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1 - Schneider Electric SNB

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Solutions / Malfunctions<br />

PROPOSED ACTIONS (CONTINUED)<br />

output(s), etc.).<br />

On the INTERFERING equipment<br />

See common section.<br />

(1) Ensure “LF” and “HF” equipotential bonding of exposed conductive parts.<br />

Recommended<br />

implementation (cont'd)<br />

(See chapter 2)<br />

(p. 8)<br />

The power supply<br />

(2) Avoid propagation of interference upstream of interfering equipment.<br />

==> Use separate power supply lines and if necessary separate power sources to ensure<br />

effective “HF” decoupling (double screen transformer, filters, etc.).<br />

See common section.<br />

The equipment<br />

(3) Limit the radiation of interfering equipment.<br />

==> Assemble the equipment in housing(s) that provide(s) adequate shielding (cabinet,<br />

casing, etc.)<br />

See common section.<br />

The associated cables<br />

(4) Limit the flow of interference upstream of the installation:<br />

==> Set up decoupling systems (R, L, C), ferrite cores or suitable filters on the inputs and/<br />

or outputs of the devices.<br />

See common section.<br />

(p. 18 and 52)<br />

(p. 32, 36, 52, 56,<br />

60 and 62)<br />

1<br />

2<br />

3<br />

4<br />

--- Class: non-standardised term adopted for the purposes of this document. ---<br />

5<br />

11 Te

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