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Linear Power Amplifiers - High Frequency Electronics

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ALSO PUBLISHED ONLINE:<br />

www.highfrequencyelectronics.com<br />

OCTOBER2012<br />

<strong>Linear</strong> <strong>Power</strong> <strong>Amplifiers</strong><br />

for Point-to-Point<br />

Radio Applications<br />

IN THIS ISSUE:<br />

Simulation Procedures for<br />

Successful Low Noise Amplifier<br />

Design<br />

Featured Products<br />

New Products<br />

Market Reports<br />

Ideas for today’s engineers: Analog · Digital · RF · Microwave · mm-wave · Lightwave


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ALSO PUBLISHED ONLINE AT: <br />

October2012<br />

www.highfrequencyelectronics.com Vol. 11 No. 10<br />

22<br />

LNA Design<br />

Simulation Procedures<br />

for Successful LNA<br />

Design Using Discrete<br />

Components<br />

By Sonoko Akamatsu,<br />

Scott Muir, Larry<br />

Dunleavy<br />

32<br />

<strong>Power</strong> Amps<br />

<strong>Linear</strong> <strong>Power</strong> <strong>Amplifiers</strong> for<br />

Point-to-Point Radio<br />

Applications<br />

By Sushil Kumar, Kent Story,<br />

Ron Kielmeyer, Tariq Lodhi,<br />

Ian Hardcastle<br />

46<br />

New Products<br />

Including Aeroflex,<br />

Anatech <strong>Electronics</strong>, Pico<br />

Technology, SAGE<br />

Millimeter, Field<br />

Components.<br />

16<br />

Featured Products<br />

12<br />

In The News<br />

6<br />

Editorial<br />

Featuring CST, Rogers<br />

Corp., Planar Monolithics<br />

Industries, RADITEK Inc.,<br />

Skyworks Solutions,<br />

Agilent Technologies.<br />

<strong>High</strong>lighting AWR Corp.,<br />

Rohde & Schwarz, RFMD,<br />

the SUCCESS Consortium,<br />

MITEQ Inc., The Boeing<br />

Co.<br />

News and<br />

commentary.<br />

6 Editorial<br />

8 Meetings & Events<br />

12 In the News<br />

48 New Products<br />

16 Featured Products<br />

70 Advertiser Index<br />

4 <strong>High</strong> <strong>Frequency</strong> <strong>Electronics</strong>


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solution. More importantly, the NI PXIe-5644R is the first software-designed<br />

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WIRELESS TECHNOLOGIES<br />

National Instruments supports a broad<br />

range of wireless standards including:<br />

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>> Learn more at ni.com/vst<br />

800 813 5078<br />

©2012 National Instruments. All rights reserved. LabVIEW, National Instruments, NI, and ni.com are trademarks of National Instruments.<br />

Other product and company names listed are trademarks or trade names of their respective companies. 07097


EDITORIAL<br />

Vol. 11 No. 10, October 2012<br />

Publisher<br />

Scott Spencer<br />

scott@highfrequencyelectronics.com<br />

Tel: 603-472-8261<br />

Associate Publisher/Managing Editor<br />

Tim Burkhard<br />

tim@highfrequencyelectronics.com<br />

Tel: 707-544-9977<br />

Senior Technical Editor<br />

Tom Perkins<br />

tom@highfrequencyelectronics.com<br />

Tel: 603-472-8261<br />

Vice President, Sales<br />

Gary Rhodes<br />

grhodes@highfrequencyelectronics.com<br />

Tel: 631-274-9530<br />

Editorial Advisors:<br />

Ali Abedi, Ph.D.<br />

Candice Brittain<br />

Paul Carr, Ph.D.<br />

Alen Fezjuli<br />

Roland Gilbert, Ph.D.<br />

Sherry Hess<br />

Thomas Lambalot<br />

John Morelli<br />

Karen Panetta, Ph.D.<br />

Business Office<br />

Summit Technical Media, LLC<br />

One Hardy Road, Ste. 203<br />

PO Box 10621<br />

Bedford, NH 03110<br />

Also Published Online at<br />

www.highfrequencyelectronics.com<br />

Subscription Services<br />

Sue Ackerman<br />

Tel: 651-292-0629<br />

circulation@highfrequencyelectronics.com<br />

Send subscription inquiries and address changes<br />

to the above contact person. You can send them<br />

by mail to the Business Office address above.<br />

Our Environmental Commitment<br />

<strong>High</strong> <strong>Frequency</strong> <strong>Electronics</strong> is printed<br />

on paper produced using sustainable<br />

forestry practices, certified by<br />

the Program for the Endorsement<br />

of Forest Certification (PEFC),<br />

www.pefc.org<br />

Balancing Innovation<br />

with Design Rigor and<br />

Processes<br />

Tom Perkins<br />

Senior Technical Editor<br />

I<br />

have enjoyed the privilege of being involved in design<br />

and development projects—mostly RF and microwave<br />

hardware--at many levels spanning parts of six<br />

decades. Responsibilities range from bottom-up design to<br />

leading teams of engineers and technicians. In recent<br />

years my involvement has, in part, reverted to serving as<br />

an individual contributor, which can be very rewarding.<br />

This led to several patents awards late in my career.<br />

Most projects carry very specific specifications and<br />

very short, defined schedules, requiring examination of the “critical path”<br />

schedule. Schedule slippage almost always leads to higher spending and cost<br />

overruns. Furthermore, in today’s economy, design entities must be responsible<br />

to a “customer” at a higher level up the “food chain.” The customer<br />

usually has rigid, unwavering expectations and specifications which may<br />

have been created by engineers who never get to meet the ultimate supplier/<br />

contractor.<br />

After specifications are created, legalism over the way specifications<br />

are written can be an issue. Both specifiers and suppliers now ponder the<br />

meaning of “will,” “shall,” “must,” “meet,” “goal,” “figure of merit,” “nominal,”<br />

etc. This occurs more in today’s environment due to lack of sustaining<br />

funds for the user to support the supplier design activity and profit-driven<br />

“bottom line.”<br />

R&D Handcuffed<br />

It seems that research and development is mostly relegated to universities,<br />

a few other government funded entities, and occasionally, efforts by<br />

individuals in home garages or basements, e.g., the Varian brothers and<br />

Hewlett-Packard. The development of electronic integrated circuits (and no<br />

doubt many regulations controlling business activity) has lessened the ability<br />

to do the gutsy garage-type activity over the past 40 years because of the<br />

need for specialty assembly capabilities. Many projects these days seem to<br />

expect outcomes that are truly unique and innovative, but carry limited<br />

funding and tight schedules—as if the design process and outcome is entirely<br />

predictable.<br />

Copyright © 2012, Summit Technical Media, LLC<br />

What to Do?<br />

So given this background, engineers’ drive for innovation can be significantly<br />

curtailed by the “bottom line” finances available. Obtaining parts for<br />

6 <strong>High</strong> <strong>Frequency</strong> <strong>Electronics</strong>


experimentation in practically zero<br />

time can require very resourceful<br />

effort because the rigid systems in<br />

place for parts procurement too often<br />

have been established primarily for<br />

production and “just-in-time” receipt.<br />

One partial solution is obtaining<br />

“samples,” but these are sometimes<br />

unreliable parts—and a single failure<br />

can result in quick dismissal of a project<br />

by management. Rigorous design<br />

rules, such as parts derating, design<br />

reviews (Preliminary Design Reviews,<br />

Critical Design Reviews, and Final<br />

Design Reviews) and many “-ilities”<br />

are important. But with tight constraints<br />

on schedules and finances<br />

they often severely limit time for<br />

experimentation.<br />

Suggestions:<br />

• Make a list of solutions very<br />

early in the design process. This would<br />

certainly include the solution proposed,<br />

but might have variants that<br />

could be more or less innovative, and<br />

might save cost.<br />

• Most design efforts involve team<br />

effort and the ability to compromise,<br />

combined with the resolve to do right.<br />

Sometimes you can get your wishes<br />

met by just ‘floating” an idea and letting<br />

others scramble to take credit for<br />

it.<br />

• Keep the design as simple as<br />

possible.<br />

• Try to anticipate how the design<br />

will look when released to production.<br />

Will it survive the test of time going<br />

forward with minimal Engineering<br />

Change Orders and compromises?<br />

• Will it fill a requirement that<br />

could be adapted to some future<br />

upgrade with minimal interface<br />

changes? Can we fill this space with<br />

something better in the future?<br />

• Discuss your ideas with others<br />

in various disciplines outside of engineering<br />

to get their inputs: project<br />

management, QA, reliability, manufacturing,<br />

etc.<br />

• Make the first meeting with the<br />

customer exciting by showing solutions<br />

considered and even making<br />

“mock-ups” of what the product might<br />

look like. Make sure the customer<br />

understands your interpretation of<br />

what they want. Sometimes there is<br />

wide difference between the written<br />

word and what they really need. Get<br />

changes in writing!<br />

• Be practical about where parts<br />

can be obtained. Try to insure that<br />

sample parts are reasonably reliable<br />

and not counterfeit, or rejects.<br />

Finally: remember that not all<br />

projects will be overwhelmingly successful.<br />

Some are praiseworthy but<br />

flawed concepts while others may be<br />

inadequately funded. But while you<br />

cannot be responsible for everything<br />

that happens, never let distractions<br />

interfere with your next good idea.<br />

Get info at www.HFeLink.com


MEETINGS & EVENTS<br />

Conferences<br />

October 28 – November 2, 2012<br />

EuMW 2012<br />

Amsterdam<br />

Information: http://www.eumweek.com/<br />

October 29 – November 1, 2012<br />

IEEE Military Communications Conference (MILCOM)<br />

Orlando, Fla.<br />

Information: http://www.milcom.org/<br />

March 19 – 21, 2013<br />

AeroDef Manufacturing Exposition and Conference<br />

Long Beach, Calif.<br />

Information: aerodefevent.com<br />

April 10 – 11, 2013<br />

Microwave & RF<br />

Paris<br />

Information: microwave-rf.com<br />

June 2 – 7, 2013<br />

IMS 2013<br />

Seattle, Wash.<br />

Information: http://www.ims2013.org/<br />

October 15 – 18, 2013<br />

IEEE International Symposium on Phased Array Systems<br />

& Technology<br />

Boston, Mass.<br />

Information: www.array2013.org<br />

Short Courses<br />

EMC Practical Applications Seminar and Workshop<br />

October 23 – October 25, 2012<br />

Hilton Hotel, Northbrook, Ill.<br />

847-537-6400<br />

www.dlsemc.com/emcseminar<br />

Learning how to design your product so that it complies<br />

with EMC regulations can save you from a finished<br />

product that fails in compliance testing.<br />

Re-designing or adding fixes to a failed product can<br />

be expensive and time-consuming. In this seminar<br />

you will learn the fundamentals of electro-magnetic<br />

compatibility, including understanding the many<br />

EMC regulatory requirements such as FCC, CE, US<br />

Military, RTCA-DO-160, and those of most foreign<br />

countries. You will learn how to minimize EMC problems,<br />

starting with the design process through final<br />

testing and approval, all of which will be brought to<br />

life through hands-on practical application to real-life<br />

products.<br />

Tonex<br />

tonex.com<br />

Tel: 1-888-868-6639<br />

Introduction to Wireless is a comprehensive two-day<br />

course covering all important aspects of wireless networks,<br />

applications and services.<br />

802.11ac Training covers the fundamentals of 802.11c<br />

concepts, features, technology, operations and configurations.<br />

Next generation of Wireless LAN technology or<br />

802.11ac standard aims to increase data rates to the<br />

region of 1Gbit/s by using wider channels compared to<br />

802.11n such as 80MHz and 160MHz channels. Up to 8<br />

MIMO spatial streams may be possible and includes<br />

higher-order modulation such as 256QAM and will be<br />

situated in the 5GHz band.<br />

Radar Communications Training features in-depth<br />

coverage of important, firm standards such as WML,<br />

WMLScript and XHTML. In addition a technical overview<br />

of WAP 2.0 is provided in this updated course. An<br />

overview of Open Mobile Architecture (OMA) initiative is<br />

also provided.<br />

Cellular Networks Performance Workshop provides<br />

a complete overview of the QoS and performance on the<br />

entire GSM/GERAN, CDMA and UMTS systems. It<br />

provides an introduction to the performance and QoS<br />

complete evolution of GSM towards a radio access and<br />

core IP networks that efficiently supports UMTS services<br />

(GERAN). It features a comprehensive study of system<br />

performance with simulations and field trials. Covers all<br />

major features such as basic QoS of voice, data and<br />

multimedia applications in GSM, GPRS, EDGE, CDMA,<br />

W-CDMA/UMTS and AMR and the full capability of the<br />

GERAN radio interface for 3G service support is<br />

envisaged.<br />

Besser Associates<br />

besserassociates.com<br />

Tel: 650-949-3300<br />

New Courses<br />

Course 227: Wireless LANs<br />

Course 226: Wireless/Computer/Telecom Network<br />

Security<br />

Course 228: GaN <strong>Power</strong> Amplifier Design<br />

Course 223: Fundamentals of LTE, HSPA, &<br />

WCDMA<br />

Course 221: BER, EVM, & Digital Modulation<br />

Testing for Test & Product Engineers<br />

Course 230: EMI/EMC Design and Troubleshooting<br />

Course 231: Radio <strong>Frequency</strong> Basics for <strong>Electronics</strong><br />

