KX-TG6122LAT KX-TG6123LAT KX-TGA610LAT - Panasonic

ORDER NO. KM40902828CE 

Telephone Equipment 

Model No. KX-TG6121LAT 

KX-TG6122LAT 

KX-TG6123LAT 

KX-TGA610LAT 

5.8 GHz Expandable Digital Cordless 

Answering System 

T:Black Metallic Version 

(for Latin America) 

© Panasonic Communications Co., Ltd. 2009. Unauthorized 

copying and distribution is a violation of law.

KX-TG6121LAT/KX-TG6122LAT/KX-TG6123LAT/KX-TGA610LAT 

2

TABLE OF CONTENTS 

PAGE 

1 Safety Precautions----------------------------------------------- 4 

1.1. For Service Technicians --------------------------------- 4 

2 Warning-------------------------------------------------------------- 4 

2.1. Battery Caution--------------------------------------------- 4 

2.2. About Lead Free Solder (PbF: Pb free)-------------- 4 

2.3. Discarding of P. C. Board-------------------------------- 5 

3 Specifications ----------------------------------------------------- 6 

4 Technical Descriptions ----------------------------------------- 7 

4.1. FHSS Description ----------------------------------------- 7 

4.2. Explanation of Link Data Communication ----------10 

4.3. Block Diagram (Base Unit_Main)---------------------11 

4.4. Block Diagram (Base Unit_RF Part)-----------------12 

4.5. Circuit Operation (Base Unit)--------------------------13 

4.6. Block Diagram (Handset)-------------------------------21 

4.7. Block Diagram (Handset_RF Part)-------------------22 

4.8. Circuit Operation (Handset)----------------------------23 

4.9. Circuit Operation (RF Part)-----------------------------27 

4.10. Circuit Operation (Charger Unit)----------------------30 

4.11. Signal Route -----------------------------------------------31 

5 Location of Controls and Components ------------------33 

5.1. Controls -----------------------------------------------------33 

5.2. Display ------------------------------------------------------33 

6 Installation Instructions ---------------------------------------34 

6.1. Connections------------------------------------------------34 

6.2. Battery Installationand replacement -----------------35 

6.3. Battery Charge --------------------------------------------35 

7 Operating Instructions-----------------------------------------37 

7.1. Programmable Settings ---------------------------------37 

7.2. Error Messages -------------------------------------------40 

7.3. Troubleshooting-------------------------------------------41 

8 Test Mode ----------------------------------------------------------44 

8.1. Adjustment and Test Mode Flow Chart -------------44 

9 Service Mode -----------------------------------------------------54 

9.1. How to Clear User Setting------------------------------54 

10 Troubleshooting Guide ----------------------------------------55 

10.1. Troubleshooting Flowchart -----------------------------55 

11 Disassembly and Assembly Instructions ---------------69 

11.1. Disassembly Instructions -------------------------------69 

11.2. How to Replace the Handset LCD -------------------73 

12 Measurements and Adjustments---------------------------74 

12.1. Things to Do after Replacing IC ----------------------74 

12.2. Base Unit Reference Drawing-------------------------75 

12.3. Handset Reference Drawing---------------------------76 

12.4. Frequency Table ------------------------------------------77 

13 Miscellaneous ----------------------------------------------------78 

13.1. CPU Data (Base Unit) -----------------------------------78 

13.2. CPU Data (Handset)-------------------------------------79 

13.3. Explanation of IC Terminals (RF Part)---------------80 

13.4. How to Replace the Flat Package IC----------------82 

13.5. How to Replace the LLP (Leadless Leadframe 

Package) IC------------------------------------------------84 

13.6. Terminal Guide of the ICs, Transistors and 

Diodes -------------------------------------------------------87 

14 Schematic Diagram ---------------------------------------------89 

14.1. For Schematic Diagram---------------------------------89 

14.2. Schematic Diagram (Base Unit_Main) --------------90 

14.3. Schematic Diagram (Base Unit_RF Part) ----------92 

14.4. Schematic Diagram (Base Unit_Operation) -------94 


PAGE 

14.5. Schematic Diagram (Handset_Main) --------------- 96 

14.6. Schematic Diagram (Handset_RF Part)------------ 98 

14.7. Schematic Diagram (Charger Unit)---------------- 100 

15 Printed Circuit Board ---------------------------------------- 101 

15.1. Circuit Board (Base Unit_Main) -------------------- 101 

15.2. Circuit Board (Base Unit_RF Part)----------------- 103 

15.3. Circuit Board (Base Unit_Operation)-------------- 105 

15.4. Circuit Board (Handset_Main) ---------------------- 107 

15.5. Circuit Board (Handset_RF Part) ------------------ 109 

15.6. Circuit Board (Charger Unit)--------------------------110 

16 Exploded View and Replacement Parts List ----------111 

16.1. Cabinet and Electrical Parts (Base Unit) ---------- 111 

16.2. Cabinet and Electrical Parts (Handset)------------112 

16.3. Cabinet and Electrical Parts (Charger Unit) ------113 

16.4. Accessories and Packing Materials ----------------114 

16.5. Replacement Parts List--------------------------------118 

3


1 Safety Precautions 

1.1. For Service Technicians 

• Repair service shall be provided in accordance with repair technology information such as service manual so as to prevent 

fires, injury or electric shock, which can be caused by improper repair work. 

1. When repair services are provided, neither the products nor their parts or members shall be remodeled. 

2. If a lead wire assembly is supplied as a repair part, the lead wire assembly shall be replaced. 

3. FASTON terminals shall be plugged straight in and unplugged straight out. 

• ICs and LSIs are vulnerable to static electricity. 

When repairing, the following precautions will help prevent recurring malfunctions. 

1. Cover plastic parts boxes with aluminum foil. 

2. Ground the soldering irons. 

3. Use a conductive mat on worktable. 

4. Do not grasp IC or LSI pins with bare fingers. 

2 Warning 

2.1. Battery Caution 

1. Danger of explosion if battery is incorrectly replaced. 

2. Replace only with the same or equivalent type recommended by the manufacturer. 

3. Dispose of used batteries according to the manufacturer's Instructions. 

2.2. About Lead Free Solder (PbF: Pb free) 

Note: 

In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that contains 

lead. 

We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn), 

Silver (Ag), and Copper (Cu). 

This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair 

work we suggest using the same type of solder. 

Caution 

• PbF solder has a melting point that is 50°F ~ 70° F (30°C ~ 40°C) higher than Pb solder. Please use a soldering iron with temperature 

control and adjust it to 700°F ± 20° F (370°C ± 10°C). 

• Exercise care while using higher temperature soldering irons.: 

Do not heat the PCB for too long time in order to prevent solder splash or damage to the PCB. 

• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100°F (600°C). 

• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the 

opposite side (See the figure below). 

4


2.2.1. Suggested PbF Solder 

There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper 

(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu), or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the manufacturer's 

specific instructions for the melting points of their products and any precautions for using their product with other materials. 

The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3 mm, 0.6 mm and 1.0 mm. 

2.3. Discarding of P. C. Board 

When discarding P. C. Board, delete all personal information such as telephone directory and caller list or scrap P. C. Board. 

5


3 Specifications 

6

4 Technical Descriptions 

4.1. FHSS Description 


4.1.1. Frequency 

The frequency range of 5.76 GHz-5.84 GHz is used. Transmitting and receiving channel between base unit and handset is same 

frequency. Refer to Frequency Table (P.77). 

4.1.2. FHSS (Frequency Hopping Spread Spectrum) 

This telephone is using an IC chip which has similar specification to WDCT (World Digital Cordless Telephone) and is the telephone 

system that can use multiple portable unit simultaneously. The explanation of this system is mentioned below. This system 

uses a Time Division Multiple Access/Time Division Duplex (TDMA/TDD) scheme: 

transmitting and receiving frequencies of the base unit and handset are shared in the same frequency. The construction of RX/ 

TX frequency data is shown below. It consists of 4 slots from the base unit to the handset, and 4 slots from the handset to the 

base unit, total 8 slots in 10 ms. By this slot system, simultaneous air link and communication between 4 handsets and the base 

unit can be realized. One communication between handset and the base unit is done by one slot from the base unit to handset, 

and another slot from handset to the base unit. 

DSS makes spectrum spread by multiplying carrier signal by PN code. The purpose to make spectrum spread is to reduce 

power density per time and per band. On the other hand, FHSS makes spectrum spread by changing channel every 10 ms 

according to Hopping table. Also the purpose to make spectrum spread is to reduce power density per time and per band. 

7


4.1.2.1. TDD Frame Format 

Sync Field (72 bit): Preamble 56 bit + SyncWord 16 bit 

Base unit (handset) adjusts the timing of reception so that reception of base unit (handset) can correspond to transmission of 

handset (base unit). 

It is necessary for sync-field that handset gets synchronization. 

A - field (64 bit): Each kinds of DATA: ch data, line condition, etc. 

B - field (320 bit + 80 bit): Sound data + parity 

Z - field (4 bit): Parity Check 

4.1.2.2. TDMA system 

This system is the cycles of 10 ms, and has four duplex paths, 

so it is possible to perform four duplex communications simultaneously. 

In 1 slot 1.25 ms, the 10 ms of voice data is transmitted. 

Each slot makes every frame frequency hop. (100 hops/sec.) 

Although each slot (UpLink3 and UpLink4) uses different frequency, UpLink3 and DownLink3 use the same frequency. 

• 2 - Handsets Link 

Traffic Bearer 

A link is established between base unit and handset. 

The state where duplex communication is performed. 

The hopping pattern of a 3000 hops (30 seconds) cycle. 

Dummy Bearer 

The base unit sends Dummy-data to the all stand-by state handsets. 

The handsets receive that data for keeping synchronization and monitoring request from the base unit. 

Dummy Bearer doesn't contain B-field (sound) data. 

8


4.1.3. Signal Flowchart in the Whole System 

Reception 

TEL JACK of the base unit is connected to the TEL line, and signal is input through the bridge diode D101. While talking, the 

relay (Q141) is turned ON and amplified at the Q171, then led to DSP (IC501). The DSP encodes ADPCM and TDD/TDMA with 

FHSS to TXDATA. The TXDATA signal goes into IC701 of RF PART, and is modulated to 5.8 GHz. The RF signal is amplified by 

the power amplifier (IC801) and fed to Antennas. 

As for the handset, RF signal from the RX antenna is amplified by LNA (IC801). The amplified signal is down-converted to IF 

signal in IC701. The IF signal passing through internal filter is demodulated into RXDATA, then goes into DSP (IC501). The DSP 

performs TDD/TDMA and ADPCM decoding to convert the RXDATA into the voice signal, then it is output to the speaker. 

Transmission 

The voice signal entering from the handset microphone is led to DSP (IC501). The DSP encodes ADPCM and TDD/TDMA with 

FHSS to TXDATA. The TXDATA signal goes into IC701 of RF PART, and is modulated to 5.8 GHz. The RF signal is amplified by 

the power amplifier (IC801) and fed to Antenna. 

As for the base unit, RF signal from the Antennas is amplified by LNA (IC801). The amplified signal is down-converted to IF signal 

in IC701. The IF signal passing through internal filter is demodulated into RXDATA, then goes into DSP (IC501). The DSP 

performs TDD/TDMA and ADPCM decoding to convert the RXDATA into the voice signal. The voice signal is amplified at the TX 

amplifier (Q161), then output to the TEL line TEL JACK through the relay (Q141) and bridge (D101). 

9


4.2. Explanation of Link Data Communication 

4.2.1. Calling 

4.2.2. To Terminate Communication 

4.2.3. Ringing 

10

4.3. Block Diagram (Base Unit_Main) 


Operational P.C. Board 

Q141 

RLY 

KEYS 

Q161 

SIDE TONE 

CIRCUIT 

R151,R152 R131, R133 

INUSE 

DETECT 2 

INUSE 

DETECT 1 

D101 

L1T 

L1R 

ANT1 ANT2 

TEL JACK 

RF_PART 

SP 

X501 

13.824 MHz 

IC501 

DSP 

LIN 

LOUT 

RLY 

DCIN 2 

DCIN 1 

BELL 

CID_IN 

CID_IN 

RESET 

POWER_DOWN 

VCC 

VCCIN 

VCCA 

VCCPA 

MIP 

MIN 

RECEIVE 

AMP 

MIC 

IC331 

Q111 

BELL 

DETECT 

4.0 V 

CONVERTOR 

DC JACK 

DCP 

DCM 

CHARGE_CONTACT 

+ 

KX-TG6121/6122/6123 BLOCK DIAGRAM (Base Unit_Main) 

- 

INT_1 

ANSWER_LED 

V_RF(VPA) 

Q171 

IC300, Q300 

SI,SO,CS, 

CLK,RST 

KEY 1 3 

KEY B, C, D, E 

SPN 

SPP 

MSG_LED 

RXDATA 

TXDATA 

RADIO_EN 

SLOT_CTRL 

SYN_OUT 

SYN_DATA 

SYN_CLK 

SYN_EN 

BCLK 

RF_RESET 

3.3 V 

REGULATOR 

with RESET 

V_RF 

FLASH 

MEMORY 

IC601 

VCC 

INT_1 5 

R372 

11


4.4. Block Diagram (Base Unit_RF Part) 

ANT1 

ANT2 

5.8 GHz Power Amp., LNA 

and Antenna Switch Circuit 

IC761 

3.0 V 

REGULATOR 

VCC_DIG 

VCC_IF 

VCC_FE 

VCC_PA 

VCC_PLLD 

VCC_VCO 

VCC_PLLA 

FL811 

FL821 

IC801 

PAEN 

ANTSEL_A 

ANTSEL_B 

LNA_EN 

RXGAIN 

Doubler 

2x 

V_PA 

V_RF 

DSP 

IC501 

PLL 

delta-sigma Modulator 

BCLK 

IC701 

Control Logic 

& 

Modem 

SYN_OUT 

SYN_EN 

SYN_CLK 

SYN_DATA 

SLOT_CTRL 

RADIO_EN 

TXDATA 

RXDATA 

A/D 

KX-TG6121/6122/6123 BLOCK DIAGRAM (Base Unit_RF Part) 

12

4.5. Circuit Operation (Base Unit) 


General Description: 

(DSP, Flash Memory) is a digital speech/signal processing system that implements all the functions of speech compression, 

record and playback, and memory management required in a digital telephone answering machine. 

The DSP system is fully controlled by a host processor DSP. The host processor provides activation and control of all that functions 

as follows. 

4.5.1. DSP (Digital Speech/Signal Processing: IC501) 

• Voice Message Recording/Play back 

The DSP system uses a proprietary speech compression technique to record and store voice message in Flash Memory. 

An error correction algorithm is used to enable playback of these messages from the Flash Memory. 

• DTMF Detection/Generator 

The DTMF detection is implemented by the DSP system in software. The DTMF detection is performed during Line Monitoring 

modes of operation. 

When the DTMF data from the handset is received, the DTMF signal is output.. 

• Synthesized Voice (Pre-recorded message) 

The DSP implements synthesized Voice, utilizing the built in speech detector and a Flash Memory, which stored the vocabulary. 

• Caller ID demodulation 

The DSP implements monitor and demodulate the FSK signals that provide CID information from the Central Office. 

• Digital Switching 

The voice signal from telephone line is transmitted to the handset or the voice signal from the handset is transmitted to the Telephone 

line, etc. They are determined by the signal path route operation of voice signal. 

• Block Interface Circuit 

RF part, LED, Key scan, Speaker, Microphone, Telephone line. 

4.5.2. Flash Memory (IC601) 

Following information data is stored. 

• Voice signal 

ex: Pre-recorded Greeting message, Incoming message 

• Settings 

ex: message numbers, ID code, Flash Time, Tone/Pulse 

13


4.5.3. Power Supply Circuit 

Function: 

The power supply voltage from AC adaptor is converted to the desired voltage of each block. 

Circuit Operation: 

• Q300 and IC300: 4.0 V DCDC Converter 

• IC331: 3.3 V Regulator 

14

4.5.3.1. Charge Circuit 

The voltage from the AC adaptor is supplied to the charge circuits. 


