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Special requirements for the assembly of lead free products Agenda: 1 Technology Roadmap 2 Legislation in Europe 3 Lead Free (<strong>LF</strong>) Powder 4 Process qualification Solder <strong>Paste</strong> 5 Assembling 6 Reliability 7 Summary Jörg Trodler / Jürgen Ehmes W.C. Heraeus GmbH CMD-SM-AT,27.6.2006 Seite 2
1 Technology Roadmap 1.1 Technology Trend vs. Lead Free IMAPS Seoul, Sep. 2./3. 2004 Y-E Shin (KMJA/Korea) Thermal Fatigue Life in µBGA and Flip Chip Solder Joints Jörg Trodler / Jürgen Ehmes W.C. Heraeus GmbH CMD-SM-AT,27.6.2006 Seite 3
Page 1: Lead Free Assembling Industrial Exp
Page 5 and 6: 1 Technology Roadmap 1.1 Technology
Page 7 and 8: Special requirements for the assemb
Page 9 and 10: 2 Legislation in Europe Directive (
Page 11 and 12: 2 Legislation in Europe Directive o
Page 13 and 14: Special requirements for the assemb
Page 15 and 16: 3 Lead Free Powder 3.2 Patens / Com
Page 17 and 18: 3 Lead Free Powder 3.3 LF- solders
Page 19 and 20: 4 Process Qualification 4.1 Complex
Page 21 and 22: 4 Process Qualification 4.1 Complex
Page 23 and 24: 4 Process Qualification Boards Type
Page 25 and 26: 4.3 Temperature Profiles 4.3.1 Prof
Page 27 and 28: 4.3 Temperature Profiles 4.3.2 Line
Page 29 and 30: 4.3 Temperature Profiles 4.3.4 Prof
Page 31 and 32: 4 Process Qualification 4.4 Wetting
Page 33 and 34: 4 Process Qualification 4.5 Solder
Page 35 and 36: 4 Process Qualification 4.6 Surface
Page 37 and 38: 4 Process Qualification 4.7 Benchma
Page 39 and 40: 4.7 Benchmarking Procedure 4.7.2 Li
Page 45 and 46: 4.7 Benchmarking Procedure 4.7.3 Ho
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4.7 Benchmarking Procedure 4.7.4 We
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4.7 Benchmarking Procedure 4.7.4 We
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4.7 Benchmarking Procedure 4.7.5 Pr
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4.7 Benchmarking Procedure 4.7.5 Pr
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4.8 Process Window 4.8.1 Printing
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4.8 Process Window 4.8.1 Printing J
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4.8 Process Window 4.8.1 Printing V
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4.8 Process Window 4.8.1 Printing P
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4.8 Process Window 4.8.1 Printing V
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4.8 Process Window 4.8.1 Printing L
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4.8 Process Window 4.8.2 Soldering
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5 Assembling 5.1 Lead Free Material
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5 Assembling IMAPS Seoul, Sep. 2./3
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5 Assembling 5.3 Finishes on Printe
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5 Assembling 5.4 Reaction of Exchan
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5 Assembling 5.4 Reaction of Exchan
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6 Reliability 6.1 Failure Data - Ex
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6 Reliability 6.2 Voids vs. Tempera
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6 Reliability 6.3 Inter Metallic Co
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6 Reliability 6.4 Future Trends IMA
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Special requirements for the assemb
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