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4.8 Process Window 4.8.1 Printing Pitch Jörg Trodler / Jürgen Ehmes W.C. Heraeus GmbH CMD-SM-AT,27.6.2006 Seite 64
4.8 Process Window 4.8.1 Printing Volume Jörg Trodler / Jürgen Ehmes W.C. Heraeus GmbH CMD-SM-AT,27.6.2006 Seite 65
Page 1 and 2:
Lead Free Assembling Industrial Exp
Page 3 and 4:
1 Technology Roadmap 1.1 Technology
Page 5 and 6:
1 Technology Roadmap 1.1 Technology
Page 7 and 8:
Special requirements for the assemb
Page 9 and 10:
2 Legislation in Europe Directive (
Page 11 and 12:
2 Legislation in Europe Directive o
Page 13 and 14: Special requirements for the assemb
Page 15 and 16: 3 Lead Free Powder 3.2 Patens / Com
Page 17 and 18: 3 Lead Free Powder 3.3 LF- solders
Page 19 and 20: 4 Process Qualification 4.1 Complex
Page 21 and 22: 4 Process Qualification 4.1 Complex
Page 23 and 24: 4 Process Qualification Boards Type
Page 25 and 26: 4.3 Temperature Profiles 4.3.1 Prof
Page 27 and 28: 4.3 Temperature Profiles 4.3.2 Line
Page 29 and 30: 4.3 Temperature Profiles 4.3.4 Prof
Page 31 and 32: 4 Process Qualification 4.4 Wetting
Page 33 and 34: 4 Process Qualification 4.5 Solder
Page 35 and 36: 4 Process Qualification 4.6 Surface
Page 37 and 38: 4 Process Qualification 4.7 Benchma
Page 39 and 40: 4.7 Benchmarking Procedure 4.7.2 Li
Page 45 and 46: 4.7 Benchmarking Procedure 4.7.3 Ho
Page 47 and 48: 4.7 Benchmarking Procedure 4.7.3 Ho
Page 49 and 50: 4.7 Benchmarking Procedure 4.7.4 We
Page 57 and 58: 4.7 Benchmarking Procedure 4.7.5 Pr
Page 59 and 60: 4.7 Benchmarking Procedure 4.7.5 Pr
Page 61 and 62: 4.8 Process Window 4.8.1 Printing
Page 63: 4.8 Process Window 4.8.1 Printing J
Page 67 and 68: 4.8 Process Window 4.8.1 Printing P
Page 69 and 70: 4.8 Process Window 4.8.1 Printing V
Page 71 and 72: 4.8 Process Window 4.8.1 Printing L
Page 73 and 74: 4.8 Process Window 4.8.2 Soldering
Page 91 and 92: 5 Assembling 5.1 Lead Free Material
Page 93 and 94: 5 Assembling IMAPS Seoul, Sep. 2./3
Page 95 and 96: 5 Assembling 5.3 Finishes on Printe
Page 97 and 98: 5 Assembling 5.4 Reaction of Exchan
Page 99 and 100: 5 Assembling 5.4 Reaction of Exchan
Page 101 and 102: 6 Reliability 6.1 Failure Data - Ex
Page 103 and 104: 6 Reliability 6.2 Voids vs. Tempera
Page 109 and 110: 6 Reliability 6.3 Inter Metallic Co
Page 115 and 116:
6 Reliability 6.3 Inter Metallic Co
Page 117 and 118:
6 Reliability 6.3 Inter Metallic Co
Page 119 and 120:
6 Reliability 6.4 Future Trends IMA
Page 121 and 122:
Special requirements for the assemb
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