Paste 2 LF

More documents

Recommendations

Info

1 Technology Roadmap 1.1 Technology Trend vs. Lead Free IMAPS Seoul, Sep. 2./3. 2004 Y-E Shin (KMJA/Korea) Thermal Fatigue Life in µBGA and Flip Chip Solder Joints Jörg Trodler / Jürgen Ehmes W.C. Heraeus GmbH CMD-SM-AT,27.6.2006 Seite 4
1 Technology Roadmap 1.1 Technology Trend vs. Lead Free Technology and Package Trend 2005 2006 2007 Legislation Lead Free Automotive? 2003 Jörg Trodler / Jürgen Ehmes W.C. Heraeus GmbH CMD-SM-AT,27.6.2006 Seite 5
Page 1 and 2: Lead Free Assembling Industrial Exp
Page 3: 1 Technology Roadmap 1.1 Technology
Page 7 and 8: Special requirements for the assemb
Page 9 and 10: 2 Legislation in Europe Directive (
Page 11 and 12: 2 Legislation in Europe Directive o
Page 13 and 14: Special requirements for the assemb
Page 15 and 16: 3 Lead Free Powder 3.2 Patens / Com
Page 17 and 18: 3 Lead Free Powder 3.3 LF- solders
Page 19 and 20: 4 Process Qualification 4.1 Complex
Page 21 and 22: 4 Process Qualification 4.1 Complex
Page 23 and 24: 4 Process Qualification Boards Type
Page 25 and 26: 4.3 Temperature Profiles 4.3.1 Prof
Page 27 and 28: 4.3 Temperature Profiles 4.3.2 Line
Page 29 and 30: 4.3 Temperature Profiles 4.3.4 Prof
Page 31 and 32: 4 Process Qualification 4.4 Wetting
Page 33 and 34: 4 Process Qualification 4.5 Solder
Page 35 and 36: 4 Process Qualification 4.6 Surface
Page 37 and 38: 4 Process Qualification 4.7 Benchma
Page 39 and 40: 4.7 Benchmarking Procedure 4.7.2 Li
Page 45 and 46: 4.7 Benchmarking Procedure 4.7.3 Ho
Page 47 and 48: 4.7 Benchmarking Procedure 4.7.3 Ho
Page 49 and 50: 4.7 Benchmarking Procedure 4.7.4 We
Page 55 and 56:
4.7 Benchmarking Procedure 4.7.4 We
Page 57 and 58:
4.7 Benchmarking Procedure 4.7.5 Pr
Page 59 and 60:
4.7 Benchmarking Procedure 4.7.5 Pr
Page 61 and 62:
4.8 Process Window 4.8.1 Printing
Page 63 and 64:
4.8 Process Window 4.8.1 Printing J
Page 65 and 66:
4.8 Process Window 4.8.1 Printing V
Page 67 and 68:
4.8 Process Window 4.8.1 Printing P
Page 69 and 70:
4.8 Process Window 4.8.1 Printing V
Page 71 and 72:
4.8 Process Window 4.8.1 Printing L
Page 73 and 74:
4.8 Process Window 4.8.2 Soldering
Page 75 and 76:
Page 77 and 78:
Page 79 and 80:
Page 81 and 82:
Page 83 and 84:
Page 85 and 86:
Page 87 and 88:
Page 89 and 90:
Page 91 and 92:
5 Assembling 5.1 Lead Free Material
Page 93 and 94:
5 Assembling IMAPS Seoul, Sep. 2./3
Page 95 and 96:
5 Assembling 5.3 Finishes on Printe
Page 97 and 98:
5 Assembling 5.4 Reaction of Exchan
Page 99 and 100:
5 Assembling 5.4 Reaction of Exchan
Page 101 and 102:
6 Reliability 6.1 Failure Data - Ex
Page 103 and 104:
6 Reliability 6.2 Voids vs. Tempera
Page 105 and 106:
Page 107 and 108:
Page 109 and 110:
6 Reliability 6.3 Inter Metallic Co
Page 111 and 112:
Page 113 and 114:
Page 115 and 116:
Page 117 and 118:
Page 119 and 120:
6 Reliability 6.4 Future Trends IMA
Page 121 and 122:
Special requirements for the assemb
show all

Paste 2 LF

You also want an ePaper? Increase the reach of your titles

Delete template?

Save as template?