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9000A
BGA 9000A
Bench­ Bench ­Top Top BGA Rework System
INSTRUCTION MANUAL
Thank you for purchasing Aoyue BGA9000A Bench­Top Rework System.
It is important to read the manual before using the equipment.
Please keep manual in accessible place for future reference.

TABLE OF CONTENTS
Product Description ………………………………………………………………… 3
Advantages of Infrared Reworking …………………………………………… 3
Package Inclusion ………………………………………………………………….. 4
Functions & Features ……………………………………………………………… 5
Product Specifications …………………………………………………………….. 5
Care and Safety Precaution ……………………………………………………… 6
System Parts Guide ………………………………………………………………… 7
Parts Diagram ………………………………………………………………………. 8­9
Control Panel Guide (Front) …………………………………………………….. 10
Back Panel Guide …………………………………………………………………… 11
Optimizer System Panel Guide (Back) ………………………………………. 11
Operating Guidelines
Initial Set­Up / Installation ………………………………………………… 12
Removing a Component ……………………………………………………. 13
Cleaning Left­Over Solder from Desoldered BGA …………………. 15
Re­Balling BGA …………………………………………………………………. 15
Replacing a BGA ………………………………………………………………. 15­17
Profiling ………………………………………………………………………………… 18­19
Reworking Tips ………………………………………………………………………. 20
Glossary ………………………………………………………………………………… 21
This manual is designed to familiarize the technician with the
proper operation and maintenance of the equipment. The “Care and
Safety Precautions” section explains the hazards of using any type of
electronic device. Please read carefully and observe the guidelines in
order to maximize usage and minimize the risk of injury or accidents.
2

PRODUCT DESCRIPTION
BGA9000A is a high­end rework and repairing system that integrates the functionalities of
infrared (IR) technology, split­vision control technology, soldering iron, pre­heater, and efficient
desoldering in one sophisticatedly designed electronic repairing system. The unique and innovative
mechanical design with in­package LCD monitor ensures accurate and precise reworking to match
even the most demanding rework
BGA9000A
Bench­Top Rework System
ADVANTAGES OF INFRARED REWORKING
● Cost Efficiency — Expensive devices and those that are hard to find replacements can be safely and
easily repaired or reworked in just a few minutes using the focused infrared beam.
● Reliability — Heat is generated by an infrared light source and remain focused on the target device.
Disruption, displacement, and damage to adjacent components due to limitations of some traditional
repair and rework equipments are eliminated.
● Versatility — The soldering capabilities of a simple soldering iron or hot air gun and reflow delivery
can be achieved in a safer and more efficient way using the heat radiated from the infrared source.
3

PACKAGE INCLUSION
Main Unit
Infrared Tool
Power Cord
Soldering Iron
Soldering Unit
Tip with Heater Cartridge
Soldering Iron Holder
Heat Resistant Pad
Connecting Cord
LCD Monitor
Optimizer System
LCD Monitor Holder
Monitor Connecting Wires
Light Optimizer Connecting Wires
Replacement Suction Nozzles
External IR Sensor
Welding Goggles
Connecting Cord
Air Tube for Pump
Vacuum Pencil
Infrared Unit
Vacuum Module
Suction Caps (L, M, S)
Solder Paste
Solder Flux
Others
Lubricant for Adjust Ladder
Tools for Micro Adjust System
Replacement Fuse
IC Popper
Instruction CD
Product Manual
4