15


4.5.4. Reset Circuit 

Function: 

This circuit is used to initialize the microcomputer when it incorporates an AC adaptor. 


When the AC Adaptor is inserted into the unit, then the voltage is shifted by IC331 and power is supplied to the DSP. 

The set starts to operate when VCC goes up to 3.0 V or more in the circuit voltage diagram. 

Note: 

(*1) The initializing time of the DSP chip is 28 ms under normal conditions. 

16


4.5.5. Telephone Line Interface 

Telephone Line Interface Circuit: 

Function 

• Bell signal detection 

• ON/OFF hook and pulse dial circuit 

• Side tone circuit 

Bell signal detection and OFF HOOK circuit: 

In the idle mode, Q141 is open to cut the DC loop current and decrease the ring load. When ring voltage appears at the Tip (T) 

and Ring (R) leads (When the telephone rings), the AC ring voltage is transferred as follows: 

T → L101 → R111 → C111 → Q111 → DSP pin 58 [BELL] 

When the CPU (DSP) detects a ring signal, Q141 turns on, thus providing an off-hook condition (active DC current flow through 

the circuit). Following signal flow is the DC current flow. 

T → L101 → D101 → Q141 → Q161 → R163 → R167 → D101 → L102 → P101 → R 

ON HOOK Circuit: 

Q141 is open, Q141 is connected as to cut the DC loop current and to cut the voice signal. The unit is consequently in an onhook 

condition. 

Pulse Dial Circuit: 

Pin 59 of DSP turns Q141 ON/OFF to make the pulse dialing. 

Side Tone Circuit: 

Basically this circuit prevents the TX signal from feeding back to RX signal. As for this unit, TX signal feed back from Q161 is 

canceled by the canceller circuit of DSP. 

17


4.5.6. Auto Disconnect Circuit 

Function: 

This circuit is used to detect the fact that another telephone connected to the same line is OFF-HOOK while the unit is in a 

receiving status or OGM transmitting status. 


The voltage of pin 90 of IC501 is monitored. If a parallel-connected telephone is put into OFF HOOK status, the presence/ 

absence of a parallel connection is determined when the voltage changes by 0.2 V or more. When the set detects the parallelconnected 

telephone is OFF HOOK status, the line is disconnected. 

You can enable or disable the Auto Disconnect function. 

See Check Record (P.57) 

18


4.5.7. Parallel Connection Detect Circuit 

Function: 

In order to disable call waiting and stutter tone functions when using telephones connected in parallel, it is necessary to have a 

circuit that judges whether a telephone connected in parallel is in use or not. This circuit determines whether the telephone connected 

in parallel is on hook or off hook by detecting changes in the T/R voltage. 


Parallel connection detection when on hook: 

When on hook, the voltage is monitored at pin 86 of IC501. There is no parallel connection if the voltage is 

1.65 V or higher, while a parallel connection is deemed to exist if the voltage is lower. 

Parallel connection detection when off hook: 

When off hook, the voltage is monitored at pin 90 of IC501; the presence/absence of a parallel connection is determined when 

the voltage changes by 0.2 V or more. 

19


4.5.8. Calling Line Identification (Caller ID) 

Function: 

The caller ID is a chargeable ID which the user of a telephone circuit obtains by entering a contract with the telephone company 

to utilize a caller ID service. For this reason, the operation of this circuit assumes that a caller ID service contract has been 

entered for the circuit being used. 

The Caller-ID data from exchange is supplied to the telephone using either method of FSK or DTMF. The method is chosen 

according to the exchange of telephone office. This unit is available to receive the data with both methods and displays the 

received data on LCD. 

• FSK (Frequency Shift Keying) format 

• DTMF format 

It is the method to send the telephone number of calling party with DTMF to the telephone. DTMF is sent before the first bell signal. 

The data is sent in turn; first the start code, secondly the telephone number of calling party, lastly end code. 

The DTMF is chosen from A (1633 Hz and 697 Hz), B (1633 Hz and 770 Hz), C (1633 Hz and 852 Hz) and D (1633 Hz and 

941Hz) as the start code and end code according to the exchange. 

20

KEYSTOROBE_A~E 

KEYIN_1~5 

WP, CLK, DATA 

4.6. Block Diagram (Handset) 


IC541 

EEPROM 

X501 

13.824 MHz 

ANT1 ANT2 

Q531 

CHARGE 

CHARGE 

DETECT 

Q361 

D361 

IC374 

Q362, Q364 

CHARGE 

CONTROL 

RST 

CHG_DET 

CHG_CTL 

RESET 

BCLK 

TX_DATA 

RX_DATA 

RADIO_EN 

SLOT_CTRL 

RF_POWER 

SYN_OUT 

SYN_DATA 

SYN_CLK 

SYN_EN 

RF part 

RST 

PDN 

IC371 

RF_RESET 

BATTERY 

2.7 V 

REGULATOR 

MIC 

VCC 

VCCA 

VCCPA 

MIP 

MIN 

IC501 

DSP 

V_PA 

V_RF 

SP 

SPP1 

Headset Jack 

LED555~ 

557 (LCD) 

SPN 

HSM 

Q563 

LED561 

(ANT) 

CN431 

R436/R437 

HEADSET 

DETECT 

HEADSET_DET 

Q561 

Monitor SP 

CI 

BL_LED 

ANT_LED 

SPP2 

SPPN 

CI 

LED551 

(KEY) 

554 

Q562 

LCD 

KEYS 

IC372 

DC/DC 

CONVERTER 

IC373 

DC/DC 

CONVERTER 

KX-TGA610 BLOCK DIAGRAM (Handset) 

21


4.7. Block Diagram (Handset_RF Part) 

5.8 GHz Power Amp., LNA 

and Antenna Switch Circuit 

IC761 

2.8 V 

REGULATOR 

VCC_VCO 

VCC_PLLA 

ANT1 

ANT2 

PAEN 

ANTSEL_A 

ANTSEL_B 

LNA_EN 

RXGAIN 

Doubler 

2x 

IC701 

PLL 

delta-sigma Modulator 

Control Logic 

& 

Modem 

TXDATA 

RXDATA 

A/D 

VCC_DIG 

VCC_IF 

VCC_FE 

VCC_PA 

VCC_PLLD 

FL811 

FL821 

IC801 

V_PA 

V_RF 

DSP 

IC501 

RF_POWER 

BCLK 

SYN_OUT 

SYN_EN 

SYN_CLK 

SYN_DATA 

SLOT_CTRL 

RADIO_EN 

KX-TGA610 BLOCK DIAGRAM (Handset_RF Part) 

22

4.8. Circuit Operation (Handset) 

4.8.1. Construction 

The circuit mainly consists of DSP and RF part as shown in the block diagram. 

4.8.1.1. DSP: IC501 

Function 

• Battery Low, Power down detect circuit 

• Ringer Generation 

• Interface circuit 

RF part, Speaker, Mic, LED, Key scan, LCD, Headset 

Initial waves 


Note: 

(*1) The initializing time of the DSP chip is 20 ms under normal conditions. 

4.8.1.2. RF part 

Mainly voice signal is modulated to RF, or it goes the other way. 

4.8.1.3. EEPROM: IC541 

All setting data is stored. 

ex: ID code, user setting (Phonebook, Caller ID data) 

23



Voltage is supplied separately to each block. 

24


4.8.3. Charge Circuit 

When the handset is put on the cradle of the base unit, the power is supplied from CHARGE+ and CHARGE- terminals to 

charge the battery via R366 or Q361. The voltage between CHARGE+ and CHARGE- flows Q531 → pin 38 of IC501, where the 

charge is detected. Then IC501 calculates the battery consumption amount from the previous charge, and it controls Q361/ 

Q362/Q364 by pin 42 of IC501 until charging is complete. When charging is complete, the control pattern is switched to Trickle 

charging form from Operational charging form. 

4.8.4. Ringer and Handset SP-Phone 

25


4.8.5. Sending Signal 

The voice signal from the microphone is input to DSP (90, 91). Also the power for the microphone is supplied from DSP (92) and 

the power is turned OFF on standby. 

4.8.6. Reception Signal 

The voice signal from the base unit is output from DSP (97,98) drives the speaker. 

26

4.9. Circuit Operation (RF Part) 


General Description: 

RF part includes Transmitter and Receiver functions. Digital signals (Mainly voice data) that come from DSP, are modulated and 

are transmitted. On the other hand, received signals are demodulated and go out to DSP. 


As indicated below, the various voltages are supplied to each block. 

V_PA, about 4.0 V at base unit or 3.3 V at handset, is supplied to the Power amplifier in 5.8 GHz PA circuit. 

IC761 is 3.0 V Regulator and outputs VRF (3.0 V) by order of RADIO_EN signal. 

V_RF is approximately 4.0 V (Base Unit) or 3.6 V (Handset). 

27


4.9.2. 5.8 GHz Mod/Demod Circuit 

IC701 incorporates all of the modulation and demodulation functions. 

TX Digital data (TX_DATA) from DSP is supplied to pin 17 of IC701, and then 5.8 GHz TX modulated signals is output from pin 1. 

This 5.8 GHz TX signal goes into the PA circuit in IC801. 

On the other hand, amplified 5.8 GHz RX signal from LNA in IC801 is passed through BALUN (BALunce-UNbalunce) matching circuit 

and supplied to pin 7 and pin 8. 

In IC701, RX signal is down-converted to 432 kHz IF signal, and demodulated, and RX digital data (RX_DATA) goes from pin 17 to 

DSP. 

IC701 outputs some digital signals (PAEN, ANTSEL_A, ANTSEL_B, LNAEN, RXGAIN), and controls IC801. 

Reference Clock signal (13.824 MHz) is supplied to pin 25. 

Note: 

The exposed GND_PLATE on the bottom of the IC701 supplies the circuit ground(s) for the entire chip. It is very important that 

a good solder connection is made between this GND_PLATE and the ground plane of the PCB underlying the IC701. 

28


4.9.3. 5.8 GHz PA (Power Amplifier), 5.8 GHz LNA (Low Noise Amplifier) and Antenna 

Switch Circuit 

IC801 includes PA (Power Amplifier) block, LNA (Low Noise Amplifier) Block and Antenna Switch Circuit. 

PA block amplifies 5.8 GHz TX signal. 

5.8 GHz TX signal from 5.8 GHz RF IC (IC701) is amplified by PA (Power Amplifier) block of IC801. After that, it is supplied to 

Antenna Switch block from pin 24 of IC801. V_PA is approximately 4.0 V at base unit, and 3.1 V at handset. 

LNA block amplifies receiving 5.8 GHz signal. 5.8 GHz RX signal from Antenna Switch block of IC801 is amplified by LNA block and 

is supplied to IC701. 

Antenna Switch block of IC801 switches for RF signals by ANTSEL_A and ANTSEL_B from IC701. 

IC701 checks RSSI (Received Signal Strength Indicator), and selects better receiving condition antenna. 

At RX mode, RX signal is lead from selected antenna to LNA block. 

On the other hand, 5.8 GHz TX signal from PA block is lead to selected antenna at RX mode. 

Note: 

The exposed GND_PLATE on the bottom of IC801 supplies the circuit ground(s) for the entire chip. It is very important that a 

good solder connection is made between this GND_PLATE and the ground plane of PCB underlying the IC801. 

29


4.10. Circuit Operation (Charger Unit) 

The voltage from the AC adaptor is supplied to the charge circuits. Main charge (180~250 mA at the Battery) of maximum 7- 

hours is started soon after the handset is placed on the charger unit. Then it changes to Trickle charge to prevent from overcharging. 

Charging form 

The route for this is as follows: DC+pin of J1(+) → F1 → D1 → R1 → CHARGE+pad → Handset → CHARGE-pad → DC-pin of 

J1(-). 

30

4.11. Signal Route 


31


RF part signal route 

32


5 Location of Controls and Components 

5.1. Controls 

5.1.1. Base Unit 

5.1.2. Handset 

5.2. Display 

33


6 Installation Instructions 

6.1. Connections 

34

6.2. Battery Installation 

and replacement 


6.3. Battery Charge 

Note for service: 

The battery strength may not be indicated correctly if the 

battery is disconnected and connected again, even after it is 

fully charged. In that case, by recharging the battery as 

mentioned above, you will get a correct indication of the 

battery strength. 

6.3.1. Battery Level 

35


6.3.2. Panasonic Ni-MH Battery 

Performance (supplied batteries) 

36

7 Operating Instructions 

7.1. Programmable Settings 


7.1.1. Programming by Scrolling through the Display Menus 

37


7.1.2. Programming using the Direct Commands 

38

39 

KX-TG6121LAT/KX-TG6122LAT/KX-TG6123LAT/KX-TGA610LAT


7.2. Error Messages 

40

7.3. Troubleshooting 


41


42

43 

KX-TG6121LAT/KX-TG6122LAT/KX-TG6123LAT/KX-TGA610LAT


8 Test Mode 

8.1. Adjustment and Test Mode Flow Chart 

8.1.1. Test Burst Mode for Base Unit 

Note: 

(*1) Refer to Check Table for RF part (P.63). 

44

8.1.2. TX-CW Mode for Base Unit 


Note: 


45


8.1.3. RX-CW Test Mode for Base Unit 

Note: 


46

8.1.4. Test Link Mode for Base Unit 


Note: 

(*1) Refer to Test Link Mode for Handset (P.52). If you can not proceed to the next step, refer to Registering a handset to a 

base unit (P.60). 


(*3) for factory use only 

47


8.1.5. Adjustment Mode for Base Unit 

Cross Reference 

Check and Adjust X501 (Base Unit) Frequency (P.74) 

48

8.1.6. Test Burst Mode for Handset 


Note: 

(*1) LCD displays the Channel number. 

(exception: default/ CH00 = 1ch.) 


49


8.1.7. TX-CW Mode for Handset 

Note: 




50

8.1.8. RX-CW Test Mode for Handset 


Note: 




51


8.1.9. Test Link Mode for Handset 

Note: 



(*2) If can not proceed to the next step, refer to Registering a handset to a base unit (P.60). 

(*3) for factory use only. 


52

8.1.10. Adjustment Mode for Handset 


Cross Reference 

(*1) Adjust Battery Low Detector Voltage (Handset) (P.74) 

Note: 

(*2) These are the default values. 

(*3) These values may not be fixed depending on the battery strength. 

53


9 Service Mode 

9.1. How to Clear User Setting 

Units are reset to the Factory settings by this operation (Erase recorded Voice messages, stored Phone numbers, Caller list and 

etc.). 

This operation should not be performed for a usual repair. 



Note: 

(*1) Be sure to short the battery terminals of the handset with a lead wire, etc. for 2 seconds for discharge after removing the 

battery. 

54

10 Troubleshooting Guide 

10.1. Troubleshooting Flowchart 


Cross Reference: 

Check Power (P.56) 

Check Playback (P.58) 

Check Record (P.57) 

Check Battery Charge (P.58) 

Check Link (P.59) 

Check the RF part (P.60) 

Check Handset Transmission (P.68) 

Check Handset Reception (P.68) 

Check Caller ID (P.68) 

Note: 

(*1) When a user claims that the unit disconnects a call right 

after the greeting message and no incoming messages can 

be recorded, this symptom can not be reappeared with TEL 

simulator in the service center. In this case, try Check 

Record (P.57) item (C), (D). 

55


10.1.1. Check Power 


Power Supply Circuit (P.24) 

Reset Circuit (P.16) 

Note: 

Flash Memory is IC601. 

DSP is IC501. 

(*1) Refer to Specifications (P.6) for part number and supply 

voltage of AC adaptor. 

(*2) Refer to Circuit Board (Base Unit_Main) (P.101). 

56

10.1.2. Check Record 

BASE UNIT 

A) Not record Greeting Message 


B) Not record Incoming Message 

C) How to change the Auto Disconnect activation (time) 

Some Telephone Company lines (fiber or cable) ON Hook and OFF Hook voltages are lower than conventional lines, which may 

cause a malfunction of Auto Disconnect detection. To solve this problem, try changing the Auto Disconnect activation through 

the procedures below. 