Professionals<br />

Course 222: RF <strong>Power</strong> Amplifier Techniques<br />

Featured Advanced Programs<br />

8 <strong>High</strong> <strong>Frequency</strong> <strong>Electronics</strong>


Size Does Matter<br />

The MLTO and MLTM-Series TO-8 YIG-Tuned oscillators<br />

from Micro Lambda Wireless provide designers a small<br />

compact and easy to use alternative for tuneable oscillator<br />

applications. These miniature oscillators provide wide<br />

tuning ranges covering 2 to 9 GHz, excellent phase noise<br />

performance of -125 dBc/Hz at 100 kHz offset in a TO-8<br />

sized package. Both electromagnetic and permanent<br />

magnet designs operate off +8 Vdc and -5 Vdc and do not<br />

require a heater.<br />

If PC board space is a premium, then these miniature<br />

oscillators are just what you are looking for.<br />

Same great performance as<br />

standard oscillators at less<br />

than one third the size!<br />

For more information about the MLTO &<br />

MLTM Series or other products, please<br />

contact Micro Lambda Wireless.<br />

See our complete line of YIG-Tuned Oscillators<br />

www.microlambdawireless.com<br />

Mini-Oscillators<br />

.5 to 10 GHZ<br />

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Oscillators<br />

.5 to 18 GHZ<br />

Low Noise<br />

Oscillators<br />

2 to 20 GHZ<br />

Millimeterwave<br />

Oscillators<br />

18 to 40 GHZ<br />

“Look to the leader in YIG-Technology”<br />

46515 Landing Parkway, Fremont CA 94538 • (510) 770-9221 • sales@microlambdawireless.com


MEETINGS & EVENTS<br />

Course 212: Behavioral Modeling & Digital Pre-<br />

Distortion of RF <strong>Power</strong> <strong>Amplifiers</strong><br />

Course 016: Modern Digital Modulation Techniques<br />

Course 181: Monolithic Microwave Integrated Circuit<br />

(MMIC) Design<br />

Courses Available via Web Classroom Delivery<br />

Course 059: RF Fundamentals<br />

Course 140: EMC/Shielding/Grounding Techniques<br />

for Chip & PCB Layout<br />

Course 216: <strong>Power</strong> Amplifier ABC’s<br />

Course 220: Phase Noise and Jitter<br />

Course 229: Introduction to Impedance Matching<br />

Course 228: GaN <strong>Power</strong> Amplifier Design<br />

Company-Sponsored<br />

Training & Tools<br />

Agilent Technologies<br />

Advanced Agilent VEE Pro<br />

October 23 - 26, 2012<br />

Las Vegas, Nev.<br />

http://www.home.agilent.com/agilent/eventDetail.<br />

jspx?cc=US&lc=eng&ckey=701878-14&nid=-<br />

34787.0.00&id=701878-14<br />

RF and Microwave Fundamentals<br />

October 23 – 26, 2012<br />

Las Vegas, Nev.<br />

http://www.home.agilent.com/agilent/eventDetail.<br />

jspx?cc=US&lc=eng&ckey=238:epsg:cou-3&nid=-<br />

536902435.626391.08&id=238:epsg:cou-3<br />

Analog Devices<br />

Training, tutorials and seminars.<br />

http://www.analog.com/en/training-tutorials-seminars/resources/index.html<br />

AWR<br />

On-site and online training, and open training courses on<br />

design software.<br />

http://web.awrcorp.com/Usa/News--Events/Events/<br />

Training/<br />

<strong>Linear</strong> Technology<br />

LTSpice IV<br />

LTpowerCAD<br />

LTpowerPlay<br />

Amplifier Simulation & Design<br />

Filter Simulation & Design<br />

Timing Simulation & Design<br />

Data Converter Evaluation Software<br />

http://www.linear.com/designtools/software/<br />

National Instruments<br />

LabVIEW Core 1<br />

Online<br />

http://sine.ni.com/tacs/app/fp/p/ap/ov/pg/1/<br />

LabVIEW Core 2<br />

Online<br />

http://sine.ni.com/tacs/app/fp/p/ap/ov/pg/1/<br />

Object-Oriented Design and Programming in LabVIEW<br />

Online<br />

http://sine.ni.com/tacs/app/fp/p/ap/ov/pg/1/<br />

Free, online LabVIEW training for students and teachers.<br />

http://sine.ni.com/nievents/app/results/p/country/<br />

us/type/webcasts/<br />

Webcasts on demand.<br />

http://search.ni.com/nisearch/app/main/p/bot/no/<br />

ap/tech/lang/en/pg/1/sn/catnav:mm,n15:Webcasts<br />

OnDemand,ssnav:dzn/<br />

LabVIEW user groups.<br />

https://decibel.ni.com/content/community/zone/<br />

labviewusergroups<br />

Call for Papers<br />

2013 IEEE International Wireless Symposium (IWS)<br />

April 13 – 18, 2013, Beijing, China<br />

Abstract Deadline: October 30, 2012<br />

Final Paper Deadline: December 10, 2012<br />

iws-ieee.org<br />

2013 IEEE International Microwave Symposium<br />

June 2 – 7, 2013, Seattle, Wash.<br />

Proposal Submission Deadline: October 14, 2012<br />

Paper Submission Deadline: December 10, 2012<br />

ims2013.mtt.org<br />

2013 IEEE International Symposium on Phased Array<br />

Systems<br />

October 15 – 18, 2013, Waltham, Mass.<br />

Summary Deadline: December 15, 2012<br />

Final Paper Deadline: June 1, 2013<br />

www.array.org<br />

2013 IEEE Wireless <strong>Power</strong> Transfer (WPT)<br />

May 15 – 16, 2013, Perugia, Italy<br />

Abstract Deadline: January 12, 2013<br />

Final Paper Deadline: March 23, 2013<br />

http://www.ieee.org/conferences_events/conferences/<br />

conferencedetails/index.html?Conf_ID=30420<br />

2013 IEEE International Topical Meeting on Microwave<br />

Photonics (MWP 2013)<br />

October 28 – 31, Annapolis, Md.<br />

Abstract Deadline: May 1, 2013<br />

www.mwp2013.org<br />

2013 38th International Conference on Infrared,<br />

Millimeter, and Terahertz Waves (IRMMW-THz)<br />

October 1 – 6, 2013, Mainz, Germany<br />

Abstract Deadline: April 15, 2013<br />

Final Paper Deadline: July 1, 2013<br />

www.irmmw-thz.org<br />

10 <strong>High</strong> <strong>Frequency</strong> <strong>Electronics</strong>


TIP 1 For an inductor with the<br />

absolute maximum Q, pick one<br />

of these air core “Springs”. They<br />

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TIP 3 Need to find coils with the<br />

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Our <strong>High</strong>est Q Finder web tool<br />

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again to plot the L, Q, Z and ESR<br />

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This new web tool finds inductors with TIP 4 When it’s time to build<br />

the highest Q at your operating frequency<br />

your prototypes, be sure to ask<br />

us for evaluation samples. They’re always free<br />

and we can get them to you overnight.<br />

To get started, visit www.coilcraft.com/Q<br />

Here are some high Q tips<br />

1508/2508<br />

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5.5 - 27 nH<br />

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Q up to 225<br />

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Q up to 350<br />

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132SM<br />

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90 - 538 nH<br />

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Q up to 300<br />

NEW!<br />

Q up to 210<br />

Q-Tips® is a registered trademark of Chesebrough-Ponds, Inc.<br />

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WWW.COILCRAFT.COM


IN THE NEWS<br />

The SUCCESS Consortium announced that it has<br />

developed and implemented a fully integrated 122<br />

GHz radar sensor. The surface-mountable package<br />

has a size of 8 mm x 8 mm.<br />

It includes a mixed-signal<br />

Silicon Germanium (SiGe)<br />

chip and two antennas for<br />

transmitting and receiving.<br />

The prototype is a breakthrough<br />

toward a miniaturized,<br />

low-cost, high-resolution<br />

millimeter-wave sensor<br />

for distance and speed measurements.<br />

The SUCCESS<br />

Consortium consists of<br />

nine partners across six countries: IHP, Robert<br />

Bosch GmbH, and the Karlsruhe Institute of<br />

Technology and Silicon Radar GmbH (Germany);<br />

ST Microelectronics (France); SELMIC (Finland);<br />

<strong>High</strong>tec MC AG (Switzerland); Evatronix<br />

(Poland); and the University of Toronto (Canada).<br />

The DoD announced that The Boeing Co., Seal<br />

Beach, Calif., is being awarded a $6,513,778 contract<br />

modification<br />

for Global<br />

Positioning<br />

Systems<br />

Satellite<br />

Sustainment.<br />

The contract<br />

modification<br />

provides for<br />

the exercise of<br />

an option for an additional 46,036 hours. The location<br />

of the performance is Seal Beach, Calif. The work is<br />

expected to be completed by Dec. 31, 2012. The contracting<br />

activity is SMC/GPK, El Segundo, Calif.<br />

Rohde & Schwarz has developed a communications<br />

intelligence system for airborne deployment<br />

to the public. Used in border protection, maritime<br />

rescue operations<br />

or military<br />

missions,<br />

for example,<br />

the onboard<br />

system reliably<br />

detects,<br />

identifies and<br />

locates radio<br />

signals. The<br />

Rohde & Schwarz solution is integrated into the DA42<br />

MPP Guardian from Diamond Airborne Sensing, a<br />

subsidiary of Diamond Aircraft Industries. Airborne<br />

communications intelligence significantly increases<br />

the efficiency of monitoring and intelligence missions.<br />

Airborne platforms make it much easier to monitor<br />

difficult-to-access terrain, the open sea, and green<br />

borders. Radio signals can be detected, identified and<br />

located regardless of the time of day and the visibility<br />

conditions.<br />

Delta Microwave issued congratulations to the<br />

NASA/JPL team on the August 2012 landing of the<br />

Mars Science Laboratory. Delta supplied L Band<br />

GPS Filter/<strong>Amplifiers</strong> for the range safety system of<br />

the Atlas V launch vehicle, X Band filters for the radar<br />

in the decent vehicle, and UHF couplers for the communications<br />

radio in the rover.<br />

Celcite Management Solutions,<br />

provider of automatic optimization<br />

tools and services for wireless networks,<br />

announced the appointment<br />

of Raj Beri as the Advisor to the<br />

CEO Rahul Sharma. As Advisor<br />

to the CEO, Beri will dedicate his<br />

efforts to exploring business and<br />

strategic opportunities, both domestic<br />

and global.<br />

Lockheed Martin Missiles and Fire Control,<br />

Orlando, Fla., is being awarded a $152,329,710 indefinite<br />

delivery/indefinite quantity contract for contractor<br />

logistics support<br />

services<br />

to sustain<br />

the Sniper<br />

Advanced<br />

Targeting<br />

Pod system.<br />

Location of<br />

performance<br />

is Lockheed<br />

Martin Missiles and Fire Control, Orlando, Fla. Work is<br />

to be completed by Aug. 31, 2017. The contracting activity<br />

is WR-ALC/GRWKA of Robins Air Force Base, Ga.<br />

RF Micro Devices, Inc. announced that it is enabling<br />

Samsung’s next-generation GALAXY Note II with<br />

RFMD’s <strong>Power</strong>Smart® <strong>Power</strong> Platforms—the industry’s<br />

first and only converged multimode, multiband<br />

(MMMB) power amplifiers. Bob Bruggeworth, president<br />

and CEO of RFMD, said, “We are delighted to<br />

support Samsung’s next-generation GALAXY Note II<br />

as well as numerous<br />

other flagship devices<br />

in Samsung’s<br />

exciting product<br />

12 <strong>High</strong> <strong>Frequency</strong> <strong>Electronics</strong>


4G 4 U<br />

Dual RF Mixer Needs Only 600mW<br />

Actual Size<br />

LTC5569 Total Solution Size:


IN THE NEWS<br />

family. With the ramp of the GALAXY Note II, RFMD<br />

extends our coverage of Samsung’s product portfolio to<br />

include all tiers and segments. In the coming months,<br />

we look forward to the availability of additional devices<br />

and baseband architectures that expand our business<br />

with Samsung to include additional PAs, incremental<br />

switch-based content, and new high-performance Wi-Fi<br />

front ends.”<br />

Agilent Technologies Inc. announced that it has<br />

worked with Concilium Technologies and the<br />

Department<br />

of Electrical,<br />

Electronic<br />

and Computer<br />

Engineering at the University of Pretoria, South<br />

Africa, to develop one of the largest electrical engineering<br />

training laboratories in the world. The lab<br />

was officially opened by Cheryl de la Rey, vice chancellor<br />

and principal of the University of Pretoria, and<br />

Benoit Neel, Agilent vice president and general manager<br />

of field operations for Europe, the Middle East and<br />

Africa. The Agilent-Computer Aided Education Center<br />

is a large undergraduate laboratory that has 144<br />

workstations, each fitted with an Agilent DSOX2002A<br />

digital oscilloscope with a built-in function generator, a<br />

U3401A 41/2 digit dual-display digital multimeter, an<br />

E3630A triple output DC power supply, and various RF<br />

design and analysis software programs. It is the largest<br />

laboratory of its kind in South Africa.<br />

Analog Devices, Inc. announced financial results<br />

for its third quarter of fiscal year 2012. “ADI delivered<br />

solid results for the third quarter, with revenue<br />

increasing by 1% and diluted EPS increasing by 6%<br />

compared to the prior quarter. Profitability and cash<br />

flow remained strong,” said Jerald G. Fishman,<br />

President and CEO. “Given the economic headwinds<br />

and uncertainty in most regions, we were encouraged<br />

by consistent order patterns among customers and<br />

distributors and by the resilience of our large and<br />

broad-based industrial business, as well as the communications,<br />

automotive, and consumer end markets.”<br />

Mr. Fishman continued, “As a result of higher opening<br />

backlog and stable order patterns, we are planning for<br />

sequential revenue growth in the fourth quarter. We<br />

expect that revenue from the industrial, communications,<br />

and automotive end markets will be similar to<br />

third quarter levels, in line with typical seasonal patterns.<br />

We are expecting sequential revenue growth<br />

from our consumer customers as is typical in the fourth<br />

quarter and also as a result of a strong new product<br />

cycle. In aggregate, we are planning for revenue in the<br />

range of $685 million to $715 million for the fourth<br />

quarter.”<br />

Sherry Hess, VP of Marketing at<br />

AWR Corp., recently noted that a<br />

year has passed since AWR merged<br />

with National Instruments: “At<br />

IMS 2012 in June we jointly demonstrated<br />

integration of AWR’s<br />

Visual System Simulator (VSS)<br />

and NI’s LabVIEW within both of<br />

our booths—for example, applications like 802.11ac,<br />

radar and more. At NIWeek 2012, we demonstrated<br />

Behavioral Model Extraction: A <strong>Power</strong> Amplifier<br />

Example, which showcased a PXI system being used<br />

for power amplifier behavioral model extraction that<br />

also embraces AWR’s time delay neural network modeling.<br />

As our second year as ‘A National Instruments<br />

Company’ unfolds, you’ll see more fruits of our joint<br />

labors—not only on the product and technologies front,<br />

but in the field at joint events and presentations.” Hess<br />

serves as an Editorial Advisor to <strong>High</strong> <strong>Frequency</strong><br />

<strong>Electronics</strong>.<br />

Bird Technologies is celebrating its 70th year in<br />

business. Founded in 1942 by J. Raymond Bird, the<br />

company has nearly 50 patents under its wings and<br />

installations in over 130 countries, Bird has continued<br />

to innovate its radio frequency products, systems,<br />

services, and educational solutions. From the historic<br />

Model 43 Thruline Directional Wattmeter, which put<br />

Bird on the RF communications map in the early ‘50s,<br />

to its new 7020 Series <strong>Power</strong> Sensor, the Bird name<br />

stands for RF performance and expertise. “We’ve<br />

always believed in developing and producing reliable<br />

RF communications products that stand the test of<br />

time. It’s built into every Bird product from product<br />

design through our vertically integrated manufacturing<br />

and test facilities and our accredited calibration<br />

lab. It lives up to what Mr. Bird envisioned when he<br />

first started the company,” remarked Bird President<br />

and CEO Mark Johnson.<br />

MITEQ Inc. appointed AR Benelux BV as the<br />

company’s exclusive sales representatives in The<br />

Netherlands. AR Benelux BV will represent MITEQ’s<br />

Component and SATCOM divisions, including amplifiers,<br />

mixers, frequency multipliers, switches, attenuators,<br />

IF signal processing components, upconverters<br />

and downconverters, LNAs and LNBs, and RF fiber<br />

optic links.<br />

Aeroflex/Inmet appointed MMS Technical Sales,<br />

Rochester, NY, as the company’s sales representative<br />

for upstate New York. MMS will represent Inmet’s<br />

broad product line of surface mount resistive products<br />

and high performance coaxial components, and provide<br />

support to strategic customers in the region.<br />

14 <strong>High</strong> <strong>Frequency</strong> <strong>Electronics</strong>


88dB SFDR @ 100MHz<br />

1.8V<br />

LTC6409<br />

LPF<br />

LTC2262-14<br />

0.9V Output<br />

Common-Mode Set<br />

Unleash Your <strong>High</strong> Speed ADC<br />

With 1.1nV/ Hz input noise density and 88dB SFDR performance at 100MHz, the LTC ® 6409 enables your high speed ADC<br />

to achieve outstanding performance. Its input common mode range includes ground and its output common mode can be<br />

set as low as 0.5V, making the LTC6409 the perfect choice for driving AC- or DC-coupled signals into the latest 1.8V data<br />

converters. Fully specified over the –40°C to 125°C temperature range, and available in a tiny 3mm x 2mm QFN package,<br />

the LTC6409 combines excellent AC performance with flexibility, robustness and a minimal footprint.<br />

Features<br />

Differential ADC Drivers<br />

Info & Free Samples<br />

• Unity Gain Stable<br />

• 1.1nV/ Hz Input Noise Density<br />

Part Number<br />

80dBc<br />

HD2/HD3<br />

(MHz)<br />

Input<br />

Referred<br />

Noise<br />

(nV/ Hz)<br />

Voltage<br />

Gain<br />

www.linear.com/6409<br />

1-800-4-LINEAR<br />

• 10GHz GBW @ 100MHz<br />

• DC- or AC-Coupled Inputs<br />

LTC6409<br />

LTC6406<br />

LTC6404-1<br />

110<br />

30<br />

15<br />

1.1<br />

1.6<br />

1.5<br />

R-set<br />

R-set<br />

R-set<br />

• 0.5V to 3.5V V OCM<br />

LTC6400-20<br />

120<br />

1.9<br />

20dB<br />

• –40°C to 125°C Fully Specified<br />

LTC6416<br />

90<br />

1.8<br />

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www.linear.com/ampsflyer<br />

• Tiny 3mm x 2mm QFN Package<br />

, LT, LTC, LTM, <strong>Linear</strong> Technology and the <strong>Linear</strong> logo are<br />

registered trademarks of <strong>Linear</strong> Technology Corporation.<br />

All other trademarks are the property of their respective owners.


