Test-data validation - Semiconductor Wafer Test Workshop

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Correlation • Can correlation-wafer probing increase the quality of the production? • Test correlation wafer (golden wafer) – Before testing load the corresponding test-datalog – During probing compare each die location between “golden” parametric values and actual values • Correlate on bin-level (Pass/Fail) • Correlate to full parametric distribution level – Shape of distribution – Location of distribution (drift) June 7 to 10, 2009 IEEE SW Test Workshop 12
First time right vs. Retest • Ultimate goal: No/Limited retest • Reduce retest – Eliminate test variance – Retest for measurement fails only (no valid reading) • Retest recovery analysis June 7 to 10, 2009 IEEE SW Test Workshop 13
Page 1 and 2: June 7-10, 2009 San Diego, CA Test-
Page 3 and 4: Test-Data; where does it come from?
Page 5 and 6: Test-Data; where does it come from?
Page 7 and 8: Test-engineers are living on the ed
Page 9 and 10: Artifacts • “An artifact is the
Page 11: Add-up; synchronization @ multi-sit
Page 15 and 16: Thermal distribution Ring-carrier H
Page 17 and 18: Automatic Z-height correction • F
Page 19 and 20: Multi site example June 7 to 10, 20
Page 21 and 22: statistics • Wafer 17; the Cpk wa
Page 23 and 24: An other example of a “site-probl
Page 25 and 26: DTC From SE-PROBE to a Dynamic Test
Page 27 and 28: Adaptive test • Result driven tes
Page 29 and 30: esults • More robust test data -
Page 31: Acknowledgments • Paul van Ulsen,

Test-data validation - Semiconductor Wafer Test Workshop

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