Auto Disconnect detect CPC detect PROCEDURE at Stand-by mode 

Enable*1 

"STOP"+"GREETING CHECK"+"REC" simultaneously 

Enable*1 [default] Disable "STOP"+"GREETING CHECK"+"VOL. " simultaneously 

Disable*2 "STOP"+"GREETING CHECK"+"VOL. " simultaneously 

Note: 

*1 Both Auto Disconnect and CPC don't detect for the first 2 seconds. 

*2 If the "Disable" is selected, even if the parallel-connected telephone is OFF HOOK, the line isn't disconnected. 

D) How to change the VOX level 

It makes easier to detect a small voice (caller) by raising the sensitivity of VOX level. Therefore, the recording of TAM is not 

turned off during a detection. 

VOX Level sensitivity 

PROCEDURE 

Normal [default] "STOP"+"LOCATOR"+"VOL. " simultaneously 

6 dB Up "STOP"+"LOCATOR"+"VOL. " simultaneously 


Signal Route (P.31) 

Telephone Line Interface (P.17) 

Auto Disconnect Circuit (P.18) 

Parallel Connection Detect Circuit (P.19) 

Note: 


DSP is IC501. 

57


10.1.3. Check Playback 


Power Supply Circuit (P.14) 

10.1.4. Check Battery Charge 

Note: 


DSP is IC501. 

(*1) Refer to Circuit Board (Base Unit_Main) (P.101). 

Note: 


(*1) Refer to Specifications (P.6) for part number and supply voltage of AC adaptor. 

58

10.1.5. Check Link 


Note: 


DSP is IC501. 

(*1) Refer to Finding out the Defective part (P.60). 


Check the RF part (P.60) 

59


10.1.6. Check the RF part 

10.1.6.1. Finding out the Defective part 

After All the Checkings or Repairing 

1. Re-register the checked handset to the checked base unit, and Regular HS to Regular BU. 

Note: 

(*1) HS: Handset 

(*2) BU: Base Unit 

10.1.6.1.1. Registering a handset to a base unit 

60

10.1.6.1.2. Deregistering a Handset 


10.1.6.1.3. Deregistering All Handsets by the Base Unit 

61


10.1.6.2. RF Check Flowchart 

Each item (1 ~ 6) of RF Check Flowchart corresponds to Check Table for RF part (P.63). 

Please refer to the each item. 

Note: 

(*1) Refer to X501 (Base Unit), X501 (Handset) Check (P.74). 

62

10.1.6.3. Check Table for RF part 


No. Item BU (Base Unit) Check HS (HandSet) Check 

1 Link Confirmation Normal 

HS, BU Mode [Normal Mode] 

1. Register Regular HS to BU (to be 

checked). 

2. Press [Talk] key of the Regular HS to 

1. Register HS (to be checked) to Regular 

BU. 

2. Press [Talk] key of the HS to establish link. 

establish link. 

2 Control signal confirmation 

Check DSP interface. (*2) Check DSP interface. (*2) 

HS, BU Mode: [Test Burst Mode] (*1) 

3 X'tal Frequency confirmation (*7) 

HS, BU Mode: [Adjustment] (*3) 

4 TX confirmation 

Regular HS, BU Mode: 

[Test Burst Mode.] (*4) 

HS, BU (to be checked) Mode: 

[TX_CW Mode.] (*1) 

5 RX confirmation 

Regular HS, BU Mode: 

[TX_CW Mode.] (*1) 

HS, BU (to be checked) Mode: 

[Test Burst Mode.] (*4) 

6 Range Confirmation Normal 

HS, BU Mode: [Normal Mode] 

Check X'tal Frequency. 

(13.824000 MHz ±100 Hz) 

1. Place the Regular HS about 15 cm away 

from the BU. 

2. Confirm "RXDATA" waveform of the Regular 

HS by Oscilloscope. (*5) (*8) 

1. Place the Regular HS about 15 cm away 

from the BU. 

2. Confirm "RXDATA" waveform of the BU by 

Oscilloscope. (*5) (*8) 

1. Register Regular HS to BU (to be 

checked). 

2. Press [Talk] key of the Regular HS to 

establish link. 

3. Compare the range of the BU (being 

checked) with that of the Regular BU. 

Check X'tal Frequency. 

(13.824000 MHz ±100 Hz) 

1. Place the HS about 15 cm away from the 

Regular BU. 

2. Confirm "RXDATA" waveform of the Regular 

BU by Oscilloscope. (*6) (*8) 

1. Place the HS about 15 cm away from the 

Regular BU. 

2. Confirm "RXDATA" waveform of the HS by 

Oscilloscope. (*6) (*8) 

1. Register HS (to be checked) to Regular 

BU. 

2. Press [Talk] key of the HS to establish link. 

3. Compare the range of the HS (being 

checked) with that of the Regular HS. 

Note: 

(*1)(*3)(*4) Adjustment and Test Mode Flow Chart (P.44) 

(*2) RF-DSP Interface Signal Wave Form (P.65) 

(*5) Base Unit Reference Drawing (P.75) 

(*6) Handset Reference Drawing (P.76) 

(*7) X501 (Base Unit), X501 (Handset) Check (P.74) 

(*8) Test Burst Mode and TX-CW Mode when TX confirmation and RX confirmation (P.67) 

63


10.1.6.4. TEST RANGE Check 

Circuit block which range is defective can be found by the following check. 

Range Confirmation TX TEST 

(TX Power check) 

HS, BU Mode: 

[Test Link Mode] (*1) 

Item BU (Base Unit) Check HS (HandSet) Check 

1. Register Regular HS to BU (to be checked). 

2. Set BU to "Test Link mode". 

3. Set Regular HS to "Test Link mode". 

Range Confirmation RX TEST 

(RX sensitivity check) 

HS, BU Mode: 

[Test Link Mode] (*1) 

*Set TX Power and RX Sensitivity of the BU and the 

Regular HS by CHART1. 

* At distance of about 5 m between HS and BU, 

Link OK = TX Power of the BU is OK. 

No Link = TX Power of the BU is NG. 

1. Register Regular HS to BU (to be checked). 

2. Set BU to "Test Link mode". 

3. Set Regular HS to "Test Link mode". 

*Set TX Power and RX Sensitivity of the BU and Regular 

HS by CHART1. 

1. Register HS (to be checked) to Regular BU. 

2. Set Regular BU to "Test Link mode". 

3. Set HS to "Test Link mode". 

*Set TX Power and RX Sensitivity of the HS and the 

Regular BU by CHART1. 


Link OK = TX Power of the HS is OK. 

No Link = TX Power of the HS is NG. 

1. Register HS (to be checked) to Regular BU. 

2. Set Regular BU to "Test Link mode". 

3. Set HS to "Test Link mode". 

* Set TX Power and RX Sensitivity of Checking_HS and 

Regular_BU by CHART1. 


Link OK= RX Sensitivity of the BU is OK. 

No Link = RX Sensitivity of the BU is NG. 


Link OK= RX Sensitivity of the HS is OK. 

No Link = RX Sensitivity of the HS is NG 

CHART1: Setting of TX Power and RX Sensitivity in Range Confirmation TX TEST, RX TEST 

BU (to be checked) 

Regular_HS 

TX Power RX Sens. TX Power RX Sens. 

BU (Base Unit) TX Power Check High High High Low 

BU (Base Unit) RX Sensitivity Check High High Low High 

HS (to be checked) 

Regular_BU 

TX Power RX Sens. TX Power RX Sens. 

HS (Handset) TX Power Check High High High Low 

HS (Handset) RX Sensitivity Check High High Low High 

Note: 

(*1) Adjustment and Test Mode Flow Chart (P.44) 

64

10.1.6.5. RF-DSP Interface Signal Wave Form 

Test Burst Mode 


65


Test Burst Mode 

66

Test Burst Mode and TX-CW Mode when TX confirmation and RX confirmation 


67


10.1.7. Check Handset Transmission 



10.1.8. Check Handset Reception 



Note: 

When checking the RF part, Refer to Check the RF part 

(P.60). 

10.1.9. Check Caller ID 


Telephone Line Interface (P.17) 

Calling Line Identification (Caller ID) (P.20) 

Note: 

• Make sure the format of the Caller ID or Call Waiting Caller 

ID services of the Telephone company that the customer 

subscribes to. 

• It is also recommended to confirm that the customer is really 

a subscriber of the service. 

68


11 Disassembly and Assembly Instructions 

11.1. Disassembly Instructions 


69


70



71


11.1.3. Charger Unit 

72

11.2. How to Replace the Handset LCD 


73


12 Measurements and Adjustments 

12.1. Things to Do after Replacing IC 

12.1.1. X501 (Base Unit), X501 (Handset) Check 

Equipment: Frequency counter 

Check Point for measurement: BCK 

Checking tolerance: 13.824 MHz ± 100 Hz (Base Unit)/13.824 MHz ± 100 Hz (Handset) 

12.1.1.1. Check and Adjust X501 (Base Unit) Frequency 

1. Set up base unit in TEST mode.* 

2. Press following keys in order to Adjust Crystal mode. [LOCATOR], [LOCATOR], [LOCATOR], [ ], [ ]. Check BCK frequency. 

3. If the BCK frequency is out of the checking tolerance (± 100 Hz), adjust to Adjustment tolelance (± 30 Hz) by pressing [ ] or 

[ ] key. 

Adjustment Tolerance: 13.824 MHz ± 30 Hz 

4. Press [LOCATOR] key to write the new frequency factor in Memory. 

5. Turn the power off. Then this value is available. 


* Adjustment Mode for Base Unit (P.48) 

12.1.1.2. Check and Adjust X501 (Handset) Frequency 

1. Set DC power supply to 2.6 V. 

2. Set up handset in TEST mode (Adjustment flow).* 

3. Press [1] key to Adjust Crystal mode ("Clock Adj." is displayed on LCD). Check BCK frequency. 

4. If the BCK frequency is out of the checking tolerance (± 100 Hz), adjust to Adjustment tolelance (± 30 Hz) by pressing [ ] or 

[ ] key. 

Adjustment Tolerance: 13.824 MHz ± 30 Hz 

5. Press [TALK] key to write the new frequency factor in EEPROM. 



*Adjustment Mode for Handset (P.53) 

12.1.2. Adjust Battery Low Detector Voltage (Handset) 

After handset's DSP (IC501) or EEPROM (IC541) replacement, Re-writing Battery Low voltage to EEPROM is required. 

With following handset Adjustment Flow, adjust DC power supply and DC voltmeter by the procedure below. 

1. Set DC power supply to 2.6 V. 

2. Set up handset in TEST mode (Adjustment flow).* 

3. Press [1] key and [OFF] key to Adjust Batt Low mode. ("Bat Adj." is displayed on LCD) 

4. Change the voltage of the DC power supply to 2.34 V accurately. Check the voltage at P.C. board pads because some voltage 

drops occur due to the usage of long or thin cables. 

5. Press [TALK] key twice to write voltage value in EEPROM. 

6. Press [TALK] key twice to write charge value 1 in EEPROM. 

7. Change the voltage of the DC power supply to 3.1 V accurately. 

8. Press [TALK] key twice to write charge value 2 in EEPROM. 

9. Change the voltage of the DC power supply to 3.6V accurately. 

10. Press [TALK] key twice to write primary battery detect value in EEPROM. 


Note: 

Refer to Handset Reference Drawing (P.76) for connection of DC power supply and voltmeter. 


*Adjustment Mode for Handset (P.53) 

74

12.2. Base Unit Reference Drawing 

When connecting the simulator equipment for checking, please refer to below. 


AF 

OSC 

Oscilloscope 

DC VOLT METER 

AF VOLT 

METER 

DC 

6.5V 

600 

LOOP 

SIMULATOR 

1 

DC 

Call-ID 

SIMULATOR 

ANT1_GND 

DCP2 

DCP 

POWER 

ANT2_GND ANT2_HOT 

DCM 

GREEN 

Ring 

400 

Tip 

FREQUENCY COUNTER 

DCM2 

RING 

L1R 

TEL 

BMC-CLK (BCL) 

TIP 

L1T 

YELLOW 

U_ART 

I/F 

Oscilloscope 

RX 

TX 

AGND 

US2BT 

DGND 

C422 

JG JO 

JS JC JI 

MIN 

C605 C604 

UGND 

MIP 

1 

4 

BCLK 

IC601 

R603 

TXO 

8 

5 

C601 

R602 

C603 C611 

SPP 

SP 

SPN 

CHARGE+ 

CHG 

CHARGE- 

MIC- 

MIC+ 

R612 R611 

C612 

IC611 

R533 

UTX URX UVCC RA501 

5 

8 

R665 

DVCC 

4 

1 

C661 

VCC 

INT1 

C660 

R157 

R155 

R156 

Q156 

R131 

R134 

D133 

D153 

R154 C132 

R133 

R151 

R114 

R181 

C152 

R152 

Q111 

R182 

E 

C181 

KEYB KEY1 KEY3/TE 

KEY2 

R112 

C112 C122 

R122 

C121 

R121 

R111 

C111 

C120 

C113 

E 

R113 

D113 

C182 

C183 

C184 

PbF 

CHARGE 

DC VOLT METER 

15 1 

Dummy Battery 

AF VOLT 

METER 

MIC1 

PNLP1008 

PNLP1007 

A 

Note: 

(*1) is referred to No.3 of Check Table for RF part (P.63). 

75


12.3. Handset Reference Drawing 

When connecting the simulator equipment for checking, please refer to below. 

ANT1 

SP_PHONE 

8 

Oscilloscope 

Spectrum 

Analyzer 

AC VOLT 

METER 

MONITOR_SP 

Oscilloscope 

MAIN_SP 

150 

AF VOLT 

METER 

SPM SPP 

Frequency 

Counter 

BCK 

MICM 

MICP 

47 

47 

VSS 

CI 

(pin52) 

VBAT 

Oscilloscope DC_VOLT_METER 

OSC 

1.1 kHz 

MIC Load 

A 

CHG1 

CHG2 

DC_POWER_SUPPLY 

2.34~3.60 V 

D427 

D426 

L431 

IC561 

RA403 

D423 

D424 

L351 

C531 

D531 

L352 

L413 

L412 

C411 

C412 C413 

D412 D413 

C354 

R354 

R361 

BATTP 

C365 

R366 

R369 

BATTN 

C364 

R368 

R367 

C541 

IC541 

D361 

PDN 

C542 

R376 

C416 

RA401 

RA402 

R509 R507 

R505 R506 

R377 R526 

C526 

C503 

C543 

C377 

C505 

BCLK 

TCK 

C596 CI 

X501 

IC501 

C512 

C510 

C379 C519 

C507 

RST 

TXO 

R378 

R379 

R501 

R534 

TX_EN 

RXI 

C564 

R431 R547 

R546 

C565 

C546 

R375 

C243 

IC546 

SPP 

IC374 

R437 C436 

C435 

R436 

R435 

L432 

CN431 

C386 

SPPP 

SPPN 

5 

3 

IC372 IC373 

IC371 

VBAT2 VBAT1 

VSS2 VSS1 

RX 

TX 

C433 

TDO 

TE 

TMS 

TDI 

C374 

C371 L511 

SPM 

R564 

C562 

C422 

C421 

C577 

C576 

C575 

C574 

C573 

R573 

R572 

C571 

R745 

R744 

C743 

R743 

R742 

R741 

R740 

C762 

L761 

C761 

R746 

R747 

C781 

L782 

C782 

C763 

C703 C746 

C733 

C734 

C732 

C731 

C702 

C701 

L711 

C727 

L724 

C725 

C714 

C713 

C704 C711C715 

C718 

C705 C712 

C806 

L768 

C706 

L878 

L873 

ANT2_HOT 

ANT2_GND 

C726 

C723 

C724 

C716 

IC701 

IC801 

C717 

C764 

IC761 

C876 

C877 

C879 

C768 

C766 

R847 

C878 

R844 

C719 

R846 

C803 

C802 

C802 

C871 C873 

R722 

C821 

C811 

ANT1_HOT 

ANT1_GND 

R822 

FL821 FL811 R812 

1 

6 

6 

1 

4 

R723 

9 

16 

4 

L721 

8 

7 

1 

17 24 

3 

1 

12 

13 18 

32 

25 

24 

19 

5 

5 4 

1 3 

1 

1 

2 

1 

51 

75 

50 

8 5 

1 4 

1 

5 

8 

26 

76 100 

25 

1 

4 

1 

C742 

C741 

C841 C844 

C842 

C843 

C722 

R843 

C805 

C845 

L725 

C721 

L872 

L373 

C362 

C572 

C372 

L427 

L426 

C570 

SP_PHONE 

C434 

L434 

C361 

C373 

C432 

E 

C509 

RA501 

R374 

R561 R560 

RA551 

Q561 

R542 

RA552 

R541 

F301 

E 

R543 

R531 

Q531 

R532 

C563 

C511 C504 

C544 

Q543 

C366 

C353 

R370 Q364 

C363 

C594 

E 

E 

Q362 

C506 

R508 

R417R434 R433 

E 

C508 

R363 

R362 

MICP-1 

Q361 

R510 

R525 

C414 C417 

C415 

D364 

E 

C540 

C502 

C501 

R540 

MICM-1 

RECEIVER 

Q563 Q562 

C525 

C515 

E E 

MICM 

MICP 

C351 

C352 

L822 

L812 

KX-TGA43 R 


PQUP11557Z 

PbF 

PNL-P1015 

Note: 

(*1) is referred to No.3 of Check Table for RF part (P.63). 

