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Fabrication of silicon microring resonator with smooth sidewalls

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Chen et al.: <strong>Fabrication</strong> <strong>of</strong> <strong>silicon</strong> <strong>microring</strong> <strong>resonator</strong> <strong>with</strong> <strong>smooth</strong> <strong>sidewalls</strong><br />

Fig. 6 Cross-section view <strong>of</strong> the fabricated <strong>silicon</strong> waveguide.<br />

Fig. 7 Silicon <strong>microring</strong> <strong>resonator</strong> <strong>with</strong> <strong>smooth</strong> <strong>sidewalls</strong>.<br />

than 1:1 under chlorine plasma, and it needs around<br />

400-nm-thick resist for etching 300-nm-thick <strong>silicon</strong>.<br />

Moreover, we observed that in some runs, the e-beam resist<br />

became delaminated by the Cl 2 plasma, as shown in Fig. 4.<br />

Due to the higher etch selectivity <strong>of</strong> Si to HSQ than that <strong>of</strong><br />

Si to maN-2403, thinner e-beam resist can be applied when<br />

using HSQ as mask material to improve EBL resolution<br />

and reduce mask-edge roughness. The etch selectivity <strong>of</strong><br />

<strong>silicon</strong> to HSQ is higher than 5:1, so in our experiment, the<br />

thickness <strong>of</strong> HSQ is 90 nm, and that <strong>of</strong> maN-2403 is<br />

300 nm for 320-nm-thick <strong>silicon</strong> etching by optimized ICP<br />

processes.<br />

Using our Cr and maN-2403 mask etch process, the<br />

etched surface roughness <strong>of</strong> the <strong>silicon</strong> <strong>microring</strong> <strong>resonator</strong>s<br />

is relatively low, normally less than 10 nm. This is due<br />

in part to the formation <strong>of</strong> the CF x polymer on the <strong>silicon</strong><br />

sidewall, which tends to reduce striation roughness associated<br />

<strong>with</strong> ion bombardment. The process <strong>with</strong> the HSQ<br />

masks permits considerable process latitude due to the high<br />

selectivity <strong>of</strong> <strong>silicon</strong> to HSQ. However, it is worthy <strong>of</strong> notice<br />

that only Cl 2 was used as the etching gas since C 4 F 8<br />

corrupts HSQ under plasma, and the striation roughness<br />

induced by ion bombardment on the <strong>silicon</strong> <strong>sidewalls</strong><br />

should be taken into consideration. Using the normal process,<br />

the etched surface roughness was 20 to 30 nm. In our<br />

process, we optimized the etch recipe based on HSQ mask<br />

etching and achieved etched surface roughness <strong>of</strong> less than<br />

10 nm, as shown in Fig. 5, where Fig. 5b is a top view <strong>of</strong><br />

the edge <strong>of</strong> the <strong>silicon</strong> waveguide, indicating roughness less<br />

than 10 nm. The roughness was demonstrated by inspecting<br />

the ripple edge fluctuation on top <strong>of</strong> the waveguide structure<br />

in a vertical etched pr<strong>of</strong>ile <strong>with</strong> high-resolution SEM.<br />

Using this method, it is essential to make sure that the<br />

Table 1 Comparison <strong>of</strong> various fabrication processes.<br />

Process<br />

complexity<br />

Process<br />

latitude<br />

Sidewall<br />

roughness<br />

Cr mask Complicated Excellent Rough<br />

maN-2403 mask Simple Poor Smooth<br />

HSQ mask Simple Good Smooth<br />

sidewall angle <strong>of</strong> the waveguide is close to 90 deg, and that<br />

there is no etch undercut below the etch mask, as shown in<br />

Fig. 6, so that the sidewall roughness can be demonstrated<br />

by the edge fluctuation on top <strong>of</strong> the waveguide. Since the<br />

edge fluctuation in Fig. 5b is around 5 nm, sidewall<br />

roughness less than 10 nm was achieved. The advantage <strong>of</strong><br />

the SEM inspection is that it can provide an approximate<br />

value <strong>of</strong> the roughness for the whole waveguide structure,<br />

which is essential for evaluating the optical scattering loss,<br />

but the limitation is that the definite value <strong>of</strong> the roughness<br />

cannot be detected by this method.<br />

A comparison was carried out for the preceding three<br />

processes considering process complexity, process latitude,<br />

and sidewall roughness <strong>of</strong> the <strong>resonator</strong>. The results are<br />

shown in Table 1.<br />

Last, by controlling the mask-edge roughness and the<br />

etched surface roughness, <strong>silicon</strong> <strong>microring</strong> <strong>resonator</strong>s were<br />

fabricated <strong>with</strong> an average sidewall roughness <strong>of</strong> less than<br />

10 nm, as shown in Fig. 7, which was demonstrated by<br />

inspecting the edge fluctuation <strong>of</strong> the waveguide structure<br />

in a vertical etched pr<strong>of</strong>ile <strong>with</strong> high-resolution SEM.<br />

These high-quality results could be achieved <strong>with</strong> both<br />

maN-2403- and HSQ-based processes, where the process<br />

<strong>with</strong> maN-2403 features the advantage <strong>of</strong> CF x sidewall protection<br />

etching, while that <strong>with</strong> HSQ takes advantage <strong>of</strong> the<br />

higher EBL resolution <strong>with</strong> thinner e-beam resist.<br />

4 Conclusion<br />

The process details <strong>of</strong> the fabrication <strong>of</strong> <strong>silicon</strong> <strong>microring</strong><br />

<strong>resonator</strong>s based on EBL and ICP etching were presented.<br />

Silicon sidewall roughness <strong>of</strong> less than 10 nm was achieved<br />

by accurate control <strong>of</strong> the mask-edge roughness and the<br />

etched surface roughness. Processes employing three different<br />

mask materials were discussed, analyzed, and compared<br />

to achieve reduced process complexity, enhanced process<br />

latitude, and low sidewall roughness <strong>of</strong> the fabricated <strong>resonator</strong>s.<br />

Acknowledgments<br />

This work is partially supported by the National Basic Research<br />

Program <strong>of</strong> China 2006CB708310 and the Natural<br />

Science Foundation <strong>of</strong> China 60578048. The work <strong>of</strong><br />

DSC was supported in part by the CNRS.<br />

J. Micro/Nanolith. MEMS MOEMS 043060-4<br />

Oct–Dec 2009/Vol. 84<br />

Downloaded from SPIE Digital Library on 28 Dec 2009 to 162.105.81.60. Terms <strong>of</strong> Use: http://spiedl.org/terms

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