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5 Assembling 5.2 Finishes Components IMAPS Seoul, Sep. 2./3. 2004 S-Y Jeon (Samsung Electronics/Korea) Pb-free Strategy of Semiconductor Business in Samsung Electronics Jörg Trodler / Jürgen Ehmes W.C. Heraeus GmbH CMD-SM-AT,27.6.2006 Seite 94
5 Assembling 5.3 Finishes on Printed Circuits Boards (PCB) • ENIG NiAu • Immersion Sn • Immersion Ag • Cu OSP • HAL SnCu / SnCuNi • Cu-Au • EL Ni-Pd • EL Pd ZVEI 15.Sep. 2004; J.Albrecht, Siemens AG CT MM6; Anforderungen an bleifreie Elektronik in den einzelnen Anwendungsbereichen - Industrieelektronik Jörg Trodler / Jürgen Ehmes W.C. Heraeus GmbH CMD-SM-AT,27.6.2006 Seite 95
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Lead Free Assembling Industrial Exp
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1 Technology Roadmap 1.1 Technology
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1 Technology Roadmap 1.1 Technology
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Special requirements for the assemb
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2 Legislation in Europe Directive (
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2 Legislation in Europe Directive o
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Special requirements for the assemb
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3 Lead Free Powder 3.2 Patens / Com
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3 Lead Free Powder 3.3 LF- solders
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4 Process Qualification 4.1 Complex
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4 Process Qualification 4.1 Complex
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4 Process Qualification Boards Type
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4.3 Temperature Profiles 4.3.1 Prof
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4.3 Temperature Profiles 4.3.2 Line
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4.3 Temperature Profiles 4.3.4 Prof
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4 Process Qualification 4.4 Wetting
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4 Process Qualification 4.5 Solder
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4 Process Qualification 4.6 Surface
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4 Process Qualification 4.7 Benchma
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4.7 Benchmarking Procedure 4.7.2 Li
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4.7 Benchmarking Procedure 4.7.2 Li
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Page 45 and 46: 4.7 Benchmarking Procedure 4.7.3 Ho
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Page 57 and 58: 4.7 Benchmarking Procedure 4.7.5 Pr
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Page 61 and 62: 4.8 Process Window 4.8.1 Printing
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Page 73 and 74: 4.8 Process Window 4.8.2 Soldering
Page 91 and 92: 5 Assembling 5.1 Lead Free Material
Page 93: 5 Assembling IMAPS Seoul, Sep. 2./3
Page 97 and 98: 5 Assembling 5.4 Reaction of Exchan
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Page 101 and 102: 6 Reliability 6.1 Failure Data - Ex
Page 103 and 104: 6 Reliability 6.2 Voids vs. Tempera
Page 109 and 110: 6 Reliability 6.3 Inter Metallic Co
Page 119 and 120: 6 Reliability 6.4 Future Trends IMA
Page 121 and 122: Special requirements for the assemb
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