76

12.4. Frequency Table 


Channel Ch. (hex) TX/RX Frequency 

(MHz) 


(MHz) 


(MHz) 

1 01 5759.702 33 21 5788.242 65 41 5816.782 

2 02 5760.594 34 22 5789.134 66 42 5817.674 

3 03 5761.486 35 23 5790.026 67 43 5818.566 

4 04 5762.378 36 24 5790.918 68 44 5819.458 

5 05 5763.270 37 25 5791.810 69 45 5820.350 

6 06 5764.162 38 26 5792.702 70 46 5821.241 

7 07 5765.054 39 27 5793.593 71 47 5822.133 

8 08 5765.945 40 28 5794.485 72 48 5823.025 

9 09 5766.837 41 29 5795.377 73 49 5823.917 

10 0A 5767.729 42 2A 5796.269 74 4A 5824.809 

11 0B 5768.621 43 2B 5797.161 75 4B 5825.701 

12 0C 5769.513 44 2C 5798.053 76 4C 5826.593 

13 0D 5770.405 45 2D 5798.945 77 4D 5827.485 

14 0E 5771.297 46 2E 5799.837 78 4E 5828.376 

15 0F 5772.189 47 2F 5800.728 79 4F 5829.268 

16 10 5773.080 48 30 5801.620 80 50 5830.160 

17 11 5773.972 49 31 5802.512 81 51 5831.052 

18 12 5774.864 50 32 5803.404 82 52 5831.944 

19 13 5775.756 51 33 5804.296 83 53 5832.836 

20 14 5776.648 52 34 5805.188 84 54 5833.728 

21 15 5777.540 53 35 5806.080 85 55 5834.620 

22 16 5778.432 54 36 5806.972 86 56 5835.511 

23 17 5779.324 55 37 5807.863 87 57 5836.403 

24 18 5780.215 56 38 5808.755 88 58 5837.295 

25 19 5781.107 57 39 5809.647 89 59 5838.187 

26 1A 5781.999 58 3A 5810.539 

27 1B 5782.891 59 3B 5811.431 

28 1C 5783.783 60 3C 5812.323 

29 1D 5784.675 61 3D 5813.215 

30 1E 5785.567 62 3E 5814.107 

31 1F 5786.459 63 3F 5814.998 

32 20 5787.350 64 40 5815.890 

77


13 Miscellaneous 

13.1. CPU Data (Base Unit) 

13.1.1. IC501 

PIN Description I/O High High_Z Low 

1 GNDPA GND -- -- -- 

2 SPP A.O -- -- -- 

3 BCLK A.O -- -- -- 

4 NC A.O -- -- -- 

5 NC A.I -- -- -- 

6 XIN A.I -- -- -- 

7 XOUT A.O -- -- -- 

8 VDD D.O -- -- -- 

9 VCCIN VCC -- -- -- 

10 GND GND -- -- GND 

11 RESET D.I Normal -- Reset 

12 FLASH_RST * High Middle Low 

13 FLASH_SO * High Middle Low 

14 FLASH_SI * High Middle Low 

15 FLASH_CS * High Middle Low 

16 NC D.O -- -- -- 

17 SYN_OUT D.I High -- Low 

18 TX_DATA D.O High -- Low 

19 SLOT_CTRL D.O High -- Low 

20 NC D.O -- -- -- 

21 NC D.O -- -- -- 

22 NC D.O -- -- -- 

23 NC D.O -- -- -- 

24 RADIO_EN D.O Active -- Not 

25 NC D.O -- -- -- 


27 VCC VCC VCC -- -- 

28 SYN_EN D.O Not -- Active 

29 SYN_CLK D.O High -- Low 

30 SYN_DATA D.O High -- Low 

31 NC D.O -- -- -- 

32 NC D.O -- -- -- 

33 NC D.O -- -- -- 

34 RX_DATA D.I High -- Low 

35 NC D.O -- -- -- 

36 NC D.O -- -- -- 

37 NC D.O -- -- -- 

38 RF_RST D.O Normal -- WakeUp 

39 NC D.O -- -- -- 

40 NC D.O -- -- -- 

41 NC D.O -- -- -- 

42 NC D.O -- -- -- 

43 NC D.O -- -- -- 

44 NC D.O -- -- -- 

45 NC D.O -- -- -- 



48 NC (INT0) D.I.O -- -- -- 

49 FLASH_SCK * High Middle Low 

50 NC D.O -- -- -- 

51 KEY_STB_E D.O Active Not -- 

52 KEY_STB_D D.O Active Not -- 

53 KEY_STB_C D.O Active Not -- 

54 KEY_STB_B D.O Active Not -- 

55 KEY_STB_A D.O Active Not -- 

56 NC D.O -- -- -- 

57 NC D.O -- -- -- 

58 BELL D.I OFF -- ON 

59 RLY D.O Off Hook -- On Hook 


60 KEY_IN6 D.I Non -- Key In 








68 TCK D.O -- -- -- 

69 TMS D.I -- -- -- 

70 TDI D.O -- -- -- 

71 TD0 D.O -- -- -- 

72 NC D.O -- -- -- 

73 NC D.O -- -- -- 

74 NC D.O -- -- -- 

75 NC D.O -- -- -- 

76 ANS_LED D.O -- Off On 

77 NC (INT1) D.O -- -- -- 

78 NC D.O -- -- -- 

79 NC D.O -- -- -- 

80 NC D.O -- -- -- 

81 UART_TX D.O High -- Low 

82 UART_RX D.I High -- Low 

83 MSG_LED D.I.O -- Off On 


85 PDN A.I -- -- -- 

86 DCIN1 A.I -- -- -- 

87 VREF A.O -- -- -- 

88 CID_INP A.I -- -- -- 

89 CID_INN A.I -- -- -- 

90 DCIN2 A.I -- -- -- 

91 NC A.I -- -- -- 

92 GNDA GND -- -- -- 

93 HSMIN A.I -- -- -- 

94 HSMIP A.I -- -- -- 

95 VCCA VCC -- -- -- 

96 LINO A.I -- -- -- 

97 LOUT0 A.O -- -- -- 

98 NC A.O -- -- -- 

99 VCCPA VCC -- -- -- 

100 SPN A.O -- -- -- 

Note: 

• The mark “*” in the I/O column means the port is controlled 

by the firmware. 

78

13.2. CPU Data (Handset) 

13.2.1. IC501 


1 GNDPA GND -- -- GND 

2 SPP2 A.O -- -- -- 

3 BCLK A.O -- -- -- 

4 NC A.I -- -- Normal 

5 XIN A.I -- -- -- 

6 XOUT A.O -- -- -- 

7 VDD VDD -- -- -- 

8 VCCIN VCC VCC -- -- 



11 GND A.I -- -- -- 

12 GND A.O -- -- -- 

13 RESET D.I Normal -- Reset 

14 (FLASH_RESET) D.O -- -- Normal 

15 (FLASH_SO) D.O -- -- Normal 

16 (FLASH_SI) D.O High -- Low 

17 (FLASH_CS) D.O -- -- Normal 

18 LCD_KEY_BL LED D.O On -- Off 

19 SYN_OUT D.I High -- Low 

20 TX_DATA D.O High -- Low 

21 SLOT_CTRL D.O High -- Low 

22 NC D.O -- -- -- 

23 RF_POWER D.O High -- Low 

24 NC D.O -- -- -- 

25 RF_RESET D.O On -- Off 

26 RADIO_EN D.O On -- Off 

27 HEADSET_DET D.I Non -- Headset 

In 



30 SERIAL_LE D.O High -- Low 

31 SERIAL_CLK D.O High -- Low 

32 SERIAL_DATA D.O High -- Low 

33 NC D.O Active -- Off 

34 TXEN D.O -- -- -- 

35 NC D.O -- -- Normal 

36 RX_DATA D.I -- -- -- 

37 NC D.O -- -- -- 

38 CHARGE_DET D.I Off 

Charge 

-- On 

Charge 

39 NC D.O -- -- -- 



42 CHARGE_CNT D.O Trickle Normal -- 


44 DOT_LCD_D4 D.O High -- Low 






50 DOT_LCD_RESET D.O Normal -- Reset 

51 (FLASH_SCK) D.O High -- Low 

52 CI D.O -- -- Normal 

53 NC D.O -- -- -- 

54 NC D.O -- -- -- 

55 ANT_LED1 D.O On -- Off 

56 DOT_LCD_RS D.O Data -- Instruct 

57 DOT_LCD_RW_WR D.O Read -- Write 

58 DOT_LCD_E_RD D.O Active -- Not 

59 DOT_LCD_POWER_SW D.O On -- Off 






63 KEYSTROBE_E D.O -- Not Active 

64 KEYSTROBE_D D.O -- Not Active 

65 KEYSTROBE_C D.O -- Not Active 

66 KEYSTROBE_B D.O -- Not Active 

67 KEYSTROBE_A D.O -- Not Active 



70 TEST_CLK D.I -- -- -- 

71 TEST_MODE_SELECT D.I -- -- -- 

72 TEST_DATA_IN D.I -- -- -- 

73 TEST_DATA_OUT D.O -- -- -- 

74 KEYIN1 D.I Non -- Key In 





79 (INT1) D.O -- -- Normal 

80 (INT0) D.O -- -- Normal 

81 EEPROM_CLK D.O High -- Low 

82 EEPROM_DATA D.I.O -- High Low 

83 UART_TX D.O High -- Low 

84 UART_RX D.I High -- Low 

85 EEPROM_WP D.O WP -- Write 


87 PDN A.I -- -- -- 

88 Battlow A.I -- -- -- 

89 VREF A.O -- -- -- 

90 MIP A.I -- -- -- 

91 MIN A.I -- -- -- 

92 MICBIAS A.O -- -- -- 

93 GNDA GND -- -- GND 

94 VCCA VCC VCC -- -- 

95 Headset_MIC_in A.I -- -- -- 

96 IBAT2 A.I -- -- -- 

97 SPP1 A.O -- -- -- 

98 SPN A.O -- -- -- 

99 VCCPA VCC VCC -- -- 

100 SPPN A.O -- -- -- 

79


13.3. Explanation of IC Terminals (RF Part) 

13.3.1. IC701 

80

13.3.2. IC801 


81


13.4. How to Replace the Flat Package IC 

13.4.1. Preparation 

• PbF (: Pb free) Solder 

• Soldering Iron 

Tip Temperature of 700°F ± 20°F (370°C ± 10°C) 

Note: We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone with 

less experience could overheat and damage the PCB foil. 

•Flux 

Recommended Flux: Specific Gravity → 0.82. 

Type → RMA (lower residue, non-cleaning type) 

Note: See About Lead Free Solder (PbF: Pb free) (P.4). 

13.4.2. How to Remove the IC 

1. Put plenty of solder on the IC pins so that the pins can be completely covered. 

Note: 

If the IC pins are not soldered enough, you may give pressure to the P.C. board when cutting the pins with a cutter. 

2. Make a few cuts into the joint (between the IC and its pins) first and then cut off the pins thoroughly. 

3. While the solder melts, remove it together with the IC pins. 

When you attach a new IC to the board, remove all solder left on the board with some tools like a soldering wire. If some solder is 

left at the joint on the board, the new IC will not be attached properly. 

82

13.4.3. How to Install the IC 

1. Temporarily fix the FLAT PACKAGE IC, soldering the two marked pins. 


*Check the accuracy of the IC setting with the corresponding soldering foil. 

2. Apply flux to all pins of the FLAT PACKAGE IC. 

3. Solder the pins, sliding the soldering iron in the direction of the arrow. 

13.4.4. How to Remove a Solder Bridge 

1. Lightly resolder the bridged portion. 

2. Remove the remaining solder along the pins using a soldering iron as shown in the figure below. 

83


13.5. How to Replace the LLP (Leadless Leadframe Package) IC 

13.5.1. Preparation 

• PbF (: Pb free) Solder 

• Soldering Iron 

Tip Temperature of 700°F ± 20°F (370°C ± 10°C) 

Note: 

We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone with less 

experience could overheat and damage the PCB foil. 

• Hot Air Desoldering Tool 

Temperature: 608°F ± 68°F (320°C ± 20°C) 

13.5.2. Caution 

• To replace the IC efficiently, choose the right sized nozzle of the hot air desoldering tool that matches the IC package. 

• Be careful about the temperature of the hot air desoldering tool not to damage the PCB and/or IC. 

13.5.3. How to Remove the Shield Case 

Note: 

If you don’t have special tools (ex. Hot air disordering tool), conduct the following operations. 

1. Cut the case along perforation. 

2. Remove the cut part. 

3. Cut the four corners along perforation. 

4. Remove the reminds by melting solder. 

84

13.5.4. How to Install the Shield Case 

Note: 

• If you don’t have special tools (ex. Hot air disordering tool), conduct the following operations 

• Shield case’s No. : PNMC1001Z 


1. Put the shield case. 

2. Solder the surroundings. 

13.5.5. How to Remove the IC 

1. Heat the IC with a hot air desoldering tool through the P.C.Board. 

2. Pick up the IC with tweezers, etc. when the solder is melted completely. 

Note: 

• Be careful not to touch the peripheral parts with tweezers, etc. They are unstable. 

When it is hard to melt the solder completely, heat it with a hot air desoldering tool through the IC besides through the 

P.C.Board. 

3. After removing the IC, clean the P.C.Board of residual solder. 

85


13.5.6. How to Install the IC 

1. Place the solder a little on the land where the radiation GND pad on IC bottom is to be attached. 

2. Place the solder a little on the land where IC pins are to be attached, then place the IC. 

Note: 

• When placing the IC, the positioning should be done very carefully. 

3. Heat the IC with a hot air desoldering tool through the P.C.Board until the solder on IC bottom is melted. 

Note: 

• Be sure to place it precisely, controlling the air volume of the hot air desoldering tool. 

4. After soldering, confirm there are no short and open circuits with visual inspection. 

13.5.7. How to Remove a Solder Bridge 

When a Solder Bridge is found after soldering the bottom of the IC, remove it with a soldering iron. 