<strong>High</strong> <strong>Frequency</strong> Products<br />

FEATURED PRODUCTS<br />

PCB Analyzer<br />

Design engineers dealing with electromagnetic<br />

compatibility (EMC)<br />

and signal integrity (SI) of PCBs<br />

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overview of potential problems in<br />

their layout. CST BOARDCHECK<br />

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Circuit Materials<br />

Rogers Corp.’s high-performance<br />

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fixed-site antennas include the<br />

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rogerscorp.com<br />

TM<br />

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System and Circuit<br />

Simulation Software<br />

Vector Signal Generator<br />

Agilent Technologies Inc. introduced<br />

the M9381A, a 1-MHz to 3- or<br />

6-GHz Vector Signal Generator that<br />

combines fast switching and excellent<br />

RF parametric performance:<br />

high output power, linearity and<br />

superior level accuracy, outstanding<br />

adjacent channel power ratio performance<br />

(for output levels up to<br />

+10 dBm or more) and wide modulation<br />

bandwidth (up to 160 MHz)<br />

for testing RF devices. It is designed<br />

for testing and validating the design<br />

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transceivers, public safety and military<br />

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Switch Matrix<br />

Mini-Circuits’ USB-8SPDT-A18 is a<br />

general purpose USB controlled RF<br />

switch matrix containing eight electro-mechanical<br />

SPDT, absorptive<br />

fail-safe RF switches constructed in<br />

break-before-make configuration<br />

and powered by +24 VDC with a<br />

switching time of 25 mSec typical.<br />

The eight switches can be set as:<br />

eight independent SPDT switches;<br />

a 2 x 8 switch; an SP5T switch and<br />

a transfer switch; two transfer<br />

switches; and many other configurations.<br />

Mini-Circuits<br />

minicircuits.com<br />

<strong>Power</strong> Amps<br />

Hittite’s new HMC952 and the<br />

HMC952LP5GE are four stage<br />

GaAs pHEMT MMIC 2 Watt<br />

16 <strong>High</strong> <strong>Frequency</strong> <strong>Electronics</strong>


© 2012 AWR Corporation. All rights reserved.<br />

The AWR<br />

mmWave<br />

design flow<br />

Often MMIC’d<br />

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<strong>High</strong> <strong>Frequency</strong> Products<br />

FEATURED PRODUCTS<br />

Medium <strong>Power</strong> <strong>Amplifiers</strong> with<br />

temperature compensated on chip<br />

power detectors that operate<br />

between 9 and 14 GHz. They provide<br />

33 dB of gain, +35 dBm of saturated<br />

output power, and 27% PAE<br />

(<strong>Power</strong> Added Efficiency) from a<br />

+6V supply. With up to +43 dBm<br />

output IP3 the HMC952LP5GE is<br />

ideal for high linearity applications<br />

in military and space as well as<br />

high capacity point-to-point and<br />

point-to-multi-point radios.<br />

Hittite Microwave Corp.<br />

hittite.com<br />

LNAs<br />

RADITEK’s <strong>High</strong> Stability C-Band<br />

LNA’s is the latest addition to its<br />

SATCOM products and offers premium<br />

performance and reliability.<br />

The latest technology used produces<br />

the lowest possible noise temperature<br />

in an uncooled LNA.<br />

Designed for satellite earth station<br />

receiver front ends and other applications,<br />

utilizing state-of-the-art<br />

technology. Designed for both fixed<br />

and transportable applications.<br />

RADITEK Inc.<br />

raditek.com<br />

Switch<br />

Skyworks has a new 0.02 – 4.0<br />

gigahertz, gallium arsenide based<br />

high isolation, single-pole fourthrow<br />

switch with integrated 50<br />

Ohm terminations in small 3 x 3<br />

millimeter quad flat no-lead plastic<br />

surface mount technology package.<br />

The SKY13384-350LF is ideal for<br />

designs where low insertion loss<br />

(40 dB)<br />

and broadband return loss (15 dB)<br />

are required, such as in critical<br />

filtering and band switching<br />

applications. Markets for this<br />

wideband high isolation switch<br />

include wireless infrastructure,<br />

military communications and test<br />

and measurement.<br />

Skyworks Solutions<br />

skyworksinc.com<br />

PLO<br />

The CLX-1020-XA Phase-Locked<br />

Oscillator operates at 1020 MHz<br />

and features exceptionally-low<br />

phase noise (


<strong>High</strong> <strong>Frequency</strong> Products<br />

FEATURED PRODUCTS<br />

Couplers<br />

RFMW announced design/sales<br />

support for Florida RF 0805 hybrid<br />

couplers. These miniature couplers<br />

handle RF power up to 5W CW and<br />

have greater thermal conductivity<br />

than comparably sized options.<br />

Standard applications include LNA<br />

circuits where a balanced topology<br />

using a hybrid coupler provides a<br />

higher intercept point than a single<br />

stage, offering increased sensitivity<br />

and therefore range. The hybrids<br />

can also be used in final stage<br />

amplifier circuits for Pico cells and<br />

indoor repeaters. Five models cover<br />

the major commercial spectrum<br />

from 700 to 3700 MHz.<br />

RFMW<br />

rfmw.com<br />

Switch<br />

PMI Model No.P2T-14D415D4-15-<br />

SMT-20W is a driverless high-power<br />

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designed for surface mount<br />

applications. This switch operates<br />

from 14.4 to 15.4 GHz and has an<br />

insertion loss of 1.2 dB maximum at<br />

+25°C. The Tx/Rx isolation is 10 dB<br />

minimum and this switch can handle<br />

input power levels up to 20<br />

watts. The size of this SMT switch<br />

is 0.35” x 0.5” x 0.21”.<br />

Planar Monolithics Industries<br />

pmi-rf.com<br />

Amp<br />

TriQuint Semiconductor, Inc.<br />

released two new packaged 1W<br />

and 2W gallium arsenide (GaAs<br />

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TriQuint Semiconductor, Inc.<br />

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Inductors<br />

AVX Corp. developed a series of<br />

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and high self-resonance, the RoHScompliant<br />

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AVX Corp.<br />

avx.com<br />

20 <strong>High</strong> <strong>Frequency</strong> <strong>Electronics</strong><br />

Switch<br />

RLC <strong>Electronics</strong> announced the<br />

introduction of a switch module; it<br />

is possible to integrate switches<br />

from our extensive range of products<br />

along with other components<br />

into a single package. The example<br />

shown comprises an electromechanical<br />

transfer switch and a<br />

SPDT switch used to switch an RF<br />

power source between two antennas<br />

and simultaneously select a<br />

fixed delay line to meet circuit configurations.<br />

RLC <strong>Electronics</strong><br />

rlcelectronics.com<br />

Module<br />

RFMD’s new RFFM6904 is a singlechip<br />

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applications in the 868MHz/900MHz<br />

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reduction for typical portable equipment<br />

RF front-end design and<br />

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thus minimizing the footprint and<br />

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CST STUDIO SUITE 2012<br />

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<strong>High</strong> <strong>Frequency</strong> Design<br />

LNA Design<br />

Simulation Procedures for<br />

Successful Low Noise Amplifier<br />

(LNA) Design Using Discrete<br />

Components<br />

By Sonoko Akamatsu, Scott Muir, and Larry Dunleavy<br />

Introduction<br />

Guiding the user through This tutorial is<br />

the stages of a basic low intended to guide the<br />

noise amplifier design user through the stages<br />

and optimization. of a basic low noise amplifier<br />

design and optimization,<br />

with a goal of first-pass fabricated design<br />

success. This will be accomplished by providing<br />

the user with a project tutorial, starting<br />

with the design process and ending with a<br />

comparison between the software simulations<br />

and the model performances. This example<br />

used in this treatment is that of a low noise<br />

amplifier using a Modelithics-developed nonlinear<br />

model for an Avago ATF54143 PHEMT<br />

device along with Modelithics CLR models for<br />

all passive lumped components [1, 2]. The<br />

simulations shown were developed within<br />

Agilent Technologies’ Advanced Design<br />

System (ADS) RF/Microwave circuit design<br />

simulation environment.<br />

Design Process<br />

In this design, a low noise<br />

amplifier application circuit<br />

was demonstrated at 1.9 GHz.<br />

As stated above, the design<br />

was started with a Modelithics<br />

nonlinear model for Avago<br />

ATF54143 PHEMT device and<br />

Modelithics CLR Models were<br />

used for all passive components.<br />

Figure 1 shows a systematic<br />

design process that<br />

can be followed with good success<br />

for cases where a reference<br />

design or application circuit<br />

is available from the vendor. The initial<br />

schematic described in this note was generated<br />

from the manufacturer application note [3].<br />

Modelithics transistor and passive component<br />

models were then used as the basis for optimization<br />

of the performance, along with built-in<br />

ADS microstrip library models for distributed<br />

elements (MLIN, MTEE, etc.). Additional<br />

steps that can be followed to further improve<br />

this design flow would be to include electromagnetic<br />

co-simulation of the microstrip portion<br />

of the circuit and with volume manufacturability<br />

in mind to add a statistical Monte<br />

Carlo analysis including expected variability<br />

of the PCB board material properties and RLC<br />

component tolerances.<br />

Basic Theory<br />

The Noise Figure describes the signal-tonoise<br />

degradation due to a noisy microwave<br />

component. The Noise Figure is defined as the<br />

ratio of the total available noise power at the<br />

output of the amplifier to the available noise<br />

Figure 1 • Design flow followed for this example LNA<br />

design.<br />

22 <strong>High</strong> <strong>Frequency</strong> <strong>Electronics</strong>


COMPLIANT<br />

<strong>High</strong> <strong>Linear</strong>ity<br />

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<strong>High</strong> <strong>Frequency</strong> Design<br />

LNA Design<br />

power at the input due to thermal noise from the input<br />

termination. The Noise Figure can be expressed as<br />

Where SNRi and SNRo are the signal to noise ratio at<br />

the input and output of the component and P No<br />

is the total<br />

available power at the output of the amplifier, P Ni<br />

is the<br />

available noise power due to the input termination and<br />

G A<br />

is the Available <strong>Power</strong> Gain.<br />

An alternate method for calculating the Noise Figure<br />

is expressed as<br />

the model. The S parameters and noise parameters were<br />

obtained from the Modelithics nonlinear model at the<br />

desired bias point and frequency. The results are shown<br />

in Table 2 and Table 3 under drain source voltage 3 V and<br />

gate voltage of 0.562 V. For this condition the simulated<br />

drain current from the model is 60 mA.<br />

Table 2 • Model Generated S Parameter Results at 1.9<br />

GHz (Vds = 3V, Vgs = 0.562V, Ids = 60 mA).<br />

F min<br />

, r n<br />

, and Γ opt<br />

are known as noise parameters and<br />

are given by the manufacturer of the transistor or can be<br />

derived experimentally.<br />

To achieve the minimum noise figure, Γ s<br />

= Γ opt<br />

is chosen.<br />

However, simultaneous minimum noise figure and<br />

maximum gain cannot be obtained, in general. Therefore,<br />

the reflection coefficient, Γ s<br />

can be selected that is a compromise<br />

between the Noise Figure and Gain performance<br />

[4]. The Available Gain can be calculated by<br />

Table 3 • Noise Parameters at 1.9 GHz (Vds = 3V, Vgs<br />

= 0.562V, Ids = 60 mA).<br />

The stability factor of the amplifier was simulated<br />

and also calculated by the obtained S-parameters [4]:<br />

For a two port network, unconditional stability is<br />

achieved when these criteria are satisfied: stability factor<br />

K > 1, and |D| > 1. An alternate set of stability criteria<br />

is K > 1 and b >0, with the b corresponding to the<br />

stability measurement given by:<br />

Design Goals<br />

Table 1 shows the design goals for this example LNA.<br />

The design approach and topology followed that determined<br />

by Avago Application Note 1222 as mentioned<br />

above. Series capacitors and parallel inductors were used<br />

for matching networks and a resistive loading method<br />

was chosen to maintain stability. Additionally source<br />

inductance was added to improve the input return loss.<br />

As a result, NF = 0.8 dB and Gain = 16 dB were obtained<br />

by an ADS simulation.<br />

Table 1 • Design Goals.<br />

Device Simulation<br />

Before proceeding to incorporate the application circuit<br />

topology and layout details, device simulation and<br />

stability analysis were performed on the transistor using<br />

Figure 2 graphically shows that the transistor is<br />

potentially unstable at the design frequency band.<br />

Manufacturer Application Circuit<br />

An application circuit was designed based on the schematic<br />

and component parts list in Table 4 provided by the<br />

manufacturer [3]. Series capacitors and parallel inductors<br />

are used for matching networks. To ensure stability,<br />

resistive loads, 51 ohm and 10 ohm are used to improve<br />

input and output bias networks respectively as shown in<br />

Figure 3 below. The design of these bias networks are<br />

such that the effects of the 51 ohm input bias resistor are<br />

isolated from the RF part of the circuit by a 3.3 nH choke<br />

inductor and a 10 pF bypass capacitor, thus increasing<br />

the noise figure. A combination of 10pF and 10 nF were<br />

used for bypass capacitors.<br />

In addition, source inductance was added for an<br />

improvement of input return loss. The measurement data<br />

of the manufacturer information indicates the potential<br />

for, 16 dB Gain at 1900 MHz, 0.7~0.8 dB Noise Figure<br />

from 1900 MHz through 2000 MHz, -6.4 dB Input Return<br />

Loss and -12.5 dB Output Return Loss under Vds = 3V at<br />

Id = 65mA.<br />

24 <strong>High</strong> <strong>Frequency</strong> <strong>Electronics</strong>


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<strong>High</strong> <strong>Frequency</strong> Design<br />

LNA Design<br />

Figure 2 • Stability Factor (K) and Stability Meas (b).<br />

Schematic Circuit and Optimization<br />

Optimization is necessary to achieve the performance<br />

listed on the application note since the chosen substrate<br />

thickness and layout for this demonstration is different<br />

than that of the manufacturer’s reference design [3]. In<br />

addition, details like the passive component size and<br />

manufacturer information are not listed in the application<br />

note. The available Modelithics models are tailored<br />

to the specifics of manufacturer component family and<br />

body style and are substrate scalable. Model inputs were<br />

setup for applicability to the 16 mil Rogers 4003 board<br />

chosen for this design. Figure 3 shows the schematic after<br />

optimization.<br />

Figure 4 and Figure 5 include plots of the optimized<br />

simulation results. Simulations show a Gain of 15.8 dB at<br />

1880 MHz, 0.7 dB Noise Figure, -5.4 dB Input Return<br />

Loss and -15.8 dB Output Return Loss under Vds=3V at<br />

Id=55.7mA. This is close to the manufacturer’s performance<br />

[3]. Table 5 shows the updated optimized component<br />

part list using Modelithics Models.<br />

Figure 3 • Optimized Schematic for LNA. Models shown<br />

are Modelithics CLR passive models.<br />

Layout and Fabrication<br />

As mentioned above, a 16mil Rogers 4003 substrate<br />

was used for the board fabrication. RF probe pads and<br />

grounding pads were added into Figure 6 to facilitate<br />

testing with ground-signal-ground (GSG) RF wafer<br />

Table 4 • Manufacturer’s Component Parts List for LNA<br />

Reference Design.<br />

Table 5 • Manufacturer’s Component Parts List Along<br />

with Modifications to Optimization using Modelithics<br />

Models (See Fig. 5 for details of usage in circuit).<br />

26 <strong>High</strong> <strong>Frequency</strong> <strong>Electronics</strong>


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<strong>High</strong> <strong>Frequency</strong> Design<br />

