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2 Legislation in Europe 2002/96/EG and 2002/95EG EC OF THE EUROPEAN PARLAMENT AND OF THE COUNCIL of/on waste electrical and electronic equipment (WEEE); Brussels 27.Jan. 2003 Jörg Trodler / Jürgen Ehmes W.C. Heraeus GmbH CMD-SM-AT,27.6.2006 Seite 8
2 Legislation in Europe Directive (ROHS) on the Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment, dated 13 Feb. 2003 Art. 4: Prohibition of: Lead, mercury, cadmium, hexavalent chromium, PBB (polybrominated biphenyls) and PBDE (polybrominated diphenyl ethers) Deadlines for Prohibitions of Materials: EU Comission (1998 bzw. 2000): 1st Jan. 2004, resp. 2008 EU Parliament (04/2001): 1st Jan. 2006 EU Council of Ministers (12/2001): 1st. Jan. 2007 EU Parliamant 2nd reading (04/2002): 1st. Jan. 2006 Official Journal of the European Communities dtd. 13 Feb. 2003: 1st July 2006 Jörg Trodler / Jürgen Ehmes W.C. Heraeus GmbH CMD-SM-AT,27.6.2006 Seite 9
Page 1 and 2: Lead Free Assembling Industrial Exp
Page 3 and 4: 1 Technology Roadmap 1.1 Technology
Page 5 and 6: 1 Technology Roadmap 1.1 Technology
Page 7: Special requirements for the assemb
Page 11 and 12: 2 Legislation in Europe Directive o
Page 13 and 14: Special requirements for the assemb
Page 15 and 16: 3 Lead Free Powder 3.2 Patens / Com
Page 17 and 18: 3 Lead Free Powder 3.3 LF- solders
Page 19 and 20: 4 Process Qualification 4.1 Complex
Page 21 and 22: 4 Process Qualification 4.1 Complex
Page 23 and 24: 4 Process Qualification Boards Type
Page 25 and 26: 4.3 Temperature Profiles 4.3.1 Prof
Page 27 and 28: 4.3 Temperature Profiles 4.3.2 Line
Page 29 and 30: 4.3 Temperature Profiles 4.3.4 Prof
Page 31 and 32: 4 Process Qualification 4.4 Wetting
Page 33 and 34: 4 Process Qualification 4.5 Solder
Page 35 and 36: 4 Process Qualification 4.6 Surface
Page 37 and 38: 4 Process Qualification 4.7 Benchma
Page 39 and 40: 4.7 Benchmarking Procedure 4.7.2 Li
Page 45 and 46: 4.7 Benchmarking Procedure 4.7.3 Ho
Page 47 and 48: 4.7 Benchmarking Procedure 4.7.3 Ho
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4.7 Benchmarking Procedure 4.7.5 Pr
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4.8 Process Window 4.8.1 Printing
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4.8 Process Window 4.8.1 Printing J
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4.8 Process Window 4.8.1 Printing V
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4.8 Process Window 4.8.1 Printing P
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4.8 Process Window 4.8.1 Printing V
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4.8 Process Window 4.8.1 Printing L
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4.8 Process Window 4.8.2 Soldering
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5 Assembling 5.1 Lead Free Material
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5 Assembling IMAPS Seoul, Sep. 2./3
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5 Assembling 5.3 Finishes on Printe
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5 Assembling 5.4 Reaction of Exchan
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5 Assembling 5.4 Reaction of Exchan
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6 Reliability 6.1 Failure Data - Ex
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6 Reliability 6.2 Voids vs. Tempera
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6 Reliability 6.3 Inter Metallic Co
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6 Reliability 6.4 Future Trends IMA
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Special requirements for the assemb
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