Test-data validation - Semiconductor Wafer Test Workshop

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Control test data quality; Make it more ROBUST! • Automatic verification of test related problems • Test-cell controller shift probe pattern to detect if “suspected value” move with the site or stay with the die. – Dynamic clean • Clean only then when needed, accepted degrading of data. – Watch-dog test (critical test) – RT SPC (values within expectation) – Correlation – Trigger tester calibration • Nice; but how? June 7 to 10, 2009 IEEE SW Test Workshop 24
DTC From SE-PROBE to a Dynamic Test-cell Controller TESTER DTC SE-PROBE PROBER / HANDLER OEE Module More to come! Daemon Adaptive test Module Outlier detection Module Datalog Module Trend Module Network switch Net June 7 to 10, 2009 IEEE SW Test Workshop 25
Page 1 and 2: June 7-10, 2009 San Diego, CA Test-
Page 3 and 4: Test-Data; where does it come from?
Page 5 and 6: Test-Data; where does it come from?
Page 7 and 8: Test-engineers are living on the ed
Page 9 and 10: Artifacts • “An artifact is the
Page 11 and 12: Add-up; synchronization @ multi-sit
Page 13 and 14: First time right vs. Retest • Ult
Page 15 and 16: Thermal distribution Ring-carrier H
Page 17 and 18: Automatic Z-height correction • F
Page 19 and 20: Multi site example June 7 to 10, 20
Page 21 and 22: statistics • Wafer 17; the Cpk wa
Page 23: An other example of a “site-probl
Page 27 and 28: Adaptive test • Result driven tes
Page 29 and 30: esults • More robust test data -
Page 31: Acknowledgments • Paul van Ulsen,

Test-data validation - Semiconductor Wafer Test Workshop

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