LNA Design<br />

Figure 4 • Optimized LNA S-parameter Simulation Results. Vds = 3 V, Vgs = 0.562 V, Id = 60 mA.<br />

probes. Figure 7 shows the complete assembled board.<br />

The board size is approximately 24mm x 18mm.<br />

Comparison to Measurements<br />

An Anritsu 37397C Vector Network Analyzer (VNA),<br />

J-Micro Wafer Probing Station and GGB 650 pitch probes<br />

were used for the measurements. A Thru Reflect Line<br />

NF (dB )<br />

1.6<br />

1.4<br />

1.2<br />

1.0<br />

0.8<br />

0.6<br />

0.4<br />

0.2<br />

m9<br />

m9<br />

freq=<br />

1.880G Hz<br />

nf(2)=0.630<br />

0.0<br />

1.5 1.7 1.9 2.1 2.3<br />

2.5<br />

F req, GHz<br />

Figure 5 • Optimized LNA Noise Simulation Result. Vds<br />

= 3 V, Vgs = 0.562 V, Id = 60 mA.<br />

(TRL) calibration was performed for these 2 port measurements<br />

using custom calibration standards fabricated<br />

on the same boards used for measurement. The results in<br />

Figure 8 show 17 dB Gain was obtained at 1.88 GHz<br />

when the amplifier was tested at a bias point of Vds=3V<br />

at Id=82mA. (Note that the transistor bias current is<br />

slightly different than that simulated due to transistor<br />

fabrication differences. Vds and Vgs values equal the<br />

simulated values, however the fabricated device uses a<br />

higher current.) Figure 8 also shows the comparison<br />

between simulation and measurement. The result shows<br />

the amplifier design achieved first-pass success. It<br />

should be mentioned that bench tuning or tweaking was<br />

done on this design after assembly. Figure 9 illustrates<br />

that the out-of band performance is also well predicted<br />

through 10 GHz. A comparison with measured Noise<br />

Figure is shown in Figure 10. These results show that<br />

simulation with Modelithics models agrees well with<br />

measurement data and verifies the success of the proposed<br />

design flow.<br />

To briefly explore alternative model results, Figure 11<br />

includes a comparison between results achieved with<br />

Modelithics models, compared to that achieved with<br />

alternately available models. This included an alternative<br />

28 <strong>High</strong> <strong>Frequency</strong> <strong>Electronics</strong>


Figure 6 • LNA Layout.<br />

Figure 7 • LNA Assembled Board.<br />

ADS Curtice model for the transistor available<br />

from the manufacturer’s website along<br />

with both Modelithics Global Models and<br />

ideal passive models.<br />

Figure 8 • Comparison of Measured (blue) and Simulated (Red). Bias<br />

conditions: Vds = 3V, Id = 82mA through 3 GHz.<br />

Summary and Conclusions<br />

In this note, a 1.9 GHz Low Noise<br />

Amplifier application circuit was described<br />

that demonstrated a first pass success<br />

design approach. Avago ATF 54143<br />

PHEMT device was chosen to satisfy the<br />

low noise requirement. The design flow<br />

started from the manufacturer application<br />

note and was optimized using a Modelithics<br />

model for the transistor and substratescalable<br />

Modelithics Global Models for the<br />

RLC components. A key feature of achieving<br />

first pass success with this design flow<br />

is the ability to account accurately for<br />

vendor specific performance and substrate<br />

effects of the passive models while being<br />

able to optimize the part values chosen to<br />

achieve the desired performance.<br />

About the Authors:<br />

Sonoko Akamatsu was a student intern<br />

at Modelithics, Inc. when this work was<br />

performed; she is now a Senior RF Design<br />

Engineer at TriQuint Semiconductor’s<br />

New England Design Center, Chelmsford,<br />

Mass.<br />

Scott Muir is an Electrical Engineering<br />

Intern at Modelithics, Inc., Tampa, Fla.<br />

Larry Dunleavy is President and CEO<br />

of Modelithics, Inc., Tampa, Fla. He is also<br />

a Professor at the University of South<br />

Florida.<br />

Figure 9 • Comparison Results for LNA Extended through 10 GHz at<br />

3V, 82mA.<br />

October 2012 29


<strong>High</strong> <strong>Frequency</strong> Design<br />

LNA Design<br />

20<br />

15<br />

NF<br />

10<br />

5<br />

0<br />

0.9 1.4 1.9 2.4 2.9 3.4 3.9<br />

freq, GHz<br />

Figure 10 • Noise figure through 3.9 GHz. Red line –<br />

simulation, Blue line – measurement. Vds = 3V, Vgs =<br />

0.562V, Ids=82mA.<br />

References:<br />

[1] “Comprehensive Models for RLC Components to<br />

Accelerate PCB Designs,” Microwave Journal, May 2004.<br />

[2] Sonoko Akamatsu, “Application of Accurate<br />

Component Models for Improved First-Pass Microwave<br />

Circuit Design Success,” MS Project University of South<br />

Florida, July 2005.<br />

[3] Avago Technologies, “<strong>High</strong> Intercept Low Noise<br />

Amplifier for the 1850–1910 MHz PCS Band using the<br />

Enhancement Mode PHEMT”, May 2010.<br />

http://www.avagotech.com/docs/5989-2273EN<br />

[4] Guillermo Gonzalez, “Microwave Transistor<br />

<strong>Amplifiers</strong>: Analysis and Design, ”<br />

Second Edition. New Jersey: Prentice Hall, 1997.<br />

Acknowledgements:<br />

The authors would like to acknowledge the assistance<br />

of Chris Reul, who assisted with some of the measurements<br />

shown in this paper while interning at Modelithics.<br />

Chris is now with Honeywell Company in Clearwater,<br />

Fla. We would also like to thank Rich Carlson and Laura<br />

Levesque for editing suggestions.<br />

Contact information:<br />

Modelithics, Inc., 3650 Spectrum Blvd., Suite 170,<br />

Tampa, FL 33612 • voice 888- 359-6539 • email sales@<br />

modelithics.com • web www.modelithics.com<br />

Figure 11 • Comparison of results, including Vendor<br />

S-Parameter Models for passives and available “ADS<br />

Model” and Modelithics models.<br />

30 <strong>High</strong> <strong>Frequency</strong> <strong>Electronics</strong>


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<strong>High</strong> <strong>Frequency</strong> Design<br />

<strong>Power</strong> Amps<br />

<strong>Linear</strong> <strong>Power</strong> <strong>Amplifiers</strong> for<br />

Point-to-Point Radio<br />

Applications<br />

By Sushil Kumar, Kent Story, Ron Kielmeyer, Tariq Lodhi, and Ian Hardcastle—mmW<br />

Solutions Team, RFMD<br />

Microwave links in<br />

There is a need to the range of 10 – 27 GHz<br />

develop a new are commonly used for<br />

generation of highly point-to-point (P2P) connectivity.<br />

With the phe-<br />

linear, high frequency<br />

chipsets to address nomenal increase of cell<br />

traffic congestion. phone users and demand<br />

for high data rates, link<br />

traffic is getting congested. Since available<br />

channel bandwidth is limited and fixed, link<br />

manufacturers are addressing this traffic<br />

congestion by increasing spectral efficiency<br />

and are using a complex modulation scheme<br />

such as 4 – 1024 QAM.<br />

In order to support this high order modulation<br />

scheme, there is a need to develop a<br />

new generation of highly linear, high frequency<br />

chipsets starting from baseband to<br />

antenna for Tx path and from antenna to<br />

baseband for Rx path.<br />

RFMD has developed a new generation of<br />

chipsets as shown in Figure 1 in the frequency<br />

range of 10 – 27 GHz to address the growing<br />

issue of traffic congestion.<br />

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state-of-the-art phase noise,<br />

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IIP3 together in their class.<br />

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As the modulation rate is<br />

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operation. The PA should be capable of maintaining<br />

a high level of intermod suppression<br />

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error vector magnitude, (EVM), especially<br />

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W, worst case IM3 for entire gain dynamic<br />

range is >46 dBc at Pin = -15dBm.<br />

Figure 1 • RFMD’s 10 – 27 GHz Chipset.<br />

32 <strong>High</strong> <strong>Frequency</strong> <strong>Electronics</strong>


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The RFPA1702 is a 17.7 - 19.7 GHz linear PA. It is<br />

designed for 18 GHz P2P link. It has 25 dB gain,<br />

IM3=52dBc at P OUT<br />

=20dBm/DCL and 32.5dBc at<br />

P OUT<br />

=27dBm/DCL. P1dB of this PA is +31.0 dBm and<br />

OIP3=41dBm at P OUT<br />

=28dBm/DCL. Its power dissipation<br />

is ~7.0 W and NF~7.0 dB. With over 15 dB gain<br />

control, it consumes 2 to 6W dc power and OIP3 varies<br />

from 20 to 40 dBm. The minimum IM3 is >55dBc for<br />

Pin=-15dBm/DCL. All of these PAs have been internally<br />

fabricated using 0.25µm PHEMT technology and packaged<br />

in a 6 x 6 QFN package.<br />

Circuit Design<br />

The key to circuit design is the device model. This<br />

model should be able to accurately predict small and<br />

large signal behavior including<br />

P1dB and IM3. The model, which is<br />

developed using DC-IV and<br />

[S]-parameter over various bias<br />

voltages, accurately predicts DC,<br />

[S]-parameters, P1dB and Psat performance.<br />

Such models usually<br />

over predict IM3, and its contours<br />

are sometimes severely dislocated<br />

on the Smith Chart compared to<br />

measured contours. RFMD’s PAs<br />

are designed based on a combination<br />

of measured load-pull data and<br />

modified device models to properly<br />

incorporate IM3 behavior and<br />

device scaling based on IM3.<br />

A good technique to PA design is<br />

to partition the spec into number of<br />

stages and then decide the device<br />

size for each stage that should provide<br />

required gain, power, and IM3<br />

per stage and inter-stage drive<br />

ratio. To design a linear power<br />

amplifier one should look for high<br />

gain and best possible IM3 for specified<br />

output power and each device<br />

should be biased for a little higher<br />

Idss compared a saturated power<br />

amplifier design. Normally a saturated<br />

power amplifier is biased<br />

close to deep class AB condition.<br />

Agilent’s ADS and Momentum have<br />

been used to design power amplifiers<br />

discussed here. Voltage and current<br />

probes have been used at all<br />

parallel nodes feeding and combining<br />

signal and power to active<br />

device. This helped to determine to<br />

maintain close to identical impedances<br />

at all similar nodes and thus<br />

minimize odd-mode problem. Due<br />

to inter-coupling among feed network,<br />

impedance mismatch occurs<br />

that cause odd-mode stability<br />

issues. To suppress odd-mode insta-


<strong>High</strong> <strong>Frequency</strong> Design<br />

<strong>Power</strong> Amps<br />

band PAs. Figure 3b shows PA<br />

outline package drawing. The<br />

main objective of PA design was<br />

to get the best possible IM3 performance<br />

at P OUT<br />

(total) =28<br />

dBm. Better BW or Psat can be<br />

achieved if IM3 is not the main<br />

design criterion.<br />

bility, proper value resistors have been added at gates<br />

and drains. ADS S-probe method has been used to check<br />

inter-stage stability. Figure 2 is an example of the<br />

design steps used for design of these PAs. Figure 3a<br />

shows die photographs of 10, 11, 13, 15, and 18 GHz<br />

Performance of 9.8 - 13.3 GHz<br />

<strong>Linear</strong> <strong>Power</strong> Amplifier<br />

(RFPA1002)<br />

Figures 4a - 4f show measured<br />

performance of RFPA1002.<br />

This PA covers 10, 11, and 13<br />

GHz bands of P2P application.<br />

All the measurements are taken<br />

at Vd=6.5, Id (total) =1.07A<br />

unless otherwise noted. Figures<br />

4d - 4f show some of the important<br />

performance plots of this<br />

PA. Figure 4a shows gain versus<br />

frequency behavior over<br />

temperature and Figure 4b<br />

shows OIP3 versus frequency at<br />

drain voltage from 4 to 7V, 0.5<br />

step for single carrier level<br />

(SCL) P OUT<br />

= 17dBm (or 20 dBm<br />

total power).<br />

Table 1 shows DC power dissipation<br />

corresponding to<br />

Figure 4b. Figure 4c shows<br />

OIP3 improvement with the<br />

increase in DC power dissipation<br />

from 6.8 W to 8.5 W, it<br />

shows > 1.5 dBm improvement<br />

in OIP3 especially at lower frequency<br />

and for P OUT<br />

= 25dBm/<br />

SCL. The main reason for this<br />

improvement could be due to<br />

slightly mismatched IM3 loadline<br />

between simulation and<br />

measured device output load.<br />

Figures 4d - 4f show measured<br />

performance of the PA as a<br />

VGA. PA gain has been varied<br />

using gate bias. Figure 4d shows<br />

variation of OIP3 versus gain,<br />

total gain was varied about 15<br />

dB and OIP3 was measured at<br />

constant input power=-15dBm/DCL. Figure 4e shows<br />

how gain varies with Vg. A >15dB gain dynamic range<br />

has been achieved by adjusting gate bias. Figure 4f<br />

shows change in DC power dissipation with variation of<br />

36 <strong>High</strong> <strong>Frequency</strong> <strong>Electronics</strong>


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<strong>High</strong> <strong>Frequency</strong> Design<br />

<strong>Power</strong> Amps<br />

gain or drain current. Since Vg is varied to get VGA<br />

function, drain current varies with Vg.<br />

Performance of 14.4 - 15.4 GHz <strong>Linear</strong> <strong>Power</strong> Amplifier<br />

(RFPA1003)<br />

Figures 5a - 5f show measured performance of<br />

RFPA1003. This is designed for 15 GHz band applications.<br />

All the measurements are taken at Vd=7.5, Id<br />

(total) =1.05A unless otherwise noted. Figure 5a shows<br />

gain versus frequency performance and for entire band<br />

~25dB gain has been achieved. Figure 5b shows IM3<br />

plots with frequency for P OUT<br />

= 17/22 and 25dBm SCL.<br />

This PA demonstrates very high IM3 ~50dBc at P OUT<br />

=<br />

17dBm/SCL and >32dBc at P OUT<br />

= 25dBm/SCL, which is<br />

a key parameter for a linear PA. Figure 5c shows OIP3<br />

versus frequency at P OUT<br />

=17/22/25dBm/SCL. Figure 5d<br />

is a plot of P1dB and P3dB versus frequency for PA<br />

when PA bias was tuned for best IM3 or OIP3. If the PA<br />

38 <strong>High</strong> <strong>Frequency</strong> <strong>Electronics</strong><br />

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<strong>High</strong> <strong>Frequency</strong> Design<br />

<strong>Power</strong> Amps<br />

needs to be used as a saturated amplifier, P1dB and<br />

P3dB performance can be improved by tuning bias condition<br />

as a saturated amplifier. Figures 5e and 5f show<br />

performance of the PA as a VGA. PA gain has been varied<br />

using gate bias.<br />

Performance of 17.7 - 19.7 GHz <strong>Linear</strong> <strong>Power</strong> Amplifier<br />