FUNCTIONS & FEATURES
● Microprocessor­controlled ESD safe rework system.
● Non­contact rework station featuring Split­Vision Control technology.
● Stand­alone XY­axis adjustment placement method using micro controls to position component.
● Designed for both lead­free and standard solder applications.
● Utilizes infrared (IR) wave technology to generate heat.
● Equipped with high precision optimizer that has dependable accuracy.
● Highly scalable system which can handle complex components like BGAs, QFPs and Micro SMDs.
● High capacity PCB support beams that can hold up to 280 X 430mm of PCB.
● Precision solder. Minimizes the distortion of PCB due to excessive heat.
● Built­in temperature sensor for monitoring system or rework temperature.
● All digital read­out and control of time, temperature, and airflow levels for monitoring and ease­of­use.
● Suitable for conducting various SMD and BGA reworking tasks.
PRODUCT SPECIFICATIONS
MAIN UNIT
Power Input 220V / 110V
Frequency
50 Hz ~ 60 Hz
Dimension 530 (w) x 480 (h) x 550 (d) mm
Weight 65 Kgs.
SOLDERING IRON
Power Consumption 75W
Temperature Range
200°C ~ 480°C
Heating Element Ceramic Heater
Output Voltage 24V
PRE­HEATER
Power Consumption 450W
Temperature Range
100°C ~ 350°C
Heating Element Quartz Infrared
Output Voltage 220V / 110V
INFRARED SOLDERLIGHT GUN
Power Consumption 150W
Temperature Range
200°C ~ 480°C
Heating Element Halogen Light Source
Output Voltage 15V
5

CARE & SAFETY PRECAUTIONS
● Check all wires and connections before plugging in the unit.
­ Some connecting points carry high voltage that may cause serious electric shock or extensive dam­
age when handled improperly.
● Make sure the equipment is completely isolated from the main power source and all moving parts
locked (by locking knobs) before moving the unit from one location to another.
● Temperature may reach as high as 500°C when the equipment is switched ON.
­ Do not use near flammable gases, paper, and other flammable materials.
­ Do not touch heated parts, which can cause severe burns.
● Handle with care.
­ Do not spill any form of liquid to the system.
­ Unit contains delicate parts, which can break if the unit is dropped or hit hard.
● Thermal Protector
WARNING: Improper usage can cause serious injury to personnel and/or damage to
property and workplace. For your own safety, please observe the following precautions.
­ If the thermal protector trips, reduce the temperature setting.
­ The unit is equipped with auto shut­off feature when the temperature gets too high. It will automati­
cally switch back ON when the temperature reaches a safe level.
● Do not tamper the electrical control unit or internal wiring in any manner. This may cause severe
electric shock or extensive damage when handled improperly.
● Disconnect the unit from the main power source if the system will not to be used for a long period.
Turn off power during breaks, if possible.
● To avoid the possibility of getting burns, allow sufficient time for the equipment to cool down before
commencing maintenance.
● Use only genuine replacement parts.
● Turn­off power and let unit cool before replacing parts.
6

SYSTEM PARTS GUIDE
LCD Monitor
Vision Shield
Pre­Heater
Digital Displays
Infrared Tool
Main Controls
Adjust Ladder
X Axis
Y Axis
Vision Tray
PCB Holder
Main Power Switch
Soldering Iron Receptacle
7

PARTS DIAGRAM
Optimizing System
(X Axis)
Locking Knob
LEFT / RIGHT Adjustment
Adjustment Ladder
Micro Adjust System
Optimizing Scale
UP / DOWN Adjustment
Scale Indicator
Adjust Ladder
Control Knobs
Micro­Adjust System
Rotation Adjustment
8

PARTS DIAGRAM
Vision Shield
Locking Knob
Welding System
Infrared Tool
Handle
Temperature
Sensor
Welding
System Lock
Focus Scale
Focus Lock
Infrared Lamp
9

CONTROL PANEL GUIDE (FRONT)
15
16
13
14
9 9a 9b
10 10a 10b
11 11a 11b
12 12a 12b
BUTTON DESCRIPTION
1 Main Power Switch
2 Soldering Iron Receptacle
3 Main Vacuum Control
Vacuum Switch
4
Vacuum Nozzle
Vacuum Pen
5 Temperature Reset Button
6 Optimizer System Power Switch
7 PCB Optimizer (Upper Light)
8 IC Optimizer (Lower Light)
9 Infrared Tool Power Switch
(9a) Increase Temperature
(9b) Decrease Temperature
10 Automate IR Tool Switch
(10a) Increase Time
(10b) Decrease Time
11 Pre­heater Power Switch
(11a) Increase Pre­heater Temperature
(11b) Decrease Pre­heater Temperature
12 Soldering Iron Power Switch
(12a) Increase Soldering Temperature
(12b) Decrease Soldering Temperature
13 Welding Time Display
14 Soldering Temperature Display
Upper Panel Set Infrared Temperature Display
15
Lower Panel Actual Component Temperature Display
16 Pre­heater Temperature Display
5
6
8
3
4
7
1
2
10

