ROUTE60â¢: a new vertical probing technology

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Scrub depth analysis @ +125°C – 9 TDs 6.5 g PH – Average scrub depth : 1.30 µm 5 g PH – Average scrub depth : 1.15 µm June 3-6, 2007 IEEE SW Test Workshop 20
6M2T pad over active Bonding point Probing point C O B E D G E M6 M5 M4 M3 M2 M1 BPO: 59 x 123µm No cracks observed till 125 μm X 6 TDs @ ROOM T with both 8g and 6.5g probe heads June 3-6, 2007 IEEE SW Test Workshop 21
Page 1 and 2: Raffaele Vallauri STMicroelectronic
Page 3 and 4: Table of contents ROUTE60 Technolog
Page 5 and 6: Technology Introduction - Design Gr
Page 7 and 8: Product test flow description Packa
Page 9 and 10: Electrical results @ ROOM T (EWS3)
Page 11 and 12: Electrical results @ -40°C (EWS4)
Page 13 and 14: Scrub mark pictures @ +125°C Epoxy
Page 15 and 16: Electrical results after EWS1 and E
Page 17 and 18: Mechanical Results Alignment: Plana
Page 19: Scrub depth analysis @ ROOM T - 1TD
Page 23 and 24: Conclusions ROUTE60 is the first ve
Page 25: Acknowledgements A special thanks t

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ROUTE60â¢: a new vertical probing technology