. Check that the N2BKFL flows at
5000 sccm in the last step of recipe. If not sure, abort the recipe and run 16VENT to vent
the tube.
10.2.2 Make sure there is nothing obstruct the movement of the boat loader.
10.2.3 Make sure the cable that pulls the boat loader is not loose. If so, ask staff to adjust the
tension of the cable.
10.2.4 Try to move the boat loader manually. (Section 9.3.3)
10.2.5 If the boat loader stuck on the track, give it a little pull/push help it overcome some
friction. Do not use excessive force.
10.2.6 If all the above step fail, report problem on WAND.
10.3 DNTLK is ON after the door closes and the recipe ends afterwards.
10.3.1 Make sure that there is nothing on the door track that hinder its movement.
10.3.2 Run the recipe again. If the problem repeats, the DNTLK sensor may not working. Report
on WAND.
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10.4 GNTLK is ON for 5 minutes after the door closes, and the recipe forward to venting step
then ends.
10.4.1 Run the recipe again after it ends. If the problem repeats, report on WAND. The gate
valve may have problem.
10.5 The recipe failed leak check.
10.5.1 Wait for the tube to finished venting.
10.5.2 Run the recipe again. After the door opens, check the O-ring on the door flange. Wipe
with clean room paper towel if necessary. Close the door by press [Alarm Ack].
10.5.3 If the problem repeats, report on WAND.
10.6 The process parameter exceeds tolerance during deposition step.
(The temperature is kept the same as the deposition step when the recipe is at post deposition
standby)
10.6.1 On TYCOM, enter DI AL 16 at command prompt. Look for the statement IF xxxx not EQ
statement, where xxxx is a process parameter.
10.6.2 Find a process staff to check the furnace. The process may be restarted again if the
source of the problem can be corrected.
10.7 N2PRSAL is ON – Nitrogen pressure
Do not attempt to run any process. Wait until the liquid nitrogen tank is refilled.
10.8 OT/SCR alarm is ON
The furnace electronic board can not control the temperature. Silence the alarm. Find Staff
immediately. During off hours, abort process and report problem on WAND.
10.9 TYCOM Terminal is blank
10.9.1 Press [Enter] key. The terminal may be at sleep mode.
10.9.2 Turn the terminal off, then on. This will reset the terminal. Adjust brightness/contrast if
needed.
10.9.3 If both of the above step do not work, the TYCOM CPU needs reset (Section 10.2).
10.10 Reset TYCOM Terminal
10.10.1 Slide the TYCOM CPU out slowly.
10.10.2 On the backside (up left corner facing the CPU), there is a black square power switch.
Toggle the switch off then on.
10.10.3 Check all the wires connected to the backside of the CPU are secured. Slide back the
CPU slowly.
10.10.4 On TYCOM terminal, Enter ACT PR, then [Enter].
10.10.5 Enter IN DA dd/mm/yy; enter IN TI hh:mm:ss to set the date/time.
10.11 I/O Error
10.11.1 There is a communication problem between the TYCOM CPU and the furnaces. Report
problem on WAND.
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11.0 Figures & Schematics
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