BACK PANEL GUIDE
PC B1 B2 A1 A2 A3 A4
CONNECTING POINT DESCRIPTION
PC Power cord for main Power Supply
B1 Connecting tube for the Vacuum Suction Pen
B2 Connecting tube for the Diaphragm Pump
A1 Connecting cord for the Diaphragm Pump (8 Pins)
A2 Connecting cord for the Infrared Tool (6 Pins)
A3 Connecting cord for Light Optimizer (5 Pins)
A4 Connecting cord for Monitor (3 Pins)
OPTIMIZER SYSTEM PANEL GUIDE (BACK)
VP A1 B1
CONNECTING POINT DESCRIPTION
VP Connects to the Vacuum Pen
A1 Connecting cord to back panel of main unit
B1 Connecting tube to back panel of main unit
11

OPERATING GUIDELINES
A. INITIAL SET­UP / INSTALLATION
WORK AREA
● The equipment must be placed on a flat stable surface of at least one square meter and at a height
that suits the user.
● RECOMMENDATION: The electricity supply must be dedicated and free from interference of
other devices.
SYSTEM SET­UP
NOTE: Lock all moving parts of the system before moving the equipment
from one location to another to avoid misalignment and possible damage.
WARNING: For the operator or user safety, make sure the system
is completely isolated from the main power source (i.e., unplugged).
● Connect and secure the tubes, lines, and cords to their respective receptacles.
● Make sure all function switches are OFF.
SOLDERING IRON HOLDER
1. Install the solder wire to the soldering iron holder as in the figure below.
2. Attach and secure the soldering iron cord assembly to the 6­pin receptacle located at the lower right
area of the main unit.
3. Place the soldering iron to the soldering iron stand as shown below.
START­UP & INITIAL CHECK­UP
Soldering Iron and Holder Set­Up
● Turn Main Power Switch ON (button “1”) and check if the digital display panel lights up.
● Turn on the Optimizer (button “6”) and check the LCD monitor.
● Turn the Main Vacuum Switch ON (button “3”) and check if the pump is working.
ATTENTION
The temperature settings used in this manual are provided for reference purpose. Actual
temperature settings for soldering and reworking are dependent on several factors such as the
size of device to be soldered and solder paste temperature characteristics. In addition, very
high reworking temperatures can damage sensitive SMT materials if not properly handled.
Please refer to the manufacturer’s data/datasheet for the appropriate parameters of the device
before proceeding with the soldering or rework process.
12

OPERATING GUIDELINES
B. REMOVING A COMPONENT
1. Position the PCB in the PCB holder such that the portion or component to be reworked is directly
above the Pre­heater.
2. Lock the PCB holder to keep the PCB in place.
3. Adjust the Y axis and the Welding System (X axis) to position the Infrared tool perpendicular to the
broken component.
4. Secure or lock when properly adjusted.
5. Press the Pre­heater switch (button“11”) to begin pre­heating.
6. Set the desired temperature using buttons “11a” and “11b”.
7. Allow sufficient time for Pre­heater to heat up PCB to desired working temperature. Pre­heater set­
tings may be set to 350 to 450 degrees, which in turn radiates a relative temperature of 120 to 170
degrees to the PCB.
8. To check for the actual board temperature, place the temperature sensor tip near the edge of the
component to be removed. (See figure below.) When the board temperature rises above 100°C the
lower display (item 15 from the front panel guide) would show the actual PCB temperature.
Temperature
Sensor
9. Put on the welding goggles or flip down the vision shield before switching on the infrared tool. This
can be done after the temperature of the PCB has increased to the desired working temperature
(normally around 120°C to 170°C).
10. Turn on the Infrared tool (button “9”) and adjust the Infrared focus light (by moving the Infrared
tool up and down) depending on the size of your component. It is best to have the infrared light
beam cover the whole area of the IC to be removed or even slightly larger to accommodate reflow.
11. Lock the infrared tool using the knobs found on both sides of the Welding System.
12. Once the Infrared tool with the proper focus light size is locked, you may list down the distance
using the focus scale for future reference.
13

