Test-data validation - Semiconductor Wafer Test Workshop

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Know what happens in the prober June 7 to 10, 2009 IEEE SW Test Workshop 16
Automatic Z-height correction • First contact – full contact – At initialization raise chuck slowly until first needle contact the die. – Then raise further until all needles are contacting the die – Difference in z-height between first and full contact indicate probe-card/set-up planarity – Limits on z-height difference protect the set-up against extensive probe mark damage (cantilever cards) • First contact – full contact measured under different conditions (temp) at different locations (on the chuck) will indicate your probe-card deflection June 7 to 10, 2009 IEEE SW Test Workshop 17
Page 1 and 2: June 7-10, 2009 San Diego, CA Test-
Page 3 and 4: Test-Data; where does it come from?
Page 5 and 6: Test-Data; where does it come from?
Page 7 and 8: Test-engineers are living on the ed
Page 9 and 10: Artifacts • “An artifact is the
Page 11 and 12: Add-up; synchronization @ multi-sit
Page 13 and 14: First time right vs. Retest • Ult
Page 15: Thermal distribution Ring-carrier H
Page 19 and 20: Multi site example June 7 to 10, 20
Page 21 and 22: statistics • Wafer 17; the Cpk wa
Page 23 and 24: An other example of a “site-probl
Page 25 and 26: DTC From SE-PROBE to a Dynamic Test
Page 27 and 28: Adaptive test • Result driven tes
Page 29 and 30: esults • More robust test data -
Page 31: Acknowledgments • Paul van Ulsen,

Test-data validation - Semiconductor Wafer Test Workshop

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