(RFPA1702)<br />

Figures 6a - 6f show measured performance<br />

RFPA1702. This PA covers 18 GHz band of P2P radio<br />

application. All the measurements are taken at Vd=5.5,<br />

Id (total) =1.3A unless otherwise noted. Figures 6a - 6c<br />

show the PAs gain and OIP3 (at P OUT<br />

=+15 and +24dBm/<br />

SCL) versus frequency behavior over temperature.<br />

Figure 6c shows P1dB and P3dB behavior of the PA<br />

when biased to achieve best IM3 performance. Figures<br />

6e - 6f show performance of the PA as a VGA. PA gain<br />

has been varied using gate bias.<br />

P OUT<br />

= 22/21 and 20<br />

dBm for the various<br />

bands. P1dB and<br />

Psat was measured<br />

under best IM3 tuned<br />

case, if the amp needs<br />

to be used as a saturated<br />

amplifier a different<br />

biasing scheme<br />

can be used for better<br />

P OUT<br />

performance at<br />

the cost of IM3/OIP3.<br />

All PA designs incorporate<br />

on-chip package<br />

compensation<br />

networks for good I/O<br />

match and are packaged<br />

in a low-cost 6 x<br />

6 ceramic package for<br />

better thermal performance.<br />

Due to<br />

superior IM3/OIP3<br />

performance of these PAs, they are well suited for high<br />

data rate and complex modulation systems.<br />

About the Authors:<br />

The authors work at RFMD, where Sushil Kumar is<br />

Director, Engineering; Kent Story is a Staff Design<br />

Engineer; Ron Kielmeyer is a Staff Design Engineer;<br />

Tariq Lodhi is a Senior Design Engineer; and Ian<br />

Hardcastle is a Staff Design Engineer.<br />

References:<br />

1. http://www.rfmd.com/CS/Documents/<br />

RFPA1002DS.pdf<br />

2. http://www.rfmd.com/CS/Documents/<br />

RFPA1003DS.pdf<br />

3. http://www.rfmd.com/CS/Documents/<br />

RFPA1702DS.pdf<br />

Conclusion<br />

The performance of RFMD’s linear power<br />

amplifiers is summarized in Table 2. These PAs<br />

demonstrate high gain and high IM3/OIP3 values<br />

at high P OUT<br />

(total) = 28 dBm for 10, 11, 13,<br />

and 15 GHz band applications. For 18, 23, and<br />

26 GHz bands, the IM3/OIP3 was measured at<br />

P OUT<br />

(total) = 27 and 26 dBm. These PAs show<br />

very good performance as VGAs and, by adjusting<br />

gate bias, a gain dynamic range of >15 dB<br />

can be achieved. These PAs maintain decent<br />

IM3/OIP3 performance, a much desired feature<br />

to dynamically adjust power consumption of a<br />

PA. IM5 performance of the PAs is >60 dBc at<br />

Table 2 • Summary of RFMD’s <strong>Linear</strong> <strong>Power</strong> <strong>Amplifiers</strong>.<br />

40 <strong>High</strong> <strong>Frequency</strong> <strong>Electronics</strong>


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Design Notes & Market Reports<br />

​Wireless Sensor Network Market to<br />

Exceed 80M Units Shipped<br />

The wireless sensor network market, led by ZigBee,<br />

grew ten-fold from 2007 to 2010 and exceeded 45 million<br />

annual shipments in 2011. “Strong growth is expected for<br />

2012 and beyond as ZigBee pervades the home automation<br />

and home entertainment markets, while Smart Meters<br />

continue to be rolled out across the globe,” commented<br />

Peter Cooney, wireless connectivity practice director.<br />

Smart metering is the largest market for ZigBee in<br />

2012 and will continue to be the major market growth<br />

driver as global roll outs of smart meters continue apace.<br />

ZigBee/RF4CE use in the home environment will also be a<br />

major growth driver. Home automation and home entertainment<br />

together are forecast to grow to over $300 million<br />

per annum by 2017.<br />

“Until quite recently ZigBee/RF4CE has been the lead<br />

choice for interoperable low power wireless connectivity in<br />

the home automation and home entertainment markets,<br />

and one look at the ZigBee Alliance’s website shows the<br />

breadth of equipment suppliers that have developed products<br />

using the technology,” added Cooney. “However, the<br />

introduction of Bluetooth Smart is set to disrupt what<br />

could have been an almost monopoly in the low power connectivity<br />

space,” he said.<br />

Proprietary wireless technology is expected to continue<br />

to dominate many markets for at least the next five years;<br />

however, the market is changing. The move from IR to RF<br />

remote controls and the increasing need for interoperability<br />

between “hub” devices and sensor “nodes” are two main<br />

factors driving growth for standards based low power connectivity<br />

such as ZigBee/RF4CE and Bluetooth Smart.<br />

There will be a battle over the coming years with each<br />

technology finding its own niches. In the longer term lowpower<br />

Wi-Fi could also be a major competitor.<br />

Competition from other technologies will have a major<br />

effect on ZigBee/RF4CE growth in the coming years.<br />

However, the ability to have almost unlimited node counts<br />

within a ZigBee system will help drive growth where other<br />

technologies compete (e.g. large building automation systems).<br />

So, while previously robust industry forecasts might<br />

not be met, Zigbee/RF4CE still has a lot of room to grow.<br />

—ABI Research<br />

abiresearch.com<br />

GaAs Epitaxial Substrate Production<br />

Registers Small Gains<br />

Continuing growth in demand for handset power<br />

amplifiers offset a shift away from GaAs technology for<br />

handset switches in 2011. The result of these two opposing<br />

trends was growth of GaAs epitaxial substrate production<br />

of nearly 3 percent. Despite this small increase in production,<br />

the overall value of the GaAs epitaxial substrate<br />

market grew by 19 percent.<br />

However, Strategy Analytics believes the disruptions<br />

caused by the 2011 earthquake and tsunami in Japan temporarily<br />

increased substrate pricing and this revenue<br />

growth is not sustainable. Strategy Analytics has recently<br />

released a spreadsheet model and Forecast and Outlook<br />

report from their GaAs and Compound Semiconductor<br />

Technologies Service (GaAs) entitled “Markets for Semiinsulating<br />

GaAs Epitaxial Substrate Markets: 2011-2016”.<br />

This report forecasts that total demand for semi-insulating<br />

(SI) GaAs epitaxial substrates from manufacturers such as<br />

IQE, VPEC, Kopin, RFMD, Hitachi Cable, Intelliepi and<br />

Sumitomo reached slightly more than 30382-kilo square<br />

inches (ksi) in 2011. The report estimates that this demand<br />

resulted in nearly $601.5 million in revenues. The forecast<br />

indicates demand will continue to show slow growth,<br />

reaching nearly 35490 ksi by 2016. With disruptions in the<br />

supply chain easing, the report forecasts that substrate<br />

price erosion will return to a more conventional profile and<br />

GaAs epitaxial revenue will decline to $544 million in<br />

2016.<br />

“The small growth in overall GaAs epitaxial substrate<br />

production in 2011 masked two more significant trends,”<br />

noted Eric <strong>High</strong>am, Director of the Strategy Analytics<br />

GaAs and Compound Semiconductor Technologies Service<br />

(GaAs). “MOCVD material production increased sharply,<br />

fueled by growth in HBT-based handset PAs. Nearly offsetting<br />

this growth completely was a sharp decline in production<br />

of wafers using MBE epitaxy.”<br />

Asif Anwar, Director in the Strategy Analytics Strategic<br />

Technologies Practice (STP) added, “The chief use of GaAs<br />

MBE wafers has been for HEMT devices in handset<br />

switching applications but device manufacturers have<br />

been moving away from GaAs for these switches. We<br />

believe the bulk of this technology conversion is complete<br />

and the MBE market will return to slow growth.”<br />

—Strategy Analytics<br />

strategyanalytics.com<br />

Growing Use of RFID in Modernizing<br />

Applications<br />

​Companies, governments, and industries are increasingly<br />

turning to RFID as they look to modernize their<br />

operations, becoming more efficient and enabling quicker,<br />

more convenient service. The traditional uses of RFID for<br />

the identification of animals, people, and within the automotive<br />

sector are continuing to grow and are projected to<br />

increase by $2.8 billion from 2012 to 2017. However, ABI<br />

Research’s new RFID Market Tracker found that modern-<br />

42 <strong>High</strong> <strong>Frequency</strong> <strong>Electronics</strong>


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Design Notes & Market Reports<br />

izing RFID applications will grow twice as fast with<br />

annual revenues derived from these jumping by $4.5 billion<br />

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Asset tracking, supply chain management, baggage<br />

and cargo tracking, RTLS, contactless payment, and<br />

ticketing are all areas in which businesses are looking to<br />

operate in a quicker, smarter, and more secure manner.<br />

Practice director John Devlin said, “Despite the general<br />

economic malaise affecting much of the world, solutions<br />

and technologies that can deliver savings and provide<br />

wider benefit will attract investment. The business model<br />

and use case for RFID is now being better understood and<br />

real-world ROI can be demonstrated in a growing number<br />

of instances.”<br />

The need to be able to improve manufacturing and supply<br />

chain efficiencies, as well as track and identify components,<br />

products, and assets is now being considered in a<br />

growing range of market sectors. The ability to add and<br />

implement greater security is another factor driving the<br />

growing adoption of RFID in both traditional and new<br />

applications.<br />

Devlin added, “There will be an increasing need for<br />

companies and, in particular government organizations,<br />

to be able to track and authenticate their in-house assets<br />

and equipment as well as items and products provided<br />

and sold. Think of the supply of food and pharmaceutical<br />

products, as well as consumer electronics and automotive,<br />

from the farm or point of manufacture and onto consumption<br />

and use. Similarly the installation and maintenance<br />

of large projects, e.g. transportation and utilities, are of<br />

critical importance. We expect to see increasing use of<br />

RFID ahead of alternative solutions to provide this audit<br />

trail.”<br />

—ABI Research<br />

abiresearch.com<br />

RF Feeder Cable Market Analysis<br />

EJL Wireless Research is announcing the second edition<br />

of its global RF feeder cable market analysis titled<br />

“Global BTS Transmission Feeder Cable Analysis and<br />

Forecast, 2012-2016.” The RF feeder cable is the primary<br />

solution that interfaces the traditional tower bottom macro<br />

cell BTS cabinet to the BTS antenna.<br />

“The market dropped 13.6% year over year in total<br />

volumes (measured in km of cables) in 2011.<br />

The 1/2” diameter feeder cable segment replaced the<br />

7/8” diameter segment as the largest in shipment volumes<br />

in 2011 however the 1 1/4” or greater diameter feeder cable<br />

segment remained the largest in revenues in 2011.<br />

Aluminum cable product shipments picked up share overall<br />

in 2011 due to emerging markets demand and higher<br />

copper pricing” said founder and President, Earl Lum.<br />

Weak end market demand in Asia Pacific (China), Latin<br />

America and Africa offset strong demand in India in 2011.<br />

“We estimate a net decline in BTS feeder cable shipments<br />

over the next five years as migration to tower top<br />

RRU BTS site architectures will force the replacement of<br />

coaxial feeder cables with fiber optic cables. We see a<br />

potential growth year in 2013 due to a stronger decline in<br />

2012 than in 2011 as demand is being pushed out. While<br />

RF cables will still be required for the transmission line<br />

connection from the RRU port to the antenna port, the<br />

much shorter lengths will alter the economic viability of<br />

the feeder cable market,” said Lum.<br />

—EJL Wireless Research<br />

ejlwireless.com<br />

Small Cell Shipments to Reach 8.6<br />

Million Units by 2017<br />

The Strategy Analytics Wireless Operator Strategies<br />

(WOS) report, “Small Cell Market Outlook 2012 – 2017—<br />

Seven Market Opportunities Quantified” predicts that<br />

Public Femto Cells will ship in the greatest volume in 2013<br />

and 2014 until Pico Cells overtake them in 2015. From<br />

2016 Metro Cells are expected to ship over 1 million units<br />

a year while Public Femto Cells will ship over 2 million<br />

and Pico Cells over 3 million.<br />

The report forecasts global shipments by region and<br />

cell type from 2012 to 2017.<br />

“Regionally, Asia Pacific is projected to be the largest<br />

market for small cells with over 12 million shipments<br />

between 2013 and 2017,” commented Guang Yang,<br />

Beijing-based Senior Analyst for Wireless Operator<br />

Strategies. “Over 2 million of the cumulative Asia Pacific<br />

shipments are expected to be Metro Cells, but over 5.5<br />

million will be Pico Cells and another 4.5 million Public<br />

Femto Cells.”<br />

The report further evaluates the market opportunity<br />

for specific applications, presenting not only total shipment<br />

numbers but also forecasts of the Served Available<br />

Market (SAM) for seven Use Cases to enable mobile<br />

operators to match the right type of small cells to specific<br />

requirements. Sue Rudd, Strategy Analytics Director,<br />

Service Provider Analysis, noted “The Use Case requirements<br />

span from overloaded urban ‘Hot Zones’ to Macro<br />

Cells needing range extension to sites with sporadic traffic<br />

peaks like football stadiums.” She adds, “This analysis<br />

will help operators and infrastructure vendors to develop<br />

business plans that optimize small cell technology for<br />

each Use Case over the next 5 years and to penetrate<br />

these huge markets in the decade beyond.”<br />

—Strategy Analytics<br />

strategyanalytics.com<br />

44 <strong>High</strong> <strong>Frequency</strong> <strong>Electronics</strong>


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Cable Assemblies<br />

FCI developed a QSFP+ based<br />

(quad small form-factor pluggable)<br />

active optical cable assembly that<br />

meets Infiniband® Compliance<br />

Testing requirements. The<br />

XLerate <strong>High</strong> Speed I/O active<br />

optical cable assembly is fully compliant<br />

to the Infiniband FDR<br />

(Fourteen Data Rate - 14 Gb/s per<br />

channel) specification, and is now<br />

on the Infiniband Trade Association<br />

(IBTA) Integrator’s List.<br />

FCI<br />

fci.com<br />

applications. They can be configured<br />

as cable-and-antenna analyzers,<br />

spectrum analyzers, vector network<br />

analyzers, or all-in-one combination<br />

analyzers. Each compact,<br />

6.6-pound package is available in 9,<br />

14, 18 or 26.5 GHz.<br />

Agilent Technologies Inc.<br />

agilent.com<br />

circuit board connector. The SBS75x<br />

connector family was created to<br />

provide a touch-safe and high power<br />

connector with two primary and<br />

four auxiliary power positions in a<br />

compact and ergonomic design. The<br />

addition of the PCB connector<br />

expands the family’s capability to<br />

include PCB-to-wire and wire-towire<br />

applications. The patented<br />

dual pole connector provides two<br />

power contacts rated 105 amps and<br />

four auxiliary power contacts for<br />

applications requiring signal or low<br />

power capability up to 20 amps.<br />

Anderson <strong>Power</strong> Products<br />

andersonpower.com<br />

Amplifier<br />

The TVA-82-213 is an instrument<br />

amplifier that covers an exceptionally<br />

wide range of frequencies while<br />

affording convenience, portability,<br />

and ease of use. Key features: ultra<br />

wide frequency range, 0.8 - 21 GHz;<br />

excellent isolation, 75 dB typical;<br />

self-contained power supply with<br />

selectable 110 or 220 volts AC supply;<br />

thermally self-protected.<br />

Mini-Circuits<br />

minicircuits.com<br />

Field Analyzers<br />

Agilent Technologies announced 14<br />

FieldFox handheld analyzers that<br />

deliver benchtop-instrument accuracy<br />

in field-test environments. The<br />

analyzers cover satellite communications,<br />

microwave backhaul, military<br />

communications, radar systems<br />

and a wide range of additional<br />

Connector<br />

The 7 mm interface is a hermaphroditic<br />

precision coaxial connector<br />

available in panel mount, cable<br />

mount and between-series adapter<br />

configurations. Constructed of polished<br />

passivated 303 stainless steel<br />

coupling mechanisms and outer<br />

shells with gold plated beryllium<br />

copper inner contacts, the 7 mm<br />

operates over a DC to 18 GHz frequency<br />

range. Panel mount offers<br />

solid probe contact and extended<br />

dielectrics and tab contacts. Cable<br />

connectors are available for .141<br />

and .250 inch diameter semi-rigid<br />

as well as popular high-frequency<br />

low-loss flexible cables. Adapters to<br />

2.4 mm, 2.9 mm, 3.5 mm, SMA,<br />

SSMA, N Type and TNC connector<br />

types are all standard and available<br />

for immediate shipment.<br />

SGMC Microwave<br />

sgmcmicrowave.com<br />

PCB Connector<br />

Anderson <strong>Power</strong> Products introduced<br />

a new right angle printed<br />

Transceiver<br />

Texas Instruments introduced the<br />

highest-performance 3.3-V RS485<br />

transceivers with IEC electrostatic<br />

discharge (ESD) protection available<br />

in speed grades up to 50 Mbps.<br />

The 250-kbps SN65HVD72,<br />

20-Mbps SN65HVD75 and 50-Mbps<br />

SN65HVD78 perform better than<br />

the competition across all key performance<br />

areas, including power,<br />

ESD and hysteresis, offering a tailored<br />

solution for designers using<br />

RS485 transceivers in harsh, noisy<br />

industrial applications.<br />

Texas Instruments<br />

ti.com<br />

46 <strong>High</strong> <strong>Frequency</strong> <strong>Electronics</strong>


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IF/RF MICROWAVE COMPONENTS<br />