86


13.6. Terminal Guide of the ICs, Transistors and Diodes 



13.6.3. Charger 

87


Memo 

88

14 Schematic Diagram 

14.1. For Schematic Diagram 

14.1.1. Base Unit (Schematic Diagram (Base Unit_Main)) 

14.1.1.1. Acoustic Testing Mode 


Notes: 

1. DC voltage measurements are taken with voltmeter from the negative voltage line. 

2. The schematic diagrams may be modified at any time with the development of new technology. 

14.1.2. Handset (Schematic Diagram (Handset_Main)) 

Notes: 

1. DC voltage measurements are taken with an oscilloscope or a tester with a ground. 

2. The schematic diagrams may be modified at any time with the development of new technology. 

14.1.3. Charger Unit (Schematic Diagram (Charger Unit)) 

Notes: 

1. DC voltage measurements are taken with voltmeter from the negative voltage line. 

2. The schematic diagram may be modified at any time with the development of new technology. 

89


14.2. Schematic Diagram (Base Unit_Main) 

V_PA 

V_RF 

BCLK 

SYN_OUT 

SYN_EN 

SYN_CLK 

SYN_DATA 

SLOT_CTRL 

RADIO_EN 

RX_DATA 

TX_DATA 

RF_RSTN 

ANT1 

ANT2 

GND 

NC 

C605 

V_PA 

(VPA) 

V_RF 

BCLK 

SYN_OUT 

SYN_EN 

SYN_CLK 

SYN_DATA 

SLOT_CTRL 

RADIO_EN 

RX_DATA 

TX_DATA 

RF_RSTN 

NC 

C604 

ANT1 

ANT2 

GND 

1 SI 

2 SCK 

3 *RESET 

4 *CS 

BCLK 

4M 

R602 NC 

*C611 

1 E0 

2 E1 

3 E2 

4 VSS 

NC 

SO 

GND 

VCC 

*WP 

NC 

VCC 

*WC 

SCL 

SDA 

*C612 NC 

*IC611 

EEPROM 

R521 NC 

TXO 

RXI 

ANT1 

ANT1_HOT2 

ANT1_HOT 

ANT2_HOT2 

ANT2_HOT 

ANT2 

ANT1_GND 

ANT2_GND 

8 

7 

6 

5 

8 

7 

6 

5 

R603 

NC 

C521 

100n 

*R612 

NC 

C603 

NC 

*R611 

C382 

100n 

*C601 

10u 

C381 

K1.0 

DVCC C501 

100n 

C503 

100n 

INT0 

0 

L501 

45 

DGND US2BT 

23 

AGND 

1k 

R422 

C422 

47k 

R421 

C509 

C6p 

100n 

RST 

C531 

100n 

VCC 

R509 NC 

C6p 

C508 

6.8u 

*L475 

100n 

C352 

6.8u 

*L474 

C471 

NC 

C472 

NC 

INT1 

C516 

C514 10u 

GND 

C515 1u 

10u 

R591 

R592 

R594 

R593 

NC 

NC 

NC 

NC 

C513 100n 

C517 

100n 

C120 

1000p 

10u 

C518 

R533 4.7k 

(12) 

(13) 

UVCC 

URX 

UTX 

UGND 

RA501 

KEYB 

KEY1 

KEY2 

KEY3/TE 

KEY_GND 

4 5 

3 6 

2 7 

1 8 

4.7k 

28ms 

NC 

NC 

NC 

220 

330 

5 

4 

1 

RF interface 

V_PA 

V_RF 

FLASH 

*IC601 

SYN_OUT 

SYN_EN 

SYN_CLK 

SYN_DATA 

SLOT_CTRL 

RADIO_EN 

RX_DATA 

TX_DATA 

RF_RSTN 

NC 

26 

27 

28 

29 

30 

31 

32 

33 

34 

35 

36 

37 

38 

39 

40 

41 

42 

43 

44 

45 

46 

47 

48 

49 

50 

GND2 

VCC1 

SYN_EN 

SYN_CLK 

SYN_DATA 

NC8 

NC9 

NC10 

RX_DATA 

NC11 

NC12 

NC13 

RF_RSTN 

NC14 

NC15 

NC16 

EROM_DATA 

EROM_CLK 

EROM_WP 

F_SYNC 

GND3 

R663 

NC 

R662 

NC 

R661 

VCC2 

INT0 

FLASH_SCK 

NC17 

NC7 

RADIO_EN 25 

NC6 24 

23 

NC5 

NC4 22 

NC3 21 

SLOT_CTRL 20 

KEYS_E 

51 

KEYS_D 

52 

KEYS_C 

53 

KEYS_B 

54 

KEYS_A 

55 

LINE_SZ 

56 

NC18 

57 

TX_DATA 19 

SYN_OUT 18 

NC2 17 

FLASH_CS 16 

15 

FLASH_SI 

FLASH_SO 14 

BELL 

58 

RLY 

59 

KEYIN6 

60 

KEYIN5 

61 

KEYIN4 

62 

KEYIN3 

NC 

R664 

63 

FLASH_RE 13 

*IC501 

KEYIN2 

64 

RSTN 12 

GND1 11 

VCCIN 10 

KEYIN1 

65 

GND4 

66 

VCC3 

67 

VDD 9 

XOUT 8 

T_CLK(JTAG) 

68 

T_MODE_SEL(JTAG) 

69 

13.824M 

XIN 7 

NC1 6 

T_D_IN(JTAG) 

X501 

70 

T_D_OUT(JTAG) 

71 

NC(TXMOD) 

NC19 

72 

SPP 3 

BMCCLK 

NC20 

73 

NC21 

74 

GNDPA 2 

SPN 

VCCPA 100 

99 

NC(HSOUT) 

98 

LOUT0 

LIN0 97 

VCCA 96 

HSMIP 95 

HSMIN 94 

GNDA 93 

IN 92 

DCIN2 91 

CID_INN 90 

CID_INP 89 

VREF 88 

DCIN1 87 

PDN 86 

GND5 85 

MSG_LED 84 

UART_RX 83 

UART_TX 82 

SDA 81 

SCL 80 

79 

BANK2 

INT1 78 

ANS_LED_1 77 

NC22 

75 

1000p 

*C473 

3.3V 

76 

C689 NC 

C688 NC 

C687 NC 

C504 100n 

JC 

JS 

JI 

JO 

JG 

4.0V 

L473 NC 

L472 NC 

*C459 

A K 

K0.018 

*D472 5.1V 

A K 

(for FLASH BOOT) 

*D473 5.1V 

SPP 

SPN 

3 

2 

(1) 

(2) 

(3) 

(4) 

*C457 

(5) 

K0.012 

4 1 

2.7k *C458 

(6) 

*RA452 K0.012 

(7) 

(8) 

(9) 

(10) 

(11) 

(14) 

(15) 

(16) 

MSG_LED 

ANS_LED 

KEY3 

KEY2 

KEY1 

KEYE 

KEYD 

KEYC 

KEYB 

Power ON 

(Reset) 

C671 

C672 

*R672 

*R671 

C661 

*R665 

NC 

NC 

2 1 

NC 

*SW661 

C660 

100n 

*WBX01 

10pin 

KEYS_E 

KEYS_D 

KEYS_C 

KEYIN3 

KEYIN2 

KEYIN1 

KEYS_B 

ANS_LED 

MEG_LED 

2APVCC 

NC: No Components 

Operation Unit interface 

90


VCCA 

1u 

C342 

C341 330u 

6.3 

C331 

K0.47 

VIN 

5 VOUT 4 

VDET 

6 NC2 3 

*RESET 

7 GND 2 

NC1 

8 CD 

1 

35 

47u 

C300 

C304 K1.0 

L300 

22uH 

R303 220 

220 

R304 

120 

R308 

K0.01 

C305 

C306 

1 ON/*OFF 5 

VIN 

2 VSS 

3 VOUT 4 

EXT 

DCDC_IC 

L361 

6.8u 

*L371 6.8u 

CHARGE+ 

*R363 NC 

CHARGE- 

L372 

NC 

C301 

NC 

DCP2 

F301 

3.0A DCP 

R178 

1k 

MIP 

*MIC1 

MIN 

*R134 1k 

2.2k 

C176 10u 

R171 22 

R176 

R175 560 100 

C174 C172 

NC 1000p 

R172 100k 

C171 

NC 

R166 NC 

C170 NC 

R165 27k 

C169 NC 

C168 2.2u 

R167 27 R163 

12 

C166 C163 C162 

NC 

NC NC 

R162 

C164 NC 

47k 

R168 820 R160 82 

C173 

K0.22 

*R157 

NC 

0.01u 

C142 

R141 

100k 

*C132 K0.01 

R122 390k 

L101 33u RX 

L102 

DCM2 

P101 22 

C113 

0.68 

R113 

10k 

47k 

1 

NC 

D300 

2 

3 

4 

2 

1 

Q300 

16 

100u 

NC 

R371 

12 

R372 

C308 K0.1 

*R373 NC 

*L362 

470n 

D301 

NC 

C456 

*RA451 

*C452 

100n 

1 

2 

C179 

NC 

D153 

A K 

R154 

1k 

C178 

22n 

*D133 

A K 

E 

Q171 

C 

B 

R181 390 R182 56 

C181 

0.1u 

C165NC 

C182 

C 

Q161 

E 

R164 

2.7k 

NC 

C183 

B 

NC 

R161 

100k 

C184 

1u 

NC 

C160 

NC 

C167 

R15110M 

10n 

NC 

C152 

*R156 

NC 

*Q156 

C 

B 

NC 

R155 

E 

D142 NC 

A K 

2.2k 

R145 

NC 

R144 

C141 

NC 

R142 

(3216) 

C143 NC 

Q142 

B 

2.7k 

C 

E 

1M 

*R133 

D361 

A K 

22V 

C101 680p 

3 

4 

C102 

R114 

D101 

2 

1 

680p 

C111 

0.047 

C112 

0.047 

R121 390k C121 680p 

C122 680p 

*SA102 

300V 

33u 

TX 

*C115 NC 

*R115 

NC 

SA103 

300V 

*SA101 

NC 

DCM 

L1T 

L1R 

Q111 

E 

B 

C 

A K 

D113 

R111 

R112 

100k 

100k 

B 

E 

4.0V 

(1) 

(2) 

3.3V 

IC331 

4.0V CONVERTOR 

IC300 

6.5~11V 

REFERENCE 

1XX : TEL LINE 

3XX : POWER, CHARGE 

4XX : RESET, MIC, SP 

5XX : DSP, RF I/F 

6XX : FLASH, KEY, LCD 

7XX : RF(2.4G) 

8XX : RF(5.8G) 

(3) 

(4) 

(5) 

(6) 

(7) 

*C455 

1p 

(8) 

(9) 

(10) 

(11) 

(12) 

(13) 

*C454 1p 

RX 

120mVp-p 

RF_GND 

DIGITAL_GND 

TX 

800mVp-p 

TX 

80mVp-p 

3.3M 

R152 

D143 25V 

C 

*Q141 

10M 

*R131 

CID 

CHARGE PAD 

CHG electrostatic GND 

SP electrostatic GND 

Test Signal 

Frequency: 1kHz 

Rx 

(MIC Mute: ON) 

-25dBm/600 IN 

100mVp-p 

Tx 

-10dBm/600 

700mVp-p 

(14) 

(15) 

(16) 

Bell detection 


KX-TG6121/6122/6123LA SCHEMATIC DIAGRAM (Base Unit) 

91


14.3. Schematic Diagram (Base Unit_RF Part) 

(1) 

4.0V 

(2) 

L873 3.3nH 

10p 

C876 

C877 1u 

R846 NC 

5.8GHz TX 

L872 

2.2nH 

C2P 

C805 

C806 1u 

C719 

NC 

C717 B0.5p 

C713 

C4P 

ANT1 

ANT2 

C811 

C821 

C1P 

C1P 

7 VDD_LNA1 

8 GND_ISO_5 

9 VDD_LNA2 

10 GND_ISO_6 

C803 NC 

11 GND_ISO_7 

12 

C721 C1p 

LNA_OUT 

C841 NC 

R722 NC 

C842 NC 

R723 NC 

L721 NC 

C722 

NC 

C723 C4P 

C801 

C4P 

C873 

L822 1.5nH 

L812 1.5nH 

C871 

C718 

C716 

B0.1P 

NC 

0.2p 

0.2p 

2 

2 

FL811 

5.8GHz_LPF 

4 

1 

3 

FL821 

5.8GHz_LPF 

4 

1 

3 

IC801 

1 GND_ISO_1 

2 ANT1 

3 GND_ISO_2 

4 GND_ISO_3 

5 ANT2 

6 GND_ISO_4 

C802 NC 

25 

24 

23 

22 

21 

20 

19 

TRSW_IN 

GND_ISO_10 

GND_ISO_9 

PA_OUT 

GND_ISO_8 

VDD_PA 

PGND 

PA_IN 

PA_EN 

ANTSEL_A 

ANTSEL_B 

LNA_EN 

LNA_GAIN 

L725 1.5nH 

18 

17 

16 

15 

14 

13 

R844 470 

R843 470 

C843 C4p 

C4p 

C844 

C845 C4p 

C726 

5.8GHz RX 

L724 

C724 3.3nH 

B0.2p 

C2p 

R847 

NC 

C725 

B0.2P 

C727 B0.2p 

(3) 

(4) 

(5) 

(6) 

(7) 

(8) 

(9) 

(10) 

92


L878 

NC 

(1) 

C0.5P 

C0.5P 

V_PA 

C766 1u 

C764 

K0.47(1608) 

C762 C2P 

V_RF 

ATESTP 

ATESTN 

C781 

J100P 

BCLK 

L782 

1uH(1005) 

C782 

J120P 

C878 

C879 

(2) 

3.0 V IC761 

4.0 V 

C768 C4P 

L768 2.2nH 

NC 

4 CE 3 

L761 NC 

VSS 2 

VRF(3.0V) 

VOUT 

5 VIN 1 

C763 NC 

C761 NC 

K0.1u 

SYN_OUT 

NC 

L711 

1.8nH 

SYN_EN 

C714 

SYN_CLK 

SYN_DATA 

SLOT_CTRL 

RADIO_EN 

R746 390 

TX_DATA 

RX_DATA 

C732 

K0.1u 

C733 

NC 

C701 

C4P 

C702 

K0.1u 

C703 

K0.1u 

C711 

C4P 

C4P 

C704 

C705 

C706 

K0.1u 

C715 

NC 

33 

1 TX 

2 PAEN 

3 ANTSEL_A 

4 ANTSEL_B 

5 LNAEN 

6 RXGAIN 

7 RXp 

8 RXn 

VDD_PA 

VCC_PA 32 

VCC_PLLD 31 

VCC_VCO 30 

VCC_PLLA 29 

ATESTP 28 

ATESTN 27 

REFIN 26 

PGND 

25 

9 VCC_FE 

10 VCC_IF 

11 VDD_IF 

12 TEST_DIG 

13 *RST 

14 GND_DIG 

15 VDD_DIG 

16 VCC_DIG 

24 

DTEST 

23 

SYN_OUT 

22 

SYN_EN 

21 

SYN_CLK 

20 

SYN_DATA 

19 

SLOT_CTRL 

18 

RADIO_EN 

17 

TR_DATA 

NC 

R747 

RF_RSTN 

C734 1u 

C746 

K0.01 

C712 1u 

R740 390 

R741 390 

(3) 

(4) 

(5) 

(6) 

(7) 

(8) 

(9) 

(10) 

IC701 

C741 

4p 

C742 

4p 

C743 

4p 

R742 220 

R743 390 

R744 1k 

R745 1k 

C731 K10u(2125) 

GND 

SHIELD 


KX-TG6121/6122/6123 SCHEMATIC DIAGRAM (Base Unit RF Part) 

93


14.4. Schematic Diagram (Base Unit_Operation) 

ANS 

MSG 

VCC 

2APVCC 

MEG_LED 

ANS_LED 

KEYS_B 

KEYIN1 

KEYIN2 

KEYIN3 

KEYS_C 

KEYS_D 

KEYS_E 

LED902 

LED901 K 

K 

A 

A 

ERASE 

1 2 

REC CHK 

2 1 2 1 

UP 

1 2 

ANS1 

1 2 

MSG2 

1 2 

RPT 

1 2 

STOP 

1 2 

MSG1 

1 2 

DOWN 

1 2 

SKIP 

1 2 

LOCAT/INT 

1 2 


KX-TG6121/6122/6123 SCHEMATIC DIAGRAM (Base Unit_Operation) 

