PDF data sheet - Panasonic Electric Works Europe AG
PDF data sheet - Panasonic Electric Works Europe AG
PDF data sheet - Panasonic Electric Works Europe AG
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Products marked are discontinued as of September 30, 2013<br />
SPECIFICATIONS<br />
■ Characteristics<br />
<strong>Electric</strong>al<br />
characteristics<br />
Mechanical<br />
characteristics<br />
Environmental<br />
characteristics<br />
Lifetime<br />
characteristics<br />
Unit weight<br />
Item Specifications Conditions<br />
Rated current<br />
0.3A/pin contact (Max. 5 A at total pin contacts)<br />
Rated voltage<br />
60V AC/DC<br />
■ Material and surface treatment<br />
Part name Material Surface treatment<br />
Molded<br />
portion<br />
Contact and<br />
Post<br />
AXE5,6<br />
Breakdown voltage<br />
150V AC for 1 min.<br />
No short-circuiting or damage at a detection current of 1 mA<br />
when the specified voltage is applied for one minute.<br />
Insulation resistance Min. 1,000M (initial) Using 250V DC megger (applied for 1 min.)<br />
Contact resistance<br />
Composite insertion force<br />
Composite removal force<br />
Contact holding force<br />
(Socket contact)<br />
Max. 90m<br />
Max. 1.200N/pin contacts pin contacts (initial)<br />
Min. 0.165N/pin contacts pin contacts<br />
Min. 0.20N/pin contacts<br />
Based on the contact resistance measurement method<br />
specified by JIS C 5402.<br />
Measuring the maximum force.<br />
As the contact is axially pull out.<br />
Ambient temperature –55C to +85C No freezing at low temperatures. No dew condensation.<br />
Soldering heat resistance<br />
Storage temperature<br />
Thermal shock resistance<br />
(header and socket mated)<br />
Humidity resistance<br />
(header and socket mated)<br />
Saltwater spray resistance<br />
(header and socket mated)<br />
H2S resistance<br />
(header and socket mated)<br />
Insertion and removal life<br />
LCP resin<br />
(UL94V-0)<br />
Copper alloy<br />
—<br />
Peak temperature: 260C or less (on the surface of<br />
the PC board around the connector terminals)<br />
300C within 5 sec. 350C within 3 sec.<br />
–55C to +85C (product only)<br />
–40C to +50C (emboss packing)<br />
5 cycles,<br />
insulation resistance min. 100M,<br />
contact resistance max. 90m<br />
120 hours,<br />
insulation resistance min. 100M,<br />
contact resistance max. 90m<br />
24 hours,<br />
insulation resistance min. 100M,<br />
contact resistance max. 90m<br />
48 hours,<br />
contact resistance max. 90m<br />
30 times<br />
20 pin contact type: Socket: 0.02 g Header: 0.01 g<br />
Infrared reflow soldering<br />
Soldering iron<br />
No freezing at low temperatures. No dew condensation.<br />
Conformed to MIL-STD-202F, method 107G<br />
Order Temperature (°C) Time (minutes)<br />
0<br />
1 –55−3 30<br />
2<br />
Max. 5<br />
+3<br />
3<br />
85 0 30<br />
4<br />
Max. 5<br />
0<br />
–55 −3<br />
Bath temperature 402C,<br />
humidity 90 to 95% R.H.<br />
Bath temperature 352C,<br />
saltwater concentration 51%<br />
Bath temperature 402C, gas concentration 31 ppm,<br />
humidity 75 to 80% R.H.<br />
Repeated insertion and removal speed of max. 200 times/<br />
hours<br />
Contact portion: Base: Ni plating Surface: Au plating<br />
Terminal portion: Base: Ni plating Surface: Au plating (except the terminal tips)<br />
The socket terminals close to the portion to be soldered have nickel barriers (exposed nickel portions).<br />
Soldering terminals: Sockets: Base: Ni plating Surface: Pd+Au flash plating (except the terminal tips)<br />
Headers: Base: Ni plating Surface: Au plating (except the terminal tips)<br />
ds_65316_en_a4s: 311012J<br />
3
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