micro, cdd - Power-One
micro, cdd - Power-One
micro, cdd - Power-One
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Reliability Tests: Thermal Shock<br />
In the Thermal Shock test, is used to evaluate the boards assembly quality<br />
(soldering joints, components, etc.) once they are submitted to fast thermal shocks<br />
between -25°C and +100°C for a total of 1000 cycles.<br />
• Bare board of MICRO-I-0.3(0.25) OUTD placed on thermal shock chamber lift.<br />
Not operating<br />
• Temperature shock: from -25°C to +100°C in 10sec. ; dwell time 10 min. High<br />
Temp./ 10 min. Low temp., 1000 cycles.<br />
• Board temperature<br />
monitored by data-logger.<br />
• No faults detected
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