94

Memo 


95

LED551 

LED552 

LED553 

LED554 

LED555 

LED556 

LED557 

LED561 

5 

6 

3 

2 

1 


14.5. Schematic Diagram (Handset_Main) 

RF circuit 

BCLK 

RXI 

TXO BCLK 

R540 NC 

C540 

K0.1 

TX_DATA 

SLOT_CTRL 

TX_DATA 

SLOT_CTRL 

ANT1 

ANT2_HOT 

ANT2 

ANT1_HOT 

NC 

RF_POWER 

RADIO_EN 

RF_RSTN 

SYN_DATA 

SYN_EN 

SYN_CLK 

SYN_OUT 

C564 NC 

C- 

4 ON/*OFF 

RX_DATA 

C+ 

GND 

V_PA 

V_RF 

GND 

ANT1_GND 

ANT2_GND 

Charge pump for 

LCD back light 

IC561 

VOUT 

VIN 

C562 

NC 

NC 

C565 

5.0V 

NC 

R560 

C519 

K0.1 

C386 

STB_A 

NC 

RX_DATA 

RF_POWER 

RF_RSTN 

SYN_DATA 

BACK 

DOWN 

MENU 

UP 

NEXT 

SYN_EN 

SYN_CLK 

SYN_OUT 

STB_B 

FLASH 

SYA 

HOLD 

LEFT 

RIGHT 

1 8 

SI SO 

2 7 

SCK GND 

3 6 

*RESET VCC 

4 5 

*CS *WP 

IC546 NC 

* 7 4 

1 

0 

STB_C 

8 

9 

STB_D 

TALK 

5 

6 

OFF 

RF control line 

Flash memory for booting 

STB_E 

SP 

2 

3 

PAUSE 

R546 

NC 

TE 

R547 

NC 

C546 

KIN_5 

KIN_4 

KIN_3 

KIN_2 

KIN_1 

NC 

TX_EN 

K0.1 

C504 

C511 NC 

RF_RSTN 

25 

24 

RF_POWER 

23 

26 

27 RADIO_EN 

HEAD_DET 

28 

29 GND6 

30 VCC1 

31 SYN_EN 

32 SYN_CLK 

SYN_DATA 

CI 

22 

SLOT_CTRL 

TX_DATA 

21 

20 

SYN_EN 

SYN_CLK 

SYN_DATA 

33 

34 NC4 

35 TX_EN 

RX_DATA 36 NC5 

37 RX_DATA 

38 NC6 

39 CHG_DET 

40 NC7 

41 LCD_BACK_LIGHT 

42 NC8 

43 CHG_CTL 

44 NC9 

DB4 

45 DB4 

DB5 

46 DB5 

DB6 

47 DB6 

DB7 

48 DB7 

49 GND7 

50 VCC2 

RESETB RESETB 

DSP Part (control circuit) 

SYN_OUT 

19 

18 

NC 

R510 

17 

16 

K1.0 

C510 

15 

14 

13 

RF_RSTN 

NC3 

RF_POWER 

NC2 

SLOT_CTRL 

TX_DATA 

SYN_OUT 

BL_LED 

FL_CS 

FL_DI 

FL_DO 

FL_RST 

RST 

GND5 

GND4 

GND3 

GND2 

VCCIN 

VDD 

XOUT 

XIN 

NC1 

BCLK 

SPP2 

GND1 

12 

K0.01 

C512 

11 

10 

9 

K0.1 

C515 

8 

7 

C514 10uF6.3V 

51 FL_CLK 

52 CI 

53 NC10 

54 NC11 

55 ANT_LED 

56 LCD_RS 

57 RW_WR 

58 E_RD 

59 LCDPOW 

60 NC12 

61 NC13 

62 NC14 

63 STB_E 

64 STB_D 

65 STB_C 

66 STB_B 

67 STB_A 

68 GND8 

69 VCC3 

70 TCK 

71 TMS 

72 TDI 

73 TDO 

74 KIN_1 

75 KIN_2 

LCD_RS 

RW_WR 

E_RD 

IC501 

STB_E 

STB_D 

STB_C 

STB_B 

STB_A 

6 

5 

4 

3 

2 

1 

RST 

D10P 

C502 

100 

SPPN 

99 

VCC4 

98 

SPN 

97 

SPP1 

96 

IBAT2 

95 

HSM 

94 

VCCA 

93 

GND10 

92 

MICBIAS 

91 

MIM 

90 

MIP 

89 

VREF 

88 

IBAT1 

87 

PDN 

86 

GND9 

85 

EE_WP 

84 

UART_RX 

83 

UART_TX 

82 

EE_SDA 

81 

EE_SCL 

80 

FB2 

79 

FB1 

78 

KIN_5 

77 

KIN_4 

76 

KIN_3 

KIN_1 

KIN_2 

TCK 

TMS 

TDI 

TDO 

X501 

13.824MHz 

R525 

R501 1M 

D10P 

C501 

K0.1 

C506 

KIN_3 

KIN_4 

KIN_5 

NC 

NC 

C525 

(1) 

(2) 

(3) 

(4) 

(5) 

RA551 

330 

1 8 

2 7 

3 6 

4 5 

Q562 

RA552 

220 

1 8 

2 7 

3 6 

4 5 

Q563 

100 

R561 

Top View 

Q561 

NC 

C563 

NC 

R564 

LCD_RS 

CN3 

22 

RW_WR 

CN3 

21 

E_RD 

CN3 

20 

CN3 

19 

DB7 

CN3 

18 

DB6 

CN3 

17 

DB5 

CN3 

16 

DB4 

CN3 

15 

CN3 

14 

NC 

C577 

CN3 

13 

C573 K0.1 

NC 

C576 

CN3 

12 

NC 

C575 

CN3 

11 

NC 

C574 

CN3 

10 

CN3 

9 

8 CN3 

R573 820K R572 430K 

(1%) (1%) 

CN3 

7 

C572 

K0.47 

CN3 

6 

CN3 

5 

K0.47 C571 

CN3 

4 

CN3 

3 

RESETB 

K0.47 C570 

CN3 

2 

CN3 

1 

20ms 

Power ON 

(Reset) 

10k 

R534 

K0.1 

C596 

K0.1 

C541 

1 8 

2 7 

3 6 

4 5 

RA501 

4.7k 

R542 2.2k 

R541 10k 

IC541 

EEPROM-16K 

1 8 

A0 VCC 

2 7 

A1 WP 

3 6 

A2 SCL 

4 5 

VSS SDA 

E 

C 

EEPROM 

Writing 

protection TR 

B 

Q543 

J100P 

C542 

K0.1 

C544 

(6) 

KEY_BACKLIGHT 

(Amber) 

LCD_BACKLIGHT 

(Amber) 

ANT_LED 

(Amber) 

White_LED (NC) 

LCD_BACKLIGHT 

Parameter saving EEPROM 

(7) 

(8) 

(9) 

(10) 

(11) 


96

2 

1 

2 

1 

2 

1 

2 

1 

1 

2 


TEST SIGNAL 

FREQUENCY: 1kHz 

Voice circuit 

L427 

L426 

NC 

NC 

SPPP SPPN 

D427 

D426 

1 

+ 

2 

- 

SP_PHONE 

SP phone RX 


1.8Vp-p/8 

(Vol. Max) 

(1) 

(2) 

(3) 

R431 NC 

R436 1k 

R437 100k 

L431 

L432 

NC 

NC 

1 

2 

3 

CN431 

NC 

C507 

NC 

C505 

NC 

C435 6.3V 

K10u 

L434 NC 

NC 

NC 

4 

5 

Headset jack 

C436 

C432 

SPP 

C508 

6.3V 10uF 

R433 

1k 

C433 K6800P 

R435 

RA403 

3 2 

4 1 

68 

D424 

C422 NC 

C421 

D423 

SPM 

+ 

- 

RECEIVER 

R508 10 

C503 K1.0 

C594 

NC 

C509 

NC 

C526 

K0.1 

R505 NC 

R506 NC 

R507 NC 

R509 100k 

RX 

TX 

UART 

PDN 

33k 

R526 

C243 

NC 

NC L511 

R417 390 R434 2.2k 

K1.0 

R375 

NC 

6.3V 10uF 

C417 

C416 K5600P 

C414 

K6800P 

RA401 

3 2 

4 1 

1k 

C415 

RA402 K6800P 

3 2 

4 1 

2.2k 

R374 220k 

C374 K0.1 

D412 

1 2 

D413 

1 2 

IC374 

2.0V_Reset 

1 OUT 

VSS 

2 VDD 

NC 

4 

3 

MICM MICM-1 

2 

1 

MIC 

MICP MICP-1 

R543 270k 

NC 

C543 

VBAT1 VBAT2 

R370 

1.2 

R366 3.3k 

C 

Q361 

L351 

NC 

CHG1 

K0.1 

C377 

2.2M 

R377 

1.0M 

R376 

K0.1 

C379 

2.2M 

R379 

1.0M 

R378 

VOUT 

1 

2 VDD 

EXT 

3 

4 

VSS 

ON/*OFF 

3.1V 

IC373 

5 

BATTP 

BATTN 

F301 

5.6n 

K0.1 

C362 

VSS1 VSS2 

R369 

33k 

R368 

33k 

R367 

120 

B 

C434 

(4) 

NC 

K1.0 

Handset RX 


590mVp-p/150 

(Vol. Max) 

(5) 

C371 

AVR, PDN_IC 

IC371 

NC ONOFF 

4 3 

VSS 

2 

VOUT VIN 

5 1 

2.7V 

2.7V 3.1V 

C413 

NC 

C412 C1p 

C2p 

C411 

L412 

NC 

L413 

NC 

Handset TX 

-33dBm/600 

88mVp-p 

SP phone TX 

-43dBm/600 

30mVp-p 

IN 

IN 

(6) 

DC/DC step-up circuit 

IC372 

3 K A 4 

L373 

10uH 

D361 

K A 

E 

Charging control circuit 

(7) 

(8) 

(9) 

(10) 

(11) 

C373 330u 6.3 

C372 

K1.0 

2 S 

1 G 

NC 

D 

Charging detection 

5 

6 

C365NC 

C361330u 6.3 

K0.1 

C366 

NC 

C364 

Q364 

C 

B 

D364 

A K 

L4.3V 

E 

K0.1 

C363 

Q362 

B 

560 

R362 

R361 47k 

R363 47k 

C 

E 

C 

E 

Q531 

NC 

R354 

B 

NC 

C354 

R531 NC 

NC 

R532 

NC 

C353 

L352 NC 

K0.1 

C531 

A K 

C351 

C352 

NC 

D531 

NC 

NC 

CHG2 


KX-TGA610 SCHEMATIC DIAGRAM (Handset_Main) 

97


14.6. Schematic Diagram (Handset_RF Part) 

(1) 

3.1V 

(2) 

L873 3.3nH 

10p 

C876 

C877 1u 

R846 NC 

5.8GHz TX 

L872 

2.2nH 

C2P 

C805 

C806 1u 

C719 

NC 

C717 B0.5p 

C713 

C4P 

ANT1 

ANT2 

NC 

L812 

C841 NC 

R723 NC 

C842 NC 

L721 NC 

C722 NC 

C723 C4P 

C801 

C4P 

C873 

C871 

C718 

C716 

B0.1P 

NC 

L822 NC 

0.2p 

0.2p 

R812 

0 

R822 

0 

FL811 

5.8GHz_LPF 

2 

4 

1 

3 

FL821 

5.8GHz_LPF 

2 

4 

1 

3 

C811 C4p 

C821 C4p 

IC801 

1 GND_ISO_1 

2 ANT1 

3 GND_ISO_2 

4 GND_ISO_3 

5 ANT2 

6 GND_ISO_4 

25 

24 

23 

22 

21 

20 

19 

C802 1u 

TRSW_IN 

GND_ISO_10 

GND_ISO_9 

PA_OUT 

GND_ISO_8 

VDD_PA 

PGND 

PA_IN 

PA_EN 

ANTSEL_A 

ANTSEL_B 

LNA_EN 

LNA_GAIN 

7 VDD_LNA1 

8 GND_ISO_5 

9 VDD_LNA2 

10 GND_ISO_6 

11 GND_ISO_7 

12 

C721 C1p 

LNA_OUT 

1.5nH 

C803 1u 

L725 

18 

17 

16 

15 

14 

13 

R844 470 

R843 470 

R722 0 

C843 C4p 

C4p 

C844 

C4p 

C845 

C726 

5.8GHz RX 

L724 

C724 3.3nH 

B0.2p 

C2p 

R847 

NC 

C725 

B0.2P 

C727 B0.2p 

(3) 

(4) 

(5) 

(6) 

(7) 

(8) 

(9) 

(10) 

98


L878 

NC 

(1) 

C0.5P 

C0.5P 

V_PA 

C766 1u 

C764 

K0.47(1608) 

C762 C2P 

V_RF 

ATESTP 

ATESTN 

C781 

J100P 

BCLK 

L782 

1uH(1005) 

C782 

J120P 

C878 

C879 

(2) 

2.8 V IC761 

3.1 V 

C768 C4P 

L768 2.2nH 

NC 3 

4 ON/OFF 

L761 NC 

VSS 2 

VRF(2.8V) 

VOUT 

5 VIN 1 

C763 NC 

C761 NC 

RF_POWER 

K0.1u 

C4P 

K0.1u 

SYN_OUT 

NC 

L711 

1.8nH 

SYN_EN 

C714 

SYN_CLK 

SYN_DATA 

SLOT_CTRL 

RADIO_EN 

R746 390 

TX_DATA 

RX_DATA 

C701 

C4P 

C702 

K0.1u 

C732 

K0.1u 

C703 

K0.1u 

C711 

C4P 

C704 

C705 

C706 

C715 

NC 

33 

1 TX 

2 PAEN 

3 ANTSEL_A 

4 ANTSEL_B 

5 LNAEN 

6 RXGAIN 

7 RXp 

8 RXn 

VDD_PA 

VCC_PA 32 

VCC_PLLD 31 

VCC_VCO 30 

VCC_PLLA 29 

ATESTP 28 

ATESTN 27 

REFIN 26 

9 VCC_FE 

10 VCC_IF 

11 VDD_IF 

PGND 

12 TEST_DIG 

13 *RST 

25 

24 

DTEST 

23 

SYN_OUT 

22 

SYN_EN 

21 

SYN_CLK 

20 

SYN_DATA 

19 

SLOT_CTRL 

18 

RADIO_EN 

17 

TR_DATA 

14 GND_DIG 

15 VDD_DIG 

16 VCC_DIG 

NC 

R747 

RF_RSTN 

C734 1u 

C746 

K0.01 

C712 1u 

R740 390 

R741 390 

(3) 

(4) 

(5) 

(6) 

(7) 

(8) 

(9) 

(10) 

IC701 

C741 

4p 

C742 

4p 

C743 

4p 

R742 220 

R743 390 

R744 1k 

R745 1k 

C731 K10u(2125) 

C733 

1u 

GND 

SHIELD 


KX-TGA610 SCHEMATIC DIAGRAM (Handset RF Part) 

99


14.7. Schematic Diagram (Charger Unit) 

TP3 

1 

F1 

A 

K 

R1 10 

TP2 

2 

D1 

J1 

TP4 

TP1 

G 

SCHEMATIC DIAGRAM (Charger Unit) 

100

15 Printed Circuit Board 

15.1. Circuit Board (Base Unit_Main) 

15.1.1. Component View 


ANT2_HOT2 

3.0A 

F301 

ANT1_HOT2 

P101 

L101 

SA102 

L102 

SA101 

C101 

C301 

C305 

C102 

SA103 

C306 

R308 IC300 

R303 

3 1 

R304 

4 5 C308 

Q300 C304 

C115 

L300 

D301 

R372 

C300 

R371 

SHIELD 

C845 

C841 C844 

C842 C843 

C703 C746 

C731 

C733 

C734 

R746 

R747 

R722 

R723 

L721 

C723 

C722 

C732 

L822 

C726 C724 C716 

C717 

C702 R847 

C701C727 

9 

16 

C803 

C802 

L724 

8 

FL821 

C802 

L725 

C721 

7 

12 

C725 

C714 

C713 

IC701 

1 

17 24 

6 

C821 

IC801 

R843 

R844 

L711 

C704 

C811 

1 

13 18 

32 

C718 

C806 

C705 

C781 

C719 

C711C715 

C712 

FL811 

24 

19 

L782 

C805 

C871C873 

R846 

C706 

L768 

C782 

L878 

L872 

L873 

IC761 

C764 1 

25 

L812 

C876 

C877 

C878 

C879 

C768 

C766 

C763 

V_PA (4.0V) 

VRF (3.0V) 