OPERATING GUIDELINES
NOTE: The Infrared focus light must be slightly larger
than the component size. (Smaller focus light
has a more concentrated heat which can dam­
age sensitive ICs.)
To use the AUTOMATE function follow steps 13 to 18;
for manual desoldering proceed to step 19.
13. Turn off the Infrared tool (button “9”).
14. Turn on the Automate IR Tool Switch (button “10”).
15. Set the desired time of welding using buttons “10a” and “10b”. Normal setting would be 30 to 90
seconds. Countdown will start as soon as the set infrared temperature is reached.
16. Turn on the Infrared tool (button “9”) and set to the desired temperature. Normal desoldering
temperature setting would be within 180°C to 220°C .
17. Put on the welding goggles or flip down the vision shield.
18. Infrared welding automatically switches off when the time has elapsed. The display will show the
19. Unlock the X axis and push Welding System to the left side.
20. Turn on Main Vacuum by pressing the Main Vacuum Control (button “3”). Use the Vacuum Suction
Pen to remove the component. See image below.
21. After de­welding switch OFF the infrared tool (button “9”), Pre­Heater Power Switch (button
“11”), as well as the Automate IR Tool Switch (button “10”), if applicable.
NOTE: When the vacuum switch is
pressed, the vacuum nozzle is ON.
When the vacuum switch is not pressed,
the suction pen is ON.
Suction Pen
Vacuum Nozzle
14

OPERATING GUIDELINES
C. CLEANING LEFTOVER SOLDER FROM DESOLDERED BGA
1. Insert a wide edge tip to the soldering iron handle.
2. Turn on the Soldering Iron Power Switch (button “12”),.
3. Set to the desired temperature (normally between 280°C and 320°C).
4. Apply solder flux to the area to be cleaned.
5. Pass the soldering iron tip over the area with left­over solders. The tip would pick up these solders.
Gently wipe off the picked up solders on a damp sponge.
6. Repeat the process until thoroughly cleaned.
D. RE­BALLING BGA
1. Clean up the BGA component.
2. Attach the BGA to its corresponding BGA stencil. Use high temperature tape to properly secure the
underside of the BGA .
3. Apply a thin layer of solder paste to the BGA stencil.
4. Wipe clean the excess solder paste.
5. Place the BGA stencil with the BGA still attached to the PCB holder, with the stencil side facing up.
6. Align the infrared tool with the component.
7. Place the temperature sensor on top of the stencil.
8. Turn on the pre­heater and set the temperature to 350°C. Allow sufficient time for the pre­heater
to heat up.
9. Turn­on the infrared tool and set the temperature to approximately 180°C.
10. Wait for all the solder paste to melt and turn into solder balls.
11. Turn off the pre­heater and the infrared tool.
E. REPLACING A BGA
1. Place the PCB on top of the PCB holder such that the portion to be reworked is directly above the
pre­heater. Use the inner beam edges as a placement guide.
2. Lock the PCB holder to prevent the PCB from moving.
3. Press the Pre­Heater switch (button “11”) to begin pre­heating.
4. Roll down the adjustment ladder and move the Y axis and Optimizer System (X axis) such that the
Suction Nozzle is right above the component of concern.
5. Lock the X and Y axis.
6. Place the BGA on top of its footprint.
7. Switch the Main Vacuum Control (button “3”) ON.
Suction Nozzle
8. Press the vacuum switch (button “4”) to activate the suction nozzle and pick up the BGA/
component. Make sure the IC is completely level and not slanted as seen in the picture below. If
the IC is slanted adjust the Suction Nozzle until perfect level is achieved.
15