499 rev C


<strong>High</strong> <strong>Frequency</strong> Products<br />

NEW PRODUCTS<br />

Filter<br />

RLC <strong>Electronics</strong> introduced a waveguide<br />

filter designed to cover a narrow<br />

frequency band in order to<br />

facilitate point-to-point routing of<br />

data over the network. Units maintain<br />

low loss and high rejection.<br />

This product covers narrow<br />

frequency bands above both 18 GHz<br />

and 26.5 GHz. Typical application<br />

would be to interconnect transmitters<br />

and receivers (transceivers)<br />

with antennas.<br />

RLC <strong>Electronics</strong><br />

rlcelectronics.com<br />

Converter<br />

Analog Devices Inc. introduced the<br />

first in a series of ultra-low-power,<br />

12-bit, 1-MSPS SAR (successive<br />

approximation register) A/D converters<br />

with internal 2.5-V reference.<br />

It is designed for USB or battery<br />

powered data acquisition modules,<br />

handheld meters, field instruments,<br />

energy harvesting applications<br />

and medical devices. The<br />

device dissipates over 70 percent<br />

lower power than the closest SAR<br />

A/D converter competitor, in a package<br />

that is 33 percent smaller than<br />

competing 12-bit converters with<br />

internal reference.<br />

Analog Devices Inc.<br />

Analog.com<br />

Get info at www.HFeLink.com<br />

48 <strong>High</strong> <strong>Frequency</strong> <strong>Electronics</strong><br />

Field Analyzer<br />

AR RF/Microwave Instrumentation<br />

introduced a series of Field<br />

Analyzers that represent a new<br />

patent-pending approach to more<br />

accurately measure modulated<br />

electric fields as well as CW electric<br />

fields. This approach uses an isotropic<br />

field sensor to sample the composite<br />

field and transmit its amplitude<br />

digitally over optical fiber to a<br />

processor unit. The sample rate of<br />

is 1.5 million samples per second—<br />

significantly faster than conventional<br />

RF field probes—enabling it<br />

to accurately measure pulsed electric<br />

fields in the micro-second<br />

range.<br />

AR RF/Microwave Instrumentation<br />

arworld.us<br />

Upconverter<br />

Comtech Xicom Technology, Inc.<br />

introduced a new compact, lightweight<br />

and highly efficient solidstate<br />

Ku-band block up converter<br />

(BUC) designed for transportable<br />

satellite communications uplinks.<br />

The XTS-40KHE-B1 offers 40 Watts<br />

of P1 output power and 20 Watts of<br />

linear power. Breakthroughs in efficiency<br />

enable the self-cooled, feedmountable<br />

amplifier to consume<br />

only 210 Watts when operated at<br />

linear power.<br />

Comtech Xicom Technology<br />

xicomtech.com<br />

Amps<br />

TriQuint’s latest amplifier products<br />

offer high performance and<br />

packaged convenience for easier<br />

assembly. The new amplifiers<br />

include the TGA2501-GSG (6-18<br />

GHz); the TGA2554-GSG (8-11


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IW designs and manufactures high performance microwave cable and cable<br />

assemblies for both military and commercial markets. Applications include<br />

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counter measures, missile systems, UAV applications, avionics and instrumentation,<br />

fire control systems, medical electronics, and geophysical exploration.<br />

We offer a wide variety of products providing extremely low attenuation at<br />

frequencies up to 67 GHz and ranging from .050 inch to 0.50 inch in diameter.<br />

Our unique PTFE lamination process, combined with our high performance shield<br />

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IW’s broad range of microwave cables and connectors assures every customer the<br />

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Our major products include:<br />

• Low-loss microwave cables optimized for use to 11, 18, 26.5, 40, 50, and 67 GHz<br />

• Microwave cable assemblies with connectors for SMA, TNC, N, SC, 7/16,<br />

1.85mm, 2.4mm, 2.92mm, 3.5mm, 7mm, ZMA, SMP, SMPM & more<br />

• RE-FLEX TM semi flexible assemblies<br />

• TUF-FLEX TM assemblies – improved crush resistance without using armor<br />

• Water-blocked cables for submarines<br />

• Composite cables – combination microwave/signal/power/data<br />

• PTFE insulated hook-up wires<br />

• Multi-conductor cables<br />

• Dielectric cores<br />

• Twisted pair and triaxial cables<br />

• Low smoke, zero halogen cable jackets<br />

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GHz); and the TGA2536-FL (13-16<br />

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Services Director Tony Balistreri<br />

said, “These devices are part of<br />

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program that offers solutions with<br />

long-standing reliability and<br />

performance in standard packages.<br />

These high-performance devices<br />

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TriQuint Semiconductor<br />

triquint.com<br />

Mixer<br />

Mini-Circuits’ MAC mixers employ<br />

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50 <strong>High</strong> <strong>Frequency</strong> <strong>Electronics</strong><br />

Isolator<br />

Targeting the receive side requirements<br />

for a low loss waveguide<br />

isolator, Renaissance has developed<br />

a product with less than 0.2 dB<br />

insertion loss over 20.1 - 21.2 GHz<br />

from -40 to +85 C. Ensuring more<br />

than 26 dB isolation, the unit<br />

improves system performance considerably.<br />

With a size of 1.5” x 0.88”<br />

x 0.5”, it can handle up to 50 W of<br />

forward and 5 W of reverse power.<br />

Renaissance <strong>Electronics</strong>/HXI<br />

rec-usa.com<br />

Inductors<br />

AVX Corp. added a new series of<br />

multilayer chip inductors designed<br />

for impedance matching, RF chokes,<br />

and high frequency filters to its<br />

expansive portfolio of thin film,<br />

MLO, power, and conical inductors.<br />

Designated the LCMC Series, the<br />

new multilayer chip inductors provide<br />

excellent Q, high SRF, a wide<br />

range of stable and accurate inductances,<br />

and tight tolerances down<br />

to 0.3nH.<br />

AVX Corp.<br />

avx.com<br />

VCO<br />

Crystek’s CVCO55CC-2610-2625<br />

VCO operates from 2610 MHz to<br />

2625 MHz with a control voltage<br />

range of 0.5V~4.5 V. This VCO features<br />

a typical phase noise of -120<br />

dBc/Hz @ 10 KHz offset and has<br />

excellent linearity. Output power is<br />

typically +7 dBm. Engineered and<br />

manufactured in the USA, the


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IF/RF MICROWAVE COMPONENTS<br />

459 rev J


<strong>High</strong> <strong>Frequency</strong> Products<br />

NEW PRODUCTS<br />

model CVCO55CC-2610-2625 is<br />

packaged in the industry-standard<br />

0.5 in. x 0.5 in. SMD package.<br />

Crystek Corp.<br />

crystek.com<br />

Filter<br />

RLC <strong>Electronics</strong> now offers 4th<br />

order tubular Bessel Lowpass<br />

Filters with 3 dB cutoffs from 1<br />

GHz to 22 GHz. Computer design<br />

and tubular construction allow us<br />

to maintain excellent group delay<br />

characteristics with reasonable<br />

rejection while extending our 3 dB<br />

cutoff approaching 30 Giga bits.<br />

These filters should be regarded as<br />

compromise designs for pulsed systems<br />

where truthful reproduction of<br />

the pulse shape is important.<br />

RLC <strong>Electronics</strong><br />

rlcelectronics.com<br />

Synthesizer<br />

The LNS-18 is a general-purpose<br />

synthesizer with outstanding phase<br />

noise performance. Its low noise<br />

oscillators generate a flexible frequency<br />

range up to 18 GHz. With<br />

-132 dBc/Hz at 10 GHz carrier and<br />

20 kHz offset, it is designed to test<br />

components and systems for<br />

demanding applications in military<br />

and aerospace. Optional level control,<br />

pulse modulation, GPIB, and<br />

low frequency extension down to 8<br />

MHz using ultra-low noise frequency<br />

dividers (-165 dBc/Hz) are available<br />

in addition to Ethernet and<br />

EFC input.<br />

Noise XT<br />

noisext.com<br />

digital downconverter option on the<br />

M9703A AXIe eight-channel highspeed<br />

digitizer. The new functionality<br />

enables faster, more flexible<br />

measurements in high-channelcount<br />

applications. In many multiantenna<br />

applications such as radar,<br />

direction-finding and satellite<br />

beam-forming, phase-coherent<br />

acquisition channels are critical for<br />

accurate data acquisition. With a<br />

frequency range of DC to 2 GHz and<br />

a sampling rate of 1.6 GS/s, the new<br />

option provides tuning and zooming<br />

capabilities to analyze these signals<br />

of interest.<br />

Agilent Technologies Inc.<br />

agilent.com<br />

Switch<br />

RFMW Ltd. announced design and<br />

sales support for TriQuint<br />

Semiconductor’s high power RF<br />

switch family. Four models span<br />

frequencies up to 18 GHz and power<br />

levels to 40 W. These SPDT switches<br />

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Get info at www.HFeLink.com<br />

AS 9120<br />

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<strong>High</strong> <strong>Frequency</strong> Products<br />

NEW PRODUCTS<br />

Filter<br />

The AE803NS2065 bandstop filter<br />

has a notch bandwidth of 800 MHz<br />

to 806 MHz; rejection greater than<br />

70 dB; passband on the low side of<br />

the notch of 0 to 750 MHz; passband<br />

on the high side of notch of<br />

850 to 1200 MHz; and passband<br />

insertion loss of less than 3 dB. It<br />

measures 4 x 1.25 x 0.75 in. and<br />

employs Type-N female connectors.<br />

Anatech <strong>Electronics</strong><br />

anatechelectronics.com<br />

Couplers<br />

VidaRF offers a wide selection of<br />

Directional Couplers, Dual<br />

Directional Couplers and Hybrid<br />

Couplers, designed to cover 0.1 GHz<br />

to 20 GHz. Average power from 50<br />

W to 1 kW. Standard coupling values<br />

3, 6, 10, 15, 20, 25 and 30 dB.<br />

Standard Connector type: SMA<br />

female, other connectors available<br />

upon request. VidaRF is a North<br />

Carolina based company that is<br />

focused on being a solutions provider<br />

by building to customer specs<br />

and offering zero days lead time for<br />

custom parts through its stock and<br />

ship program.<br />

VidaRF<br />

vidarf.com<br />

54 <strong>High</strong> <strong>Frequency</strong> <strong>Electronics</strong><br />

Chipsets<br />

TriQuint Semiconductor, Inc. introduced<br />

complete, cost-effective<br />

Ka-band gallium arsenide (GaAs)<br />

RF chipsets to support key requirements<br />

in very small aperture terminal<br />

(VSAT) satellite communications<br />

systems. The family includes a<br />

variable-gain driver amplifier, a 1<br />

Watt GaAs monolithic microwave<br />

integrated circuit (MMIC) power<br />

amplifier, a subharmonic upconverter<br />

and a highly-integrated block<br />

downconverter.<br />

TriQuint Semiconductor, Inc.<br />

triquint.com<br />

Connector<br />

VidaRF is offering Low PIM versions<br />

of the popular 7/16, Type N,<br />

and SMA connector that can deliver<br />

PIM performance as low as -170<br />

dBc. As with all RF components<br />

that VidaRF offers, we are happy to<br />

build to your specifications and provide<br />

delivery in as little as two to<br />

three weeks.<br />

VidaRF<br />

vidarf.com<br />

Divider<br />

Narda Microwave-East introduced<br />

the model 2372A-2, a high-power,<br />

2-way power divider that operates<br />

from 500 MHz to 2.5 GHz, handles<br />

up to 250 W CW input power (2 kW<br />

peak power), and is well suited for<br />

both commercial and military applications.<br />

It has insertion loss of less<br />

than 0.6 dB, amplitude balance of<br />

+/0.25 dB or less, phase balance of<br />

+/-5 deg., isolation of at least 13 dB<br />

from 500 to 700 MHz, and 18 dB<br />

from 700 MHz to 2.5 GHz, and<br />

VSWR of less than 1.5:1. It employs<br />

Type-N female connectors and measures<br />

3.5 in. x 2.5 in. x 1 in.<br />

Narda Microwave-East<br />

nardamicrowave.com<br />

Oscilloscope<br />

The 3000 Series of high–performance<br />

oscilloscopes has expanded<br />

to include six new 4–channel models.<br />

The oscilloscopes offer a maximum<br />

sampling rate of 1 GS/s (up to<br />

10 GS/s effective for repetitive signals),<br />

a range of input bandwidths<br />

from 60 MHz to 200 MHz, and buffer<br />

memory depths from 4 M to 128<br />

M samples. The new Flexi<strong>Power</strong><br />

system allows the scopes to run on<br />

either USB or AC power. With the<br />

option of either a built–in function<br />

generator or a built–in arbitrary<br />

waveform generator, these units<br />

form a complete, portable test bench<br />

in a single unit.<br />

Pico Technology<br />

picotech.com<br />

Sensors<br />

SAGE Millimeter is offering two<br />

new Ka band Doppler and directional<br />

speed sensors. Model SSS-<br />

35307-25M-S1 offers single channel<br />

output for speed sensing only, and<br />

model SSS-35307-25M-D1 offers<br />

speed and direction sensing simultaneously.<br />

The sensors operate at


<strong>High</strong> <strong>Frequency</strong> Products<br />

NEW PRODUCTS<br />

the 35 GHz frequency range with<br />

+7.0 dBm nominal output power.<br />

Typical conversion losses are 6 dB<br />

for single channel and 9 dB for dual<br />

channel. The sensors are equipped<br />

with a microstrip array antenna<br />

which has 5 x 15 degree half power<br />

beamwidth and 25 dBi gain.<br />

SAGE Millimeter<br />

Sagemillimeter.com<br />

We have always known<br />

what we wanted to do...<br />

Mission-critical, high reliability resistive products.<br />

they’re our specialty. For over forty years we<br />

have applied painstaking research, rigid quality<br />

programs,<br />

and hard work<br />

to produce the<br />

world’s most<br />

reliable resistors!<br />

Let us worry<br />

about quality,<br />

reliability<br />

and delivery.<br />

That is what we do.<br />

Waveguides<br />

A.T. Wall’s full line of waveguide<br />

products includes standard and<br />

heavy wall rigid rectangular, circular,<br />

and seamless flexible waveguides.<br />

In addition to tubing, the<br />

company can supply flanges for all<br />

these waveguide types. Waveguide<br />

is offered in copper, bronze, aluminum,<br />

stainless steel, Invar (Nilo<br />

36), Monel, and silver. It is available<br />

in numerous standard shapes,<br />

diameters, and wall thicknesses,<br />

with customization available.<br />

A.T Wall Co.<br />

atwall.com<br />

Cable Builder<br />

Field Components Inc. recently<br />

updated and expanded its coaxial<br />

cable builder. With now over 1 million<br />

combinations available, Field<br />

Components has one of the most<br />

extensive coaxial cable builders<br />

available on the web. Flexible,<br />

Semi-Rigid, Test and LMR cables<br />

are the company’s specialties. Now<br />

also offering custom cable assemblies<br />

up to 110 GHz.<br />

Field Components<br />

fieldcomponents.com<br />

56 <strong>High</strong> <strong>Frequency</strong> <strong>Electronics</strong><br />