D361 

D473 

D472 

R363 

R373 

L371 

L362 

L473 

L472 

L361 

L372 

D101 

C166 

C142 

E 

D143 C141 

C342 

D142 

5 

R161 R162 

R145 

Q142 

C163 C162 

E 

C143 

R144 

8 

Q161 

Q141 

R165 

C165 

R141 

R160 

R115 

C167 

C331 

C160 

C341 

R664 

4 

E R164 R168 

C164 

75 

1 

C161 

C173 C174 

R594 76 

100 

R592 

C459 

R171 

E 

R591 

C352 

C178 

R163 

C515 

RA452 

C518 

C516 

C458 

C671 C672 

C454 C517 

R167 

SW661 

R671 R672 

C456 C455 

WBX01 

MIC+ MIC- RA451 

KEYIN2 

KEYS_E KEYS_C KEYS_B MEG_LED 

1 

10 

C452 

R166 

C171 

C168 

C169 

R142 

C179 

C170 

R178 

C172 

C176 

R172 

IC331 

R421 

R176 

R175 

Q171 

KX-TG4311/21H 

1 

R422 

R662 

RST 

D300 

KEYS_D KEYIN3 KEYIN1 ANS_LED 2APVCC 

C689 

R593 

L501 INT0 

50 

51 

R663 

R661 

C687 

C688 

C504 

R745 

R744 

C743 

R743 

R742 

C503 

C742 

C741 

R741 

IC501 

RXI 

R740 

PbF 

PQUP11551 

C762 

L761 

C761 

C521R521 

C501 

26 

25 

C457 

C381 

C531 

C513 

R509 

C509 

C472 

C473 

C471 C508 

C382 

L474 

C514 

X501 

L475 

A 

Vcc 3 

Digital Vcc E 

SP Vcc 

Analog Vcc D 

Reset 4 

KX-TG6121/6122/6123 CIRCUIT BOARD (Base Unit (Component View)) 

101


15.1.2. Bottom View 

DC 1 

ANT1_HOT 

ANT1_GND 

DCP2 

DCP 

POWER 

DCM 

ANT2_GND 

ANT2_HOT 

GREEN 

DCM2 

L1R 

RING 

TEL 

YELLOW 

TIP 

L1T 

BCK 

(13.824MHz) 

AGND 

US2BT 

DGND 

JG 

JS JC JI 

MIN 

C605 C604 

UGND 

C422 

JO 

MIP 

1 

4 

BCLK 

IC601 

TXO 

8 C601 

SPP 

SP 

SPN 

CHARGE+ 

CHG 

CHARGE- 

MIC- 

MIC+ 

R612 

IC611 

5 

R602 

R603 

8 

C603 C611 

R533 

UTX URX UVCC RA501 

5 

R611 

C612 

R665 

DVCC 

4 

1 

C661 

VCC 

INT1 

C660 

R157 

R155 

R156 

R131 

R134 

D133 

D153 

C132 

R154 

R133 

R112 

C152 

C120 

R152 

E 

Q111 

C112 

R151 

R114 

R181 R182 

E 

C181 

KEYB KEY1 KEY3/TE 

KEY2 

Q156 

C122 

C121 

R122 

R121 

D113 

C182 

C183 

R111 

C111 

C113 

R113 

C184 

PbF 

MIC1 

PNLP1008 

PNLP1007 

A 

INT1 5 

KX-TG6121/6122/6123 CIRCUIT BOARD (Base Unit (Bottom View)) 

102

15.2. Circuit Board (Base Unit_RF Part) 


C845 

C841 C844 

C842 C843 

C703 C746 

C731 

C732 

C733 

C734 

R746 

R747 

C702 R847 

C701C727 

C803 

C802 

R722 

R723 

L721 

C722 

L822 

C723 

C726 C724 

9 

16 

L724 

8 

FL821 

C802 

L725 

C721 

7 

12 

C716 

C725 

C714 

C713 

IC701 

1 

17 24 

6 

C821 

IC801 

R843 

R844 

C717 

L711 

C704 

C811 

1 

5 4 

1 3 

R745 

R744 

C743 

R743 

R742 

C742 

C741 

R741 

R740 

13 18 

32 

25 

C718 

C806 

L782 

L768 

L878 

C762 

L761 

C761 

C711C715 

C712 

C705 

C764 

C781 

C719 

FL811 

24 

19 

C805 

C871C873 

R846 

C706 

IC761 

C782 

L872 

L812 

L873 

C876 

C877 

C878 

C879 

C768 

C766 

C763 

V_PA (4.0V) 

VRF (3.0V) 

KX-TG6121/6122/6123 CIRCUIT BOARD (Base Unit_RF Part (Component View)) 

103


Memo 

104

15.3. Circuit Board (Base Unit_Operation) 



PbF 

PQUP11553Z 

PNLP1013Z 

KX-TG4321 / 6321 / 9331 / 9371H 

WBX01 

10 1 

A 

KX-TG6121/6122/6123 CIRCUIT BOARD (Base Unit_Operation (Component View)) 

105



REC 

CHK 

PbF 

KX-TG4321 / 6321 / 9331 / 9371H 

PNLP1013Z 

PQUP11553Z 

LED901 

ERASE 

UP 

ANS1 

LED902 

RPT 

MSG1 

MSG2 

SKIP 

STOP 

DOWN 

LOCAT/INT 

KEYS_E KEYS_C KEYIN2 KEYS_B MEG_LED 

MSG 

VCC 

ANS 

KEYS_D KEYIN3 KEYIN1 ANS_LED 2APVCC 

A 

KX-TG6121/6122/6123 CIRCUIT BOARD (Base Unit_Operation (Bottom View)) 

106

15.4. Circuit Board (Handset_Main) 





PQUP11557Z 

ANT1_HOT 

ANT1_GND 

PbF 

ANT2_HOT 

ANT2_GND 

C845 

L822 

C731 

C703 C746 

C841 C844 

R746 C733 

C702 

C842 C843 

R747 C734 C732 

C701 R847 

C722 

C727 

7 

24 

IC801 

R722 

C726 

9 

16 

C803 

R822 

FL821 

6 

C723 

C724 C716 

L724 

C802 

8 

C802 

12 

R723 

L725 

L721 

C721 

C725 

C714 

C713 

L711 

C704 C711C715 

C718 

C705 C712 

C806 

L768 

C706 

L878 

IC701 

1 

17 24 

C821 

C811 

C717 

1 

R844 

C719 

C805 

R846 

13 18 

R843 

32 

FL811 R812 

19 

C871 C873 

L872 

L812 

C878 L873 

5 4 

IC761 

C764 

25 

1 3 

C781 

L782 

C782 

C763 

C876 

C877 

C879 

C768 

C766 

2.8 V 

VRF 

IC372 

IC373 

D427 

D426 

5 

L431 

C435 

CN431 

R745 

R744 

C743 

R743 

R742 

C742 

C741 

R741 

R740 

C762 

L761 

C761 

PNL-P1015 

C577 

C576 

C575 

C574 

C572 

C573 

R573 

R572 

C571 

C570 

SP_PHONE 

6 

L373 

C362 

1 

4 

4 

5 

3 

C386 

3 

C372 

1 

L427 

L426 

C434 

SPPP 

SPPN 

1 

3.1 V 

V_PA 

L434 

C361 

C373 

R437 C436 

R436 R435 

2 

C432 

IC374 

1 

L432 

2.7V 

Vcc DSP 

CI 

VBAT1 

2.34~3.6V 

(Battery) 

PDN 

(Power Down) 

C374 

IC371 

TDI 

C509 

R374 

RECEIVER 

RA403 

1 

D423 

R375 

VBAT2 VBAT1 TX 

VSS2 VSS1 RX 

C541 

R509 R507 

R505 R506 

BATTP 

E 

Q561 

RA501 

TDO 

TMS 

TE 

TCK 

C596 CI 

C365 

C243 

C371 L511 

C565 

C564 

IC541 

L351 

R564 

C543 

PDN 

C542 

R376 

R534 

C562 

C546 

TX_EN 

IC501 

R377 R526 

C526 

C377 

C503 

R369 

C364 

C416 

RA401 

C422 

C421 

D424 

C563 

5 

4 

R561 

R560 

1 

8 

1 

RA552 

IC561 

RA551 

C511 

C504 

50 

26 

51 

25 

R542 

R541 

IC546 

RXI 

R431 R547 

R546 

75 

1 

76 100 

C544 

R543 

E 

Q543 C594 

8 5 

1 4 

F301 

C366 

C353 

C363 

Q531 

E 

R531 

R532 

C506 

R508 

C508 

R417R434 R433 

R368 

R361 R367 

C531 

D531 

L413 

L412 

C411 

C414 

C415 

MICP-1 

RA402 

D364 

R370 Q364 

E R363 

E 

Q362 R362 

Q361 

C412 C413 

D412 D413 

C354 

C433 C505 

C512 C510 

C379 C519 

C507 

RST 

TXO 

R378 

R379 

R501 

R510 

R525 

E 

C540 

C417 

C502 

C501 

R540 

MICM-1 

R366 

D361 

L352 R354 

SPP SPM 

Q563 Q562 

C525 

C515 

E E 

BCLK 

BATTN 

X501 

MICM 

MICP 

RST 

(Reset) 

BCK 

(13.824 MHz) 

CHG1 

C351 

C352 

CHG2 

A 

KX-TGA610 CIRCUIT BOARD (Handset_Main (Component View)) 

107



LED561 



PQUP11557Z 

PbF 

CN3 

LCD 

LED557 

LED556 

LED555 

LEFT 

MENU 

RIGHT 

TALK 

UP 

OFF 

BACK 

NEXT 

SP 

DOWN 

PAUSE 

1 2 3 

LED551 

LED552 

4 5 6 

7 

8 

9 

LED553 

0 

LED554 

# 

FLASH 

HOLD 

MIC 

A 

KX-TGA610 CIRCUIT BOARD (Handset_Main (Bottom View)) 

108

15.5. Circuit Board (Handset_RF Part) 


C731 

C845 

C841 C844 

C703 C746 

C843 

C842 

C702 

C733 

R847 

C732 

C734 

R746 

R747 

C701 

L822 

C722 

C726 

C727 

C803 

R722 

R723 

9 

16 

R822 

L724 

C802 

C723 

C724 

8 

L725 

L721 

FL821 

C802 

C721 

7 

12 

C716 

C725 

C714 

C713 

IC701 

17 24 

6 

C821 

C717 

L711 

IC801 

R844 

C704 

C781 

C811 

C719 

C718 

1 

13 18 

R843 

1 

R745 

R744 

C743 

R743 

R742 

R741 

R740 

C711C715 

C712 

L782 

C806 

L768 

L878 

L761 

32 

C705 

C706 

C782 

L873 

C763 

C762 

C761 

25 

C764 

FL811 R812 

C805 

24 

19 

R846 

C871 C873 

L872 

C878 

5 4 

IC761 

1 3 

L812 

C876 

C877 

C879 

C768 

C766 

2.8 V 

VRF 

C742 

C741 

KX-TGA610 CIRCUIT BOARD (Handset_RF Part (Component View)) 

109


15.6. Circuit Board (Charger Unit) 


R1 

PbF 

PQLV30055 

PQLV30056 

D1 

J1 

PQUP11532Z 

A 

CIRCUIT BOARD (Charger Unit (Component View)) 


TP4 (GND) 

PbF PQLV30055 

PQLV30056 

TP4 

D1 

F1 

TP3 

J1 

1 

2 

PQUP11532Z 

A 

TP3 

CIRCUIT BOARD (Charger Unit (Bottom View)) 

110


16 Exploded View and Replacement Parts List 

16.1. Cabinet and Electrical Parts (Base Unit) 

Note: 

(*1) Refer to the spacer (No. 109) of Cabinet and Electrical Parts (Handset) (P.112) . 

111


16.2. Cabinet and Electrical Parts (Handset) 

Note: 

(*1) This cable is fixed by welding. Refer to How to Replace the Handset LCD (P.73). 

(*2) Stick the MAGNETIC SHIELD (No. 117) to the exact location described above. 

(*3) Attach the SPACER (No. 129) to the exact location described above. 

(*4) The rechargeable Ni-MH battery HHR-4EPT or HHR-4MPT is available through sales route of Panasonic. 

112

16.3. Cabinet and Electrical Parts (Charger Unit) 


113


16.4. Accessories and Packing Materials 

16.4.1. KX-TG6121LAT 

114

16.4.2. KX-TG6122LAT 


115


16.4.3. KX-TG6123LAT 

116

16.4.4. KX-TGA610LAT 


117


16.5. Replacement Parts List 

Note: 

1. The “RTL” marking indicates that its Retention Time is 

Limited. When production is discontinued, this item will 

continue to be available only for a specific period of time. 

This period of time depends on the type of item, and the 

local laws governing parts and product retention. At the 

end of this period, the item will no longer be available. 

2. Important safety notice 

Components identified by the mark indicates special 

characteristics important for safety. When replacing any 

of these components, only use specified manufacture's 

parts. 

3. The S mark means the part is one of some identical parts. 

For that reason, it may be different from the installed part. 

4. ISO code (Example: ABS-94HB) of the remarks column 

shows quality of the material and a flame resisting grade 

about plastics. 

5. RESISTORS & CAPACITORS 

Unless otherwise specified; 

All resistors are in ohms (Ω) k=1000Ω, M=1000kΩ 

All capacitors are in MICRO FARADS (µF) p=µµF 

*Type & Wattage of Resistor 


16.5.1.1. Cabinet and Electrical Parts 

Safety 

Ref. Part No. Part Name & Description Remarks 

No. 

1 PNKM1005W1 CABINET BODY PS-HB 

2 L0AA04A00028 SPEAKER 

3 PQHR11082Z GUIDE, SPEAKER POM-HB 

4 PNKE1001Y3 CASE, CHARGE TERMINAL PS-HB 

5 PNJT1003Z CHARGE TERMINAL 

6 PQJJ1T039X JACK, MODULAR 

7 K2ECYZ000001 JACK, DC 

8 PNBC1004Y1 BUTTON, ANSWER ON ABS-HB 

9 PNBC1005Y1 BUTTON, ERASE ABS-HB 

10 PNBC1006Y1 BUTTON, STOP ABS-HB 

11 PNBC1007Y1 BUTTON, LOCATOR ABS-HB 

12 PNBC1002Z2 BUTTON, NAVIGATOR KEY ABS-HB 

13 PNHR1001Z GUIDE, BUTTON PS-HB 

14 PNBC1001Z2 BUTTON, MESSAGE AS-HB 

15 PNJK1005Z KEYBOARD SWITCH 

16 PNLA1001Z ANTENNA 

17 PNLA1017Z ANTENNA 

Safety Ref. Part No. Part Name & Description Remarks 

No. 

18 PQMG10025W RUBBER PARTS, MIC 

19 PNKF1005Y1 CABINET COVER PS-HB 

20 PQHA10023Z RUBBER PARTS, FOOT CUSH- 

ION 

21 PNGT2211Z NAME PLATE 

22 PQHS10722Y SPACER, CUSHION LCD 

16.5.1.2. Main P.C. Board Parts 

Note: 

(*1) When you have replaced IC501 or IC661, adjust X501. 

Refer to Check and Adjust X501 (Base Unit) Frequency 

(P.74). 

(*2) When replacing IC701 or IC801, refer to How to 

Replace the LLP (Leadless Leadframe Package) IC 

(P.84). 

Safety 


No. 

