LINK ADAPTOR

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IMS C012 6.4 Power rating Internal power dissipation (P INT ) of transputer and peripheral chips depends on VDD, as shown in figure 6.6. P INT is substantially independent of temperature. 200 Power P INT (mW) 150 100 50 4.4 4.6 4.8 5.0 5.2 5.4 5.6 VDD (Volts) Figure 6.6 IMS C012 internal power dissipation vs VDD Total power dissipation (P D ) of the chip is P D = P INT + P IO where P IO is the power dissipation in the input and output pins; this is application dependent. Internal working temperature T J of the chip is T J = T A + q JA * P D where T A is the external ambient temperature in o C and q JA is the junction-to-ambient thermal resistance in o C/W. Further information about device thermal characteristics can be found in section 7.1. 20 /25
7 Package details 7 Package details Figure 7.1 IMS C012 24-pin dual-in-line (DIL) package pinout 21 /25
Page 1 and 2: ) IMS C012 Link adaptor FEATURES H
Page 3 and 4: 1 Introduction 1 Introduction The I
Page 5 and 6: 3 System services 3 System services
Page 7 and 8: 3 System services 3.4 Reset The Res
Page 9 and 10: 4 Links Symbol Parameter Min Nom Ma
Page 11 and 12: 5 Parallel interface 5 Parallel int
Page 13 and 14: 5 Parallel interface Symbol Paramet
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Page 23 and 24: 7 Package details 7.1 Thermal speci
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