tec.News - Harting

More documents

Recommendations

Info

to single-mode components with approx. 9 micrometre core diameter. The current development task for optimising the production process is to increase the yield of components with small core diameters. The splitter in Fig. 4 has a numerical aperture of 0.48 for connecting up the standard polymer fibre and an excess loss smaller than 2 decibels. By using crosslinked, transparent plastics, its temperature stability is approx. 130°C. MICROSTRUCTURE DUPLICATE MOULDING FOR ELECTRONIC MODULES If it is required to link electrooptical semiconductors, such as laser diodes or photo-detectors, to fibre-optic cables, a high degree of adjustment precision in the positioning of the semiconductor in relation to the waveguide is necessary. If, for cost reasons, the passive coupling is to be inserted via mechanical location markings, appropriate adjustment structures must be made on the substrate (which carries the chip and waveguide). This is impossible with conventional PCB technology, and it is also difficult in the lead frame technology widely used today. The solution being pursued by HARTING ELEKTRO- OPTISCHE BAU- ELEMENTE GMBH & CO. KG is based on the company's existing knowhow in methods of micro-structure duplicate moulding with plastics. Fig. 5: Microstructure duplicate moulding for electronic modules (schematic) Fig. 5 shows the manufacturing process. In a similar way to that already described, a mould insert for thermoplastic moulding of a metal-platable, microstructured plastic substrate is used À. The plastic substrate is given a thin surface coating of metal Á and then mechanically polished Â. The metal coating thus only remains in the depressions of the plastic substrate. As the substrate was moulded thermoplastically, it is easy to apply mechanical location marks for precise adjustment of semiconductor chips, fibre-optic cables and also micro-mirrors and lenses. To Fig. 6: Passively adjusted and bonded RC- LED with micro-mirror À Á Â Ã finish, the semiconductor chips are conventionally bonded Ã. Fig. 6 shows a passively adjusted and bonded RC-LED (Resonant- Cavity LED) on a substrate manufactured in this way, from the company, Mitel Semiconductor. The light is launched into the adjusted fibre in the mirror plate via a micro-mirror. Dissipation of the lost heat generated in the semiconductor chip is no problem provided the metal coatings on the plastic substrate are suitably dimensioned. The method of manufacturing described permits simultaneous production of mechanically, electrically and optically effective 3D structures, in which the process used achieves a high level of precision itself. The products derived from this technology carry the designation MicroMID ® (Micro Moulded Interconnect Device). DEVELOPMENT OBJECTIVE: MICROSTRUCTURED OPTO- ELECTRONICS The two previous sections make it clear how passive, integrated optical components with a precise surface structure can be manufactured and how electronic modules with the inverse, but equally precise, surface structure can be produced. If the two surface structures are engaged with each other, all the conditions for passive coupling between optical and opto-electronic systems are met. 40 HARTING tec.News 4-II-1999
Fig. 7 is a schematic diagram of the "sandwich technique" for electronics and optics, which is the ultimate goal. The "component halves" for optics and opto-electronics are manufactured separately. It is only at the last production step that they are joined together passively, but nevertheless with high precision, by means of an adhesive, soldering or plugin connection. optic cables. However, optical communications are also well on the way towards mass use in the transportation and automotive sector. Finally, the field of industrial communications should be mentioned, as it will undoubtedly also utilise low-cost electro-optical components. HARTING ELEKTRO- OPTISCHE BAU- ELEMENTE GMBH & CO. KG is deter- Fig. 7: Hybrid integrated optical component in sandwich technique PROMISING APPLICATIONS In forthcoming years it is to be expected that optical communication systems will make evergreater inroads into all the technical sectors where electrical, cable-bound data transmission is still used at present. Telecommunications and information technology will be the first areas of application to benefit, where the technology described will first of all be used to develop single-fibre transceivers for all types of fibre- mined to accelerate the continued growth of optical communication systems by developing pioneering products and systems. DR. HANS KRAGL is managing director of HARTING ELEKTRO- OPTISCHE BAUTEILE GMBH & CO. KG in Bad Salzdetfurth, Lower Saxony, Germany. Info-Fax 4009 41 People Power Partnership
Page 1 and 2: HARTING’s Technology Newsletter S
Page 3 and 4: Impressum. Published by: HARTING KG
Page 5 and 6: material, copper, necessitate the u
Page 7 and 8: with the pace of innovation require
Page 9 and 10: People Power Partnership 9
Page 11 and 12: Germany MII's main task is to synch
Page 13 and 14: the companies with branches in thei
Page 17 and 18: DIVERSE SYSTEM STRUCTURES "With the
Page 19 and 20: tec. S p e c i a l t o p i c GUEST
Page 21 and 22: (Fig. Siemens) vide further impetus
Page 23 and 24: horizontal contact rows, but the HA
Page 25 and 26: CAROL ANDERSON is responsible for p
Page 27 and 28: All these reports, forecasts and vi
Page 29 and 30: tec. S p e c i a l t o p i c APPLIC
Page 31 and 32: PHYSICAL LAYER SPECIFICA- TION PICM
Page 33 and 34: NGIO architecture (Fig. NGIO Forum)
Page 35 and 36: APPLICATION OF SOLDER PASTE Before
Page 39: Fig. 3: Schematic diagram of micros
Page 43 and 44: are required for installation in ju
Page 45 and 46: historically, meeting the highest a
Page 47 and 48: tec. I n f o - F a x +49(0)571 / 88

tec.News - Harting

You also want an ePaper? Increase the reach of your titles

Delete template?

Save as template?