PCB1 PNWP16121LAH MAIN P.C.BOARD ASS'Y 

(RTL) 

(ICs) 

IC300 C0DBAGZ00023 IC S 

IC331 C0DBFGD00017 IC 

IC501 C2HBBY000089 IC (*1) 

IC601 PNWIG6121LAH IC (*1) 

IC701 C1CB00002618 IC (*2) 

IC761 C0CBABE00029 IC 

IC801 C1CB00002629 IC (*2) 

(TRANSISTORS) 

Q111 2SC6054JSL TRANSISTOR(SI) 

Q141 B1ACGP000008 TRANSISTOR(SI) 

Q142 PQVTBF822T7 TRANSISTOR(SI) 

Q161 2SD0874AS TRANSISTOR(SI) 


Q300 B1ZBZ0000065 TRANSISTOR(SI) 

(DIODES) 

D101 PQVDMD5S DIODE(SI) 

D113 MA111 DIODE(SI) S 


D143 MANV250GEL DIODE(SI) 


D301 B0JCME000035 DIODE(SI) 


D472 MAZ805100L DIODE(SI) 

D473 MAZ805100L DIODE(SI) 

(COILS) 

L101 PQLQXF330K COIL S 

L102 PQLQXF330K COIL S 

L300 G1C220M00037 COIL S 

L361 G1C6R8MA0072 COIL 

L362 G1CR47J00005 COIL 




L711 MQLRF1N8DFB COIL 




L782 G1C1R0KA0096 COIL 





(IC FILTERS) 

FL811 J0E5797B0002 IC FILTER 


(COMPONENTS PART) 

RA451 D1H422220001 COMPONENTS PARTS 

RA452 D1H427220001 COMPONENTS PARTS 

RA501 D1H84724A013 RESISTOR ARRAY S 

(VARISTORS) 

118


Safety Ref. 

No. 

Part No. Part Name & Description Remarks 

SA102 PQVDDSS301L VARISTOR (SURGE S 

ABSORBER) 

SA103 J0LF00000026 VARISTOR (SURGE 

ABSORBER) 

(RESISTORS) 

R111 PQ4R10XJ104 100k S 

R112 PQ4R10XJ104 100k S 

R113 ERJ3GEYJ103 10k 




R131 PQ4R18XJ106 10M S 

R133 ERJ3GEYJ105 1M 



R142 PQ4R18XJ272 2.7k S 

R145 ERJ2GEJ222 2.2k 


R152 ERJ3GEYJ335 3.3M 


R160 ERJ3GEYJ820 82 



R163 ERJ12YJ120 12 

R164 ERJ3GEYJ272 1.5k 


R167 ERJ12YJ270 27 

R168 ERJ3GEYJ821 820 

R171 ERJ2GEJ220 22 


R175 ERJ3GEYJ561 560 

R176 ERJ2GEJ101 100 

R178 ERJ2GEJ102 1k 

R181 ERJ2GEJ391 390 

R182 ERJ2GEJ560X 56 

R303 ERJ3GEYJ221 220 

R304 ERJ3GEYJ221 220 

R308 ERJ3GEYJ121 120 

R372 ERG2SJ120 12 




R533 ERJ2GEJ472X 4.7k 

R671 ERJ2GEJ331 330 

R672 ERJ2GEJ221 220 

R740 ERJ2GEJ391 390 

R741 ERJ2GEJ391 390 

R742 ERJ2GEJ221 220 

R743 ERJ2GEJ391 390 



R746 ERJ2GEJ391 390 

R843 ERJ2GEJ471 470 

R844 ERJ2GEJ471 470 

(CAPACITORS) 

C101 F1B2H681A070 680p S 

C102 F1B2H681A070 680p S 

C111 F1J2A473A024 0.047 

C112 F1J2A473A024 0.047 

C113 PQCUV1A684KB 0.68 

C120 ECUE1H102KBQ 0.001 

C121 F1K2H681A008 680p 

C122 F1K2H681A008 680p 

C132 ECUV1H103KBV 0.01 

C142 ECUV1H103KBV 0.01 

C152 ECUV1H103KBV 0.01 

C161 EEE1EA100WR 10 

C168 PQCUV1A225KB 2.2 

C172 ECUE1H102KBQ 0.001 

C173 ECUV1A224KBV 0.22 

C176 PQCUV0J106KB 10 

C178 ECUE1C223KBQ 0.022 

C181 ECUE1A104KBQ 0.1 

C184 ECUV1A105KBV 1 

Safety Ref. 

No. 


C300 PSEA1VXF470 47 S 


C305 ECUV1H103KBV 0.01 

C306 ECEA1CKS101 100 S 

C308 ECUV1E104KBV 0.1 

C331 ECUV1A474KBV 0.47 

C341 ECEA0JK331 330 S 

C342 ECUV0J105KBV 1 






C454 ECUE1H010CCQ 1p S 


C457 ECUE1C123KBQ 0.012 

C458 ECUE1C123KBQ 0.012 

C459 ECUE1C183KBQ 0.018 

C473 ECUE1H102KBQ 0.001 




C508 ECUE1H6R0CCQ 6p 



















C712 ECUE0J105KBQ 1 


C716 F1G1HR20A561 0.2p 

C717 F1G1HR50A561 0.5p 

C718 F1G1HR20A561 0.2p 



C724 F1G1HR20A561 0.2p 

C725 F1G1HR20A561 0.2p 


C727 F1G1HR20A561 0.2p 







C746 ECUE1C103KBQ 0.01 


C764 ECUV1A474KBV 0.47 



C781 ECUE1H101JCQ 100p 










119


Safety Ref. Part No. Part Name & Description Remarks 

No. 

C873 F1G1HR10A561 0.1p 

C876 ECUE1H100DCQ 10p 


C878 ECJ0EC1H0R5C 0.5p 


L501 ERJ6GEY0R00 0 

(OTHERS) 

MIC1 L0CBAY000016 BUILTIN-MICROPHONE 

E1 PNMC1001Z MAGNETIC SHIELD, CASE 

E2 WBX10SH-5GG LEAD WIRE, PARALLEL WIRE 

P101 PFRT002 THERMISTOR (POSISTOR) S 

X501 H0J138500003 CRYSTAL OSCILLATOR S 

F301 K5H302Y00003 FUSE S 

Note: 

(*3) It can also be used as the antenna P.C. board (L). 

16.5.1.3. Operational P.C. Board Parts 

Safety 


No. 

PCB2 PNWP2TG4321H OPERATIONAL P.C.BOARD 

ASS'Y (RTL) 

(DIODES) 

LED901 PQVDBR1111C LED S 

LED902 PQVDBR1111C LED S 



Safety 


No. 

101 PNGP1002Z1 PANEL, LCD AS-HB 

102 PNHS1002Z TAPE, DOUBLE SIDED 

103 PNKM1006Y1 CABINET BODY PS-HB 

104 PNHR1005Z OPTIC CONDUCTIVE PARTS, PS-HB 

LED LENS 

105 PNGT2208Z N A M E P L A T E 

106 PNHS1001Z SPACER, RECEIVER NET 

107 L0AD02A00041 RECEIVER 

108 PQHG10756Z RUBBER PARTS, RECEIVER 

109 PQHS10722Y SPACER, CUSHION LCD 

110 PNBC1008Y1 BUTTON, TALK ABS-HB 

111 PNBC1009Y1 BUTTON, OFF ABS-HB 

112 PNBC1010Y1 BUTTON, SP ABS-HB 

113 PNBC1011Y1 BUTTON, PAUSE ABS-HB 

114 PNBC1003Z2 BUTTON, NAVIGATOR KEY ABS-HB 

115 PNJK1006Z KEYBOARD SWITCH 

116 PNHX1036Z COVER, LCD SHEET 

117 PNMC1007Z MAGNETIC SHIELD, ANTENNA 

118 PNJT1002Y CHARGE TERMINAL (R) 

119 PNJT1001Y CHARGE TERMINAL (L) 

120 PQHR11313Z GUIDE, SPEAKER ABS-HB 

121 PQHG10729Z RUBBER PARTS, SPEAKER 

122 L0AD02A00026 SPEAKER 

123 PQHS10622Z SPACER, SPEAKER NET 

124 PQJC10056X BATTERY TERMINAL 

125 PNKE1002Z2 COVER, EP CAP 

126 PNKF1006Z1 CABINET COVER ABS-HB 

127 PNQT1065Z LABEL, ATTENTION 

128 PNQT1469Z LABEL, BATTERY 

129 PQHS10561Y SPACER, BATTERY 

130 PNKK1001Z2 LID, BATTERY COVER ABS-HB 


Note: 

(*1) When you have replaced IC501 or IC541, adjust X501. 

Refer to Check and Adjust X501 (Handset) Frequency 

(P.74) and Adjust Battery Low Detector Voltage (Handset) 

(P.74). 

(*2) When replacing IC701 or IC801, refer to How to 

Replace the LLP (Leadless Leadframe Package) IC 

(P.84). 

(*3) When replacing the handset LCD, See How to 

Replace the Handset LCD (P.73). 

Safety 


No. 

PCB100 PNWPGA610LAR MAIN P.C.BOARD ASS'Y 

(RTL) 

(ICs) 

IC371 C0DBGYY00297 IC 

IC373 C0DBAYY00067 IC 

IC374 C0EBD0000355 IC 

IC501 C2HBBY000087 IC (*1) 

IC541 PNWIGA610LAR IC EEPROM (*1) 

IC701 C1CB00002618 IC (*2) 

IC761 C0CBCAC00253 IC 

IC801 C1CB00002629 IC (*2) 

(TRANSISTORS) 

Q361 B1ADGE000004 TRANSISTOR(SI) 



Q531 UNR921EJ0L TRANSISTOR(SI) 

Q543 UNR9215J0L TRANSISTOR(SI) 

Q561 UNR921MJ0L TRANSISTOR(SI) 

Q562 UNR92AVJ0L TRANSISTOR(SI) 

Q563 UNR92AVJ0L TRANSISTOR(SI) 

IC372 MTM767200LBF TRANSISTOR(SI) 

(DIODES) 

D361 MA2ZD0200L DIODE(SI) 

D364 MA8043L DIODE(SI) S 

LED551 B3ACB0000190 DIODE(SI) 








(COILS) 

L373 G1C100MA0283 COIL 





L782 G1C1R0KA0096 COIL 



F301 PQLQR2M5N6K COIL S 

(IC FILTERS) 



(COMPONENTS PARTS) 

RA401 D1H410220001 RESISTOR ARRAY 





RA552 EXB28V221JX RESISTOR ARRAY 

(VARISTORS) 

D412 D4ED1180A013 VARISTOR (SURGE 

ABSORBER) 


ABSORBER) 


ABSORBER) 

120


Safety Ref. 

No. 



ABSORBER) 


ABSORBER) 


ABSORBER) 

(RESISTORS) 


R362 ERJ2GEJ561 560 


R366 ERJ3GEYJ332 3.3k 

R367 ERJ2GEJ121 120 



R370 ERJ8GEYJ1R2 1.2 

R374 ERJ2GEJ224 220k 

R376 ERJ2GEJ105X 1M 

R377 ERJ2GEJ225 2.2M 

R378 ERJ2GEJ105X 1M 

R379 ERJ2GEJ225 2.2M 

R417 ERJ2GEJ391 390 


R434 ERJ2GEJ222 2.2k 


R437 ERJ2GEJ104 100k 


R508 ERJ3GEYJ100 10 

R509 ERJ2GEJ104 100k 




R542 ERJ2GEJ222 2.2k 

R543 ERJ2GEJ274 270k 

R561 ERJ2GEJ101 100 

R572 D1BB4303A055 430k 

R573 D1BB8203A055 820k 

R722 ERJ2GE0R00 0 

R740 ERJ2GEJ391 390 

R741 ERJ2GEJ391 390 

R742 ERJ2GEJ221 220 

R743 ERJ2GEJ391 390 



R746 ERJ2GEJ391 390 

R812 ERJ2GE0R00 0 

R822 ERJ2GE0R00 0 

R843 ERJ2GEJ471 470 

R844 ERJ2GEJ471 470 

(CAPACITORS) 

C361 F2A0J6810012 680 






C373 F2A0J3310068 330 







C414 ECUE1E682KBQ 0.0068 

C415 ECUE1E682KBQ 0.0068 

C416 ECUE1E562KBQ 0.0056 



C433 ECUE1E682KBQ 0.0068 







Safety Ref. 

No. 




C512 ECUE1C103KBQ 0.01 









C570 ECUV1C474KBV 0.47 

C571 ECUV1C474KBV 0.47 

C572 ECUV1C474KBV 0.47 

C573 ECUV1C104KBV 0.1 











C716 F1G1HR20A561 0.2p 

C717 F1G1HR50A561 0.5p 

C718 F1G1HR20A561 0.2p 

C721 ECUE1H010CCQ 1p 


C724 F1G1HR20A561 0.2p 

C725 F1G1HR20A561 0.2p 


C727 F1G1HR20A561 0.2p 








C746 ECUE1C103KBQ 0.01 


C764 ECUV1A474KBV 0.47 















C873 F1G1HR10A561 0.1p 





(OTHERS) 

MIC100 L0CBAY000018 MICROPHONE 

E101 L5DCBYY00016 LIQUID CRYSTAL DISPLAY 

(*3) 

E102 PQHX11378Z COVER, LCD COVER SHEET 

E103 PQHR11195Z TRANSPARENT PLATE, LCD PMMA-HB 

PLATE 

E104 PQHR11205Z GUIDE, LCD ABS-HB 

E105 PNMC1001Z MAGNETIC SHIELD CASE 

E106 PQWE10050Z BATTERY TERMINAL 

X501 H0J138500003 CRYSTAL OSCILLATOR 

121


Safety Ref. 

No. 

CN431 

K2HD103D0001 JACK 

16.5.3. Charger Unit 


Safety 


No. 

200 PNLC1001YT CHARGER UNIT ASS'Y without 

NAME PLATE (RTL) 

200-1 PNKM1015Y2 CABINET BODY PS-HB 

200-2 PNJT1010Z CHARGE TERMINAL 

200-3 PNKF1012Z1 CABINET COVER PS-HB 

200-4 PQHA10023Z RUBBER PARTS, FOOT CUSH- 

ION 

201 PNGT2209Z NAME PLATE 


Safety 


No. 

PCB200 PQWPTGA721CH MAIN P.C.BOARD ASS'Y 

(RTL) 

(DIODE) 

D1 B0JAME000095 DIODE(SI) 

(JACK) 

J1 K2ECYB000001 JACK 

(RESISTOR) 

R1 ERG2SJ100E 10 

(FUSE) 

F1 K5H302Y00003 FUSE 

16.5.4. Accessories and Packing Materials 

Note: 

(*1) You can download and refer to the Operating Instructions 

(Instruction book) on TSN Server. 

16.5.4.1. KX-TG6121LAT 

Safety 



No. 

A1 PQLV207T AC ADAPTOR (for Base 

Unit) 

A2 PQJA10075Z CORD, TELEPHONE 

A3 PNQX1881Z INSTRUCTION BOOK (*1) 

A4 PNQW1691Z LEAFLET, QUICK GUIDE 

A5 PNKE1003Z2 HANGER, BELT CLIP ABS-HB 

P1 PQPP10152Z PROTECTION COVER (for 

Base Unit) 

P2 XZB08X25B02 PROTECTION COVER (for 

Handset) 

P3 PNPK2054Z GIFT BOX 

16.5.4.3. KX-TG6123LAT 

Safety 


No. 


Unit) 

A202 PQLV209T AC ADAPTOR (for Charger 

Unit) 






Base Unit) 


Handset) 

P203 XZB13X19C03 PROTECTION COVER (for 

Charger Unit) 


P205 PNPD1269Z CUSHION 

16.5.4.4. KX-TGA610LAT 

Safety 


No. 

A301 PQLV209T AC ADAPTOR 




Charger Unit) 


Handset) 


16.5.5. Screws 

Safety 


No. 

A XTB26+8GFJ TAPPING SCREW 

B XTB2+8GFJ TAPPING SCREW 

16.5.6. Fixtures and Tools 

Note: 

When replacing the Handset LCD, See How to Replace 

the Handset LCD (P.73). 

Safety 

Ref. 

No. 

Part No. 

PQZZ430PIR 

PQZZ430PRB 

Part Name & Description Remarks 

TIP OF SOLDERING IRON 

RUBBER OF SOLDERING 

IRON 

16.5.4.2. KX-TG6122LAT 

Safety 


No. 


Unit) 

A102 PQLV209T AC ADAPTOR (for Charger 

Unit) 






Base Unit) 


Handset) 


Charger Unit) 


T.I 

KXTG6121LAT 

KXTG6122LAT 

KXTG6123LAT 

KXTGA610LAT 

122

KX-TG6122LAT KX-TG6123LAT KX-TGA610LAT - Panasonic

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