State of the Art, Inc.<br />

Resistive PRoducts<br />

Made<br />

in the USA.<br />

Get info at www.HFeLink.com<br />

Cables<br />

Florida RF Labs expanded its line<br />

of stranded center conductor cables<br />

Lab-Flex® S, a modified version of<br />

the Lab-Flex® high performance<br />

flexible cable assemblies. Lab-<br />

Flex® S cables offer higher flexure<br />

rates and durability than solid center<br />

conductor designs. They are<br />

especially well-suited for test setups<br />

in addition to radar and antenna<br />

systems applications requiring


<strong>High</strong> <strong>Frequency</strong> Products<br />

NEW PRODUCTS<br />

Product Showcase<br />

flexible coaxial interconnects that<br />

are subjected to constant motion.<br />

Florida RF Labs<br />

emc-rflabs.com<br />

Coupler<br />

KRYTAR, Inc. announced a directional<br />

coupler offering high performance<br />

over the frequency range of<br />

1.0 to 50.0 GHz in a single, compact,<br />

lightweight package. The new<br />

model is a multi-purpose, stripline<br />

design that exhibits excellent coupling<br />

over the 1.0 to 50.0 GHz frequency<br />

band. Applications include<br />

signal monitoring and measurement,<br />

antenna beam forming, cable<br />

distributed systems, and military<br />

and EMC testing environments.<br />

KRYTAR<br />

krytar.com<br />

Termination<br />

Aeroflex/ Inmet’s improved 50 Watt<br />

terminations are rugged 50 OHM<br />

coaxial units that offer low VSWR<br />

characteristics (1.35:1 @ 12.4 GHz).<br />

Inmet’s TN180-50W series offers<br />

DC-18 GHz broadband performance<br />

ideally suited for lab environments<br />

and high power combiner<br />

systems. The housing is anodized<br />

aluminum with fins for natural<br />

convection. A stainless steel Type N<br />

male or female connector is standard.<br />

Other connector types and<br />

power levels are available.<br />

Aeroflex-Inmet<br />

aeroflex.com<br />

58 <strong>High</strong> <strong>Frequency</strong> <strong>Electronics</strong><br />

30<br />

Years<br />

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Product Showcase<br />

Fast Pulse Test Solutions from AVTECH<br />

Some of our standard models:<br />

AVR-CD1-B Reverse Recovery Test System<br />

AVR-EB4-B: +2A / -4A pulser for diode reverse-recovery time tests<br />

AV-156F-B: +10 Amp constant current pulser for airbag initiator tests<br />

AVO-9A-B: 200 mA, 200 ps rise time driver for pulsed laser diode tests<br />

AV-151J-B: ±400 V, 50 kHz function generator for piezoelectric tests<br />

AVOZ-D2-B: 700 V, 70 A pulser for production testing of attenuators<br />

AVR-DV1-B: 1000 V, variable rise-time pulser for phototriac dV/dt tests<br />

Pricing, manuals, datasheets: www.avtechpulse.com<br />

AVTECH ELECTROSYSTEMS LTD .<br />

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Typical Output Waveform<br />

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avtechpulse.com<br />

www.DudleyLab.com<br />

Page 1 General Test Equip<br />

Page 2 Mini-Circuits<br />

Page 3 <strong>Power</strong> Supplies<br />

Page 4 Oscilloscopes Le Croy<br />

Page 5 RF <strong>Power</strong> Meters<br />

Page 6 Waveguide Parts Section<br />

Page 7 RF Coaxial Parts<br />

Page 8 Manuals Free pdf Download<br />

Page 9 Solid State RF <strong>Amplifiers</strong><br />

Page 10 Tube Type RF Amps TWT<br />

Page 11 Miscellaneous Repair Parts<br />

VOICE: 732.240.6895<br />

EMAIL: hdudley@dudleylab.com<br />

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SURFACE MOUNT FREQUENCY SYNTHESIZERS<br />

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From 2-way through 48-way designs, with 0°, 90°, or 180°<br />

phase configurations, Mini-Circuits power splitters/combiners offer<br />

outstanding performance for insertion loss, isolation, and VSWR.<br />

Decades of experience with multiple technologies make it all possible, from<br />

core & wire, microstrip, and stripline, to semiconductors and LTCC ceramics.<br />

Get easy-to-find, detailed data and performance curves, S-parameters,<br />

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quickly, at minicircuits.com. Just enter your requirements, and our patented search<br />

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Product <strong>High</strong>lights<br />

Switch<br />

Skyworks introduced a very high isolation (>60 db) yet<br />

low loss (0.8 db) single-pole double-throw switch with<br />

integrated 50 Ohm terminations and broadband operation<br />

to 6.0 GHz. The cost-effective SKY13372-467LF targets<br />

cellular infrastructure applications requiring feedback<br />

and filter-bank switching where low loss and high<br />

channel to channel isolation performance is required. The<br />

new switch is also ideal for military communication and<br />

various RF test and measurement applications.<br />

Skyworks Solutions<br />

skyworksinc.com<br />

Switch<br />

RFMW announced design and sales support for the<br />

PE42422 UltraCMOS SPDT RF switch from Peregrine<br />

Semiconductor. This broadband, 100 – 6000 MHz switch<br />

offers typical insertion loss of 0.25 dB @ 1000 MHz with<br />

44 dB isolation. It integrates on-board CMOS control logic<br />

that requires no external components and supports a<br />

wide supply range of 2.3 to 5.5 V. IIP2 of 115 dBm highlights<br />

this switch’s performance. Housed in a 2 x 2mm<br />

QFN package, ESD tolerance is 4kV HBM on the RF pins.<br />

RFMW, Ltd.<br />

rfmw.com<br />

Transmitter<br />

The Model 337 <strong>Power</strong> MOSFET Modulator, Magnetron<br />

Transmitter is designed to operate magnetrons up to 500<br />

kW. The continuously variable pulse width range is 0.15<br />

to 2.0 microseconds or greater at PRF up to 5 kHz.<br />

Maximum pulse width is determined by the pulse storage<br />

capacitor value and the magnetron capability. The Model<br />

337 Modulator is not damaged by magnetron arcs. Arc<br />

energy to the magnetron is limited which actually helps<br />

to clean up an arcing magnetron.<br />

Applied Systems Engineering<br />

applsys.com<br />

62 <strong>High</strong> <strong>Frequency</strong> <strong>Electronics</strong>


Get info at www.HFeLink.com


Product <strong>High</strong>lights<br />

<strong>Power</strong> Amp<br />

TriQuint Semiconductor announced a new Multi-band, Multi-mode <strong>Power</strong><br />

Amplifier (MMPA) that simplifies the increasingly complex RF front-end for<br />

next-generation global 3G/4G smartphones and other mobile devices. The compact,<br />

highly integrated TRIUMF MMPA achieves best-in-class power-added<br />

efficiency, providing up to 15 percent more browsing time.<br />

TriQuint Semiconductor<br />

triquint.com<br />

SMi’s 14th Annual<br />

C O N F E R E N C E & E X H I B I T I O N 2 0 1 2<br />

Europe’s Leading Military Communications Event<br />

for Satellite Professionals<br />

Tuesday 27th November - Thursday 29th November 2012,<br />

Millennium Conference Centre, London, UK<br />

MILITARY AND GOVERNMENT SPEAKERS INCLUDE<br />

Brigadier General Pitre R.R, Director General<br />

Space, Canadian Forces<br />

Cindy Moran, Director of Network Services,<br />

Defence Information Systems Agency<br />

Commander Martin Walker, Deputy Inspector<br />

General Evaluation, NZDF<br />

Masayuki Iwaike, Director of Missile Defence<br />

and Space Policy, Defence Policy Division,<br />

Ministry of Defence, Japan<br />

Lieutenant Colonel Holger Luschow,<br />

Bundeswehr Military Satellite System,<br />

German MoD<br />

Colonel Andrew Weate, Chief Architecture and<br />

Analysis Division J9, USAF<br />

Controller<br />

Analog Devices, Inc. introduced the ADP1851 wideinput-range,<br />

synchronous, step-down DC-to-DC controller<br />

with voltage tracking and synchronization capability. The<br />

versatile ADP1851/53 can be configured to work as a<br />

voltage-mode controller with input feed-forward or as a<br />

current-mode controller, depending on the application<br />

and customer preference. The units are designed for high<br />

efficiency, high current, fast, transient point-of-load applications<br />

in a broad range of communications networking,<br />

industrial, medical, and consumer applications.<br />

Analog Devices, Inc.<br />

analog.com<br />

PRE-CONFERENCE WORKSHOP HOSTED BY COBHAM<br />

26TH NOVEMBER 2012 | 13.00-17.00<br />

What is the Future for Broadband Tactical<br />

Satellite Communications?<br />

LEAD SPONSOR<br />

64 <strong>High</strong> <strong>Frequency</strong> <strong>Electronics</strong><br />

GOLD SPONSORS:<br />

In Association with:<br />

www.globalmilsatcom.com<br />

James Hitchen on +44 (0)20 7827 6054<br />

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Get info at www.HFeLink.com<br />

<strong>Power</strong> Amps<br />

The HMC994LP5E is a GaAs MMIC pHEMT<br />

Distributed <strong>Power</strong> Amplifier that operates between DC<br />

and 28 GHz. It provides 13 dB of gain, +29 dBm of saturated<br />

output power, and 23% PAE from a +10V supply.<br />

With up to +38 dBm Output IP3, it is ideal for high linearity<br />

applications in military and space as well as point-topoint<br />

and point-to-multi-point radios. The HMC998LP5E<br />

is a GaAs pHEMT MMIC Distributed <strong>Power</strong> Amplifier<br />

that operates between 100 MHz and 20 GHz. It provides<br />

11 dB of gain, +41 dBm output IP3, and +31 dBm of output<br />

power at 1 dB gain compression while requiring only<br />

500 mA from a +15V supply.<br />

Hittite Microwave Corp.<br />

hittite.com


P – AgPd<br />

W – Ag<br />

Cu Barrier Layer<br />

Sn Plated Solder<br />

H – Ag<br />

Enhanced Cu Barrier<br />

Sn Plated Solder<br />

Z – Ag<br />

Ni Barrier Layer<br />

SnPd Plated<br />

U – Ag<br />

Ni Barrier Layer<br />

SnPb Plated Solder<br />

E – Ag<br />

Enhanced Ni Barrier<br />

Sn Plated Solder<br />

DLI has been your<br />

global partner for<br />

application specific<br />

microwave and<br />

millimeter wave<br />

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Solder Layer<br />

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Thick Film Termination<br />

Ceramic Material<br />

Engineering teams like to put<br />

our parts through their paces.<br />

When design engineers told us<br />

they’d like a termination that<br />

would allow them the freedom<br />

to use harsh solder profiles and<br />

multiple reworks, we listened!<br />

DLI has qualified enhanced<br />

versions of its RoHS compliant<br />

terminations designed to<br />

handle both the rigors of the<br />

test bench and the production<br />

floor with ease. The enhanced<br />

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Product <strong>High</strong>lights<br />

Filters<br />

RLC <strong>Electronics</strong>’ Customized Band Reject Filters are<br />

designed to operate over the frequency range of 10 to<br />

12,000 MHz. These filters are characterized by having the<br />

reverse properties of band pass filters. The filters are<br />

available in compact sizes and are constructed to operate<br />

over the most severe military environmental conditions.<br />

The 3 dB band reject band-widths may be chosen from 0.5<br />

to 15% of the center frequency. They are available with a<br />

choice of the 2 through 9 sections.<br />

RLC <strong>Electronics</strong><br />

rlcelectronics.com<br />

LadyBug <strong>Power</strong> Sensors:<br />

Because Accuracy Matters<br />

Inductors<br />

Vishay Intertechnology, Inc. launched 10 new IHLP®<br />

low-profile, high-current inductors with extended temperature<br />

ranges to + 155 °C for automotive and commercial<br />

applications. The new -51 and -5A series devices are<br />

offered in 2525, 3232, 4040, 5050, and 6767 case sizes<br />

with low profiles down to 3.0 mm and a wide range of<br />

inductance values from 0.22 µH to 33 µH. With a frequency<br />

range up to 1 MHz, the devices released today<br />

serve as high-performing, space- and power-saving solutions<br />

for voltage regulator module (VRM) and DC/DC<br />

converter applications.<br />

Vishay Intertechnology Inc.<br />

vishay.com<br />

Variation (dB) 0 - 50C<br />

<strong>Power</strong> Sensor Temperature Sensitivity with No Zero<br />

3<br />

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Because Dynamic Range Matters<br />

When LadyBug specs 80dB of dynamic range, you get the<br />

entire 80dB of dynamic range all the time.<br />

Because Time Matters<br />

When LadyBug says you get 2000 measurements per second<br />

- you get one settled measurement every 500 microseconds.<br />

LadyBug Technologies LLC<br />

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Santa Rosa, CA 95404., U.S.A.<br />

T E C H N O L O G I E S L L C<br />

Get info at www.HFeLink.com<br />

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707-546-1050 ext 3 then #<br />

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<strong>Power</strong> Module<br />

Texas Instruments Inc. introduced a new power module<br />

with 65-V transient protection that integrates a DC/<br />

DC converter, inductor and passives in a very small, easyto-use<br />

package. The 2.5-A TPS84250 meets the EN55022<br />

Class B electromagnetic emissions standard and features<br />

frequency synchronization to cleanly power noise-sensitive<br />

analog circuits in test and measurement, industrial<br />

motor control, medical and imaging applications.<br />

Texas Instruments<br />

ti.com<br />

66 <strong>High</strong> <strong>Frequency</strong> <strong>Electronics</strong>


www.highfrequencyelectronics.com<br />

<strong>High</strong> <strong>Frequency</strong> <strong>Electronics</strong> magazine<br />

An effective advertising medium to reach design engineers<br />

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ADVERTISING SALES — WEST<br />

Tim Burkhard<br />

Tel: 707-544-9977, Fax: 707-544-9375<br />

tim@highfrequencyelectronics.com<br />

ADVERTISING SALES — CENTRAL<br />

Keith Neighbour<br />

Tel: 773-275-4020, Fax: 773-275-3438<br />

keith@highfrequencyelectronics.com<br />

PUBLISHER — OTHER REGIONS & INTERNATIONAL<br />

Scott Spencer<br />

Tel: 603-472-8261, Fax: 603-471-0716<br />

scott@highfrequencyelectronics.com


Product <strong>High</strong>lights<br />

Probe Station<br />

The LMS-2709 is a basic, rugged RF (and DC) probe<br />

station for the research of advanced active and passive<br />

components. Useful for educational training of university<br />

students in the discipline of microwave and DC microprobing.<br />

Compatible with magnetic mount ball bearing<br />

microprobing positioners. Positioners compatible with<br />

DC, AC & RF microprobes. Binocular and Trinocular stereo<br />

zoom microscope with 7-30X magnification (included<br />

wide field eyepieces), LED ring Illuminator, precision x-y<br />

stage with isolated and shielded chuck, vacuum hold<br />

down and Z-lift.<br />

J microTechnology<br />

jmicrotechnology.com<br />

Sampling Modules<br />

Agilent Technologies Inc. introduced a 60-GHz remote<br />

sampling head oscilloscope module for engineers who<br />

design, validate and manufacture high-speed electrical<br />

communications systems and components.<br />

The Agilent N1045A 2/4-port electrical remote sampling<br />

head module provides the most economical solution<br />

for accurately characterizing multilane designs used in<br />

today’s new and emerging standards such as IEEE 802.3<br />

ba/bj/bm (40Gb/100Gb Ethernet) and Optical<br />

Internetworking Forum CEI 3.0.<br />

Agilent Technologies<br />

agilent.com<br />

Interconnect System<br />

Samtec’s SEARAY interconnect system offers high<br />

speed performance and the unparalleled grounding and<br />

routing flexibility of the popular .050” (1,27 mm) X .050”<br />

(1,27 mm) open pin field SEARAY, but with a 0,80 mm<br />

(.0315”) micro pitch design that requires 50% less board<br />

space. This real estate-saving high density system is<br />

available in 4 and 6 row designs with up to 180 I/Os (pin<br />

counts to 300 I/Os are in design).<br />

Samtec<br />

samtec.com<br />

68 <strong>High</strong> <strong>Frequency</strong> <strong>Electronics</strong>


Product <strong>High</strong>lights<br />

Driver<br />

Model AMFOD-30K450 is a new optical modulator<br />

driver, suitable for driving Lithium Niobate optical modulators<br />

for OC-768 long haul fiber Optic communications<br />

applications. This unit has a high output drive voltage of<br />

up to 8V, with 30 dB of small signal gain, flat up to 40<br />

GHz with a low frequency cutoff at 80 kHz. It is in a hermetically<br />

sealed package that is 0.31 inch thick by 0.65<br />

inch wide by 1.2 inch long, with straight or bent pin<br />

options. Input and out are with GPPO connectors.<br />

Miteq<br />

miteq.com<br />

Connector<br />

Molex Inc. introduced the robust Brad Micro-Change®<br />

M12 Cat6A connector system designed for vision systems<br />

and other high-speed data transfer applications in harsh<br />

environments. Conforming to TIA and ISO/IEC Cat 6A<br />

specifications for high-speed Ethernet signal integrity up<br />

to 10 Gbps, the high-pin-density Micro-Change connector<br />

system features an innovative x-coding cross-shielding<br />

design (conforms to IEC 61076-2-109) for superior performance<br />

and transmission reliability in frequency bandwidths<br />

up to 500 MHz.<br />

Molex Inc.<br />

molex.com<br />

Attenuators<br />

MECA <strong>Electronics</strong> offers six models of variable step<br />

attenuators with average power ratings of 2 watts (1000<br />

watts peak) available in 0-10 dB in 1 dB steps, 10-70 dB<br />

in 10 dB steps, and 0-30 in 1 dB steps. N-female and SMA<br />

female covering Hz - 2.0 GHz.<br />

MECA <strong>Electronics</strong><br />

e-meca.com<br />

October 2012 69


Advertiser Index<br />

Company Page Company Page<br />

Advanced Switch<br />

Mini-Circuits.............................2, 3<br />

Technology...............................59<br />

Applied Computational<br />

Sciences....................................16<br />

Avtech.......................................59<br />

AWR Corp .................................17<br />

Cernex.......................................48<br />

Coilcraft.....................................11<br />

CDM <strong>Electronics</strong>.......................34<br />

CST.............................................21<br />

C.W. Swift & Associates...........C2<br />

C.W. Swift/SGMC......................39<br />

Damaskos..................................59<br />

Delta <strong>Electronics</strong>......................57<br />

Dielectric Laboratories............65<br />

Dudley Lab...............................59<br />

Emerson Network<br />

<strong>Power</strong>.........................................37<br />

Emerson Network<br />

<strong>Power</strong>........................................C4<br />

Emerson Network<br />

<strong>Power</strong>................................... Insert<br />

IW Microwave...........................49<br />

J microTechnology...................38<br />

LadyBug Technologies............66<br />

<strong>Linear</strong> Technology....................13<br />

<strong>Linear</strong> Technology....................15<br />

Luff Research............................59<br />

MECA <strong>Electronics</strong>.....................19<br />

MegaPhase..............................50<br />

Micro Lambda Wireless.............9<br />

Microwave Components........53<br />

Mini-Circuits...............................23<br />

Mini-Circuits...............................33<br />

Mini-Circuits...............................47<br />

Mini-Circuits...............................51<br />

Mini-Circuits.........................60, 61<br />

Miteq...........................................1<br />

Molex........................................C3<br />

National Instruments..................5<br />

Planar<br />

Monolithics Industries...............43<br />

Precision Connector................31<br />

Relcomm Technologies...........63<br />

RF Bay........................................59<br />

Rogers Corp .............................55<br />

San-tron.....................................45<br />

Satellink.....................................58<br />

Sector Microwave....................58<br />

SGMC Microwave....................27<br />

SMI Group.................................64<br />

State of the Art.........................56<br />

SV Microwave...........................35<br />

Teledyne Storm<br />

Microwave................................41<br />

Temwell Corp ...........................18<br />

Times Microwave<br />

Systems......................................25<br />

VidaRF.........................................7<br />

Wenteq Microwave<br />

Corp ..........................................58<br />

Wilmanco..................................58<br />

The ad index is provided as an additional service by the publisher,<br />

who assumes no responsibility for errors or omissions.<br />

n Find Our Advertisers’ Web Sites using HFeLink<br />

1. Go to our company information Web site:<br />

www.HFeLink.com, or<br />

2. From www.highfrequencyelectronics.com, click on the HFeLink<br />

reminder on the home page<br />

3. Companies in our current issue are listed, or you can choose<br />

one of our recent issues<br />

4. Find the company you want ... and just click!<br />

5. Or ... view our Online Edition and simply click on any ad!<br />

Publisher<br />

Scott Spencer<br />

Tel: 603-472-8261<br />

Fax: 603-471-0716<br />

scott@highfrequencyelectronics.com<br />

Advertising Sales — East<br />

Gary Rhodes<br />

Vice President, Sales<br />

Tel: 631-274-9530<br />

Fax: 631-667-2871<br />

grhodes@highfrequencyelectronics.com<br />

Advertising Sales — west<br />

Tim Burkhard<br />

Associate Publisher<br />

Tel: 707-544-9977<br />

Fax: 707-544-9375<br />

tim@highfrequencyelectronics.com<br />

Advertising Sales — central<br />

Keith Neighbour<br />

Tel: 773-275-4020<br />

Fax: 773-275-3438<br />

keith@highfrequencyelectronics.com<br />

Product Showcase<br />

Joanne Frangides<br />

Tel: 201-666-6698<br />

Fax: 201-666-6698<br />

joanne@highfrequencyelectronics.com<br />

U.K and Europe<br />

Sam Baird<br />

Tel: +44 1883 715 697<br />

Fax: +44 1883 715 697<br />

sam@highfrequencyelectronics.com<br />

U.K and Europe<br />

Zena Coupé<br />

Tel: +44 1923 852 537<br />

Fax: +44 1923 852 261<br />

zena@highfrequencyelectronics.com<br />

<strong>High</strong> <strong>Frequency</strong> <strong>Electronics</strong> (USPS 024-316) is published monthly by Summit Technical Media, LLC, 3 Hawk Dr., Bedford, NH 03110.<br />

Vol. 11 No. 10 October 2012. Periodicals Postage Paid at Manchester, NH and at additional mailing offices.<br />

POSTMASTER: Send address corrections to <strong>High</strong> <strong>Frequency</strong> <strong>Electronics</strong>, PO Box 10621, Bedford, NH 03110-0621.<br />

Subscriptions are free to qualified technical and management personnel involved in the design, manufacture and distribution of electronic equipment<br />

and systems at high frequencies. Copyright © 2012, Summit Technical Media, LLC<br />

70 <strong>High</strong> <strong>Frequency</strong> <strong>Electronics</strong>


2013<br />

EDITORIAL CALENDAR<br />

Regular monthly<br />

columns include:<br />

n In the News<br />

n Meetings & Events<br />

n New Products<br />

n Featured Products<br />

n Design Notes<br />

In addition to the coverage to<br />

the right, each monthly issue will<br />

offer the reader a balanced mix of<br />

subject matter at levels of technical<br />

depth ranging from fundamental<br />

tutorials to advanced theory. Each<br />

month the subject matter is<br />

carefully selected to be both<br />

practical and useful to engineers<br />

who are developing high<br />

frequency and high-speed systems<br />

for applications in wireless and<br />

wireless communications, military<br />

and civilian defense, navigation,<br />

computing, imaging, and more.<br />

Contacts:<br />

Scott Spencer, Publisher<br />

scott@highfrequencyelectronics.com<br />

Tim Burkhard,<br />

Associate Publisher-Managing Editor<br />

tim@highfrequencyelectronics.com<br />

January<br />

Test and Measurement n<br />

Interconnect Technology n Emerging<br />

Technologies<br />

DesignCon n Santa Clara n<br />

January 29 – 30, 2013<br />

February<br />

Active Components n Military<br />

Radar n Government <strong>Electronics</strong><br />

Satellite 2013 n Washington, D.C.<br />

n March 18 – 21, 2013<br />

March<br />

Mixers and Modulators n EDA n<br />

Filters<br />

International Wireless Symposium n<br />

Beijing n April 13 – 18, 2013<br />

April<br />

Passive Components n Cables and<br />

Connectors n Engineering Education<br />

CTIA n Las Vegas n May 21 – 23,<br />

2013<br />

May<br />

Millimeter Waves n <strong>Frequency</strong><br />

Synthesis n IMS 2013 Preview<br />

IMS 2013 n Seattle n<br />

June 2 – 7, 2013<br />

Antennas & Propagation<br />

Symposium n Orlando n<br />

June 7 – 13, 2013<br />

June<br />

Antennas n Integrated Circuits n<br />

Defense <strong>Electronics</strong><br />

July<br />

<strong>Power</strong> <strong>Amplifiers</strong> n Cable<br />

Assemblies and Connectors n EMC<br />

IEEE EMC n Denver n<br />

August 5 – 9, 2013<br />

National Instruments Week n Austin<br />

n August 5 – 9, 2013<br />

August<br />

ICs and Devices n EDA n Active<br />

Components<br />

September<br />

Resistive Products n Design Tools n<br />

EuMW 2013 Preview<br />

EuMW 2013 n Nuremburg n<br />

October 6 – 11, 2013<br />

AOC n Washington n<br />

October 13 – 18, 2013<br />

October<br />

Defense <strong>Electronics</strong> n Control<br />

Components n Cables and<br />

Connectors<br />

Asia Pacific Microwave Conference<br />

n Seoul n November 5 – 8, 2013<br />

MILCOM n San Diego n<br />

November 19 – 21, 2013<br />

November<br />

ISM Technology n <strong>High</strong> <strong>Power</strong><br />

<strong>Amplifiers</strong> n RFICs and MMICs<br />

December<br />

Radio Communications n Signal<br />

Analysis n Software Design<br />

Radio Wireless Week n Austin n<br />

January 20 – 23, 2014<br />

Gary Rhodes, VP Sales<br />

ghrodes@highfrequencyelectronics.com<br />

Tom Perkins, Senior Technical Editor<br />

tom@highfrequencyelectronics.com<br />

<strong>High</strong> <strong>Frequency</strong> <strong>Electronics</strong><br />

One Hardy Road, Ste 203<br />

PO Box 10621 Bedford, NH 03110 603<br />

472 8261 Fax 603 471 0716<br />

Press Releases<br />

Press releases for our informational columns should be sent by the first of<br />

the month prior to the desired publication date (e.g., April 1 for the May<br />

issue). Late-breaking news can be accommodated, but please advise the<br />

editors of urgent items by telephone or e-mail.<br />

tim@highfrequencyelectronics.com<br />

Article Contributions<br />

We encourage the submission of technical articles, application notes and<br />

other editorial contributions. These may be on the topics noted above, or<br />

any other subject of current interest. Contact us with article ideas:<br />

tim@highfrequencyelectronics.com<br />

October 2012 71


Product <strong>High</strong>lights<br />

Synthesizer<br />

The MLBS-Series bench test synthesizers are ideal for<br />

production test sets, laboratory tests and test equipment<br />

racks where generation of microwave signals is essential.<br />

<strong>Frequency</strong> coverage is 2 to 20 GHz. Each bench top synthesizer<br />

consists of a frequency synthesizer, heat sink,<br />

power supply, cooling fans, keyboard, display, USB interface,<br />

Ethernet interface and a manual tuning knob.<br />

Components are housed in a 10” wide, 4” height, 13” deep<br />

enclosure with mounting feet and handle.<br />

Micro Lambda Wireless<br />

microlambdawireless.com<br />

PDA<br />

Texas Instruments introduced the world’s first programmable<br />

differential amplifiers (PDAs). The 2.4 GHz<br />

LMH6881 single-channel PDA and 2.4 GHz LMH6882<br />

dual-channel PDA provide optimized noise, distortion and<br />

bandwidth performance over a 6 dB to 26 dB gain range,<br />

simplifying the way engineers design with differential<br />

amplifiers. Designing systems with PDAs increases flexibility<br />

and significantly reduces design time, solution size<br />

and bill of materials cost for a broad range of applications.<br />

Texas Instruments<br />

ti.com<br />

72 <strong>High</strong> <strong>Frequency</strong> <strong>Electronics</strong>


The choice is clear<br />

for all your RF needs.<br />

Custom solutions and<br />

standard products from<br />

a single source.<br />

With decades of experience in the<br />

interconnect industry, we know<br />

what’s important to engineers.<br />

That’s why Molex manufactures<br />

the world’s broadest line of radio<br />

frequency connectors, cable<br />

assemblies and custom products.<br />

Our RF solutions can be optimized<br />

to minimize signal loss over a<br />

wide range of frequencies in a<br />

broad spectrum of sizes and styles<br />

of connectors. Plus, our serviceoriented<br />

team can turn around<br />

drawings in 48 hours and deliver<br />

custom products in less than eight<br />

weeks –– so you can get your<br />

products to market faster.<br />

For the industry’s largest array of<br />

product options backed by reliable<br />

service, turn to Molex –– your<br />

clear choice for RF interconnect<br />

products and solutions.<br />

www.molex.com/product/rf.html<br />

Get info at www.HFeLink.com


It’s your<br />

move.<br />

Make the right one.<br />

Emerson Network <strong>Power</strong> and the Emerson Network <strong>Power</strong> logo are trademarks<br />

and service marks of Emerson Electric Co. ©2011 Emerson Electric Co.<br />

Emerson Connectivity Solutions offers the Midwest Microwave product line of passive coaxial microwave<br />

components that are known for their precision performance and high quality and meet the precise requirements<br />

of the RF/Microwave industry. Our broad product portfolio includes: Attenuators, Precision<br />

Adapters, Terminations, DC Blocks, <strong>Power</strong> Dividers, Couplers, Equalizers, Phase Shifters, Connectors, and<br />

Test Cables that are designed and manufactured for both military and commercial applications. Midwest<br />

Microwave also offers a wide variety of Qualified Product List (QPL) approved products in the M3933,<br />

M39030 and M39012 series, as well as many DESC/DSCC approved models.<br />

Make the right move with Midwest Microwave from Emerson Connectivity Solutions.<br />

EmersonConnectivity.com<br />

Toll free: 800-247-8256<br />

Phone: 507-833-8822<br />

EMERSON. CONSIDER IT SOLVED.

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