OPERATING GUIDELINES
9. Roll up the adjust ladder. Make sure the IC is completely level and not slanted as in the picture
below. If the IC is slanted adjust the Suction Nozzle until perfect level is achieved.
10. Make sure the red arrows meet each other at the tip after rolling up the adjustment ladder. This
corresponds to the 1:1 split vision of the component and the PCB.
11. Turn the Optimizer System (button “6”) ON.
12. Pull forward the Vision Tray just beneath the Suction Nozzle.
13. Look into the LCD monitor and use the Micro­Adjust System to position the BGA/components. Move
the Adjustment Ladder for more precise placement. Lights can be adjusted for better visibility. Use
button “7” for better view of the print on the PCB and button “8” for better view of the component.
14. After the BGA/component has been centered and positioned properly, push the Vision Tray entirely
and slowly roll down the Adjustment Ladder. Release the Vacuum Switch (button “4”) to let BGA/
component fall down to its place on the PCB.
IMPORTANT: DO NOT let the BGA component come into full contact with the
PCB while rolling the adjustment ladder. Leave at least 1­2mm of space to let the
BGA naturally fall into place when you release the vacuum. See illustrations below.
Figure 1.
Clearance height of 1­2mm before
releasing the vacuum and let the
BGA/component fall into place.
NOTE: The 1:1 optimizer scale’s red arrow is applicable to
BGA ICs of 2 mm in thickness. Varying thickness of BGA
ICs may require the user to adjust the ladder to get the
best possible 1:1 split vision of the component. In this
case, users would be required to determine the applicable
scale when reworking different types of components.
Figure 2.
Vacuum is released leaving 1.5­
2mm of space between suction
nozzle and BGA/component.
16

OPERATING GUIDELINES
(Continuation… “Replacing a BGA”)
15. Roll up the Adjustment Ladder entirely after releasing the vacuum and letting BGA/component fall
to its place on the PCB.
16. Adjust the Pre­Heater temperature using buttons “11a” and “11b”.
17. Release the lock of the Optimizer System and slowly push it to the right.
18. Adjust Y axis and Welding System (X axis) to position the Infrared Tool right above the BGA/
component.
13. Turn on the Infrared tool (button “9”).
14. Adjust the Infrared focus light (by moving Infrared tool up and down) depending on the size of
your component.
15. Secure the position using the locks/knobs found on both sides of the Welding System.
16. Turn off the Infrared tool (button “9”).
17. To check for the actual board temperature, place the temperature sensor tip near the edge of the
component. (See figure below.) When the board temperature rises above 100°C the lower display
(item 15 from the front panel guide) would show the actual PCB temperature.
18. Turn ON the Infrared Tool (button “9”).
19. Adjust the infrared temperature using buttons “9a” and “9b”. Normal welding settings would be
around 180°C to 220°C.
Temperature
Sensor
To use the AUTOMATE function follow steps 20 to 22;
for manual soldering proceed to step 23.
20. Turn off the Infrared tool (button “9”).
21. Turn on the Automate IR Tool Switch (button “10”).
22. Set the desired time of welding using buttons “10a” and “10b”. Normal setting would be 30 to 90
seconds. Countdown will start as soon as the set infrared temperature is reached. Likewise, welding
automatically stops when the countdown time has elapsed.
NOTE: Welding time depends on the size of the BGA/component and the type of flux being used.
Make sure to check the suggested welding time of components before starting the rework process.
23. When welding is complete, switch OFF the infrared tool (button “9”).
24. Remove the welding goggles or lift the vision shield.
25. Unlock the X axis and push the Welding System (assembly) to the left side.
26. Switch OFF the Infrared Tool, Pre­Heater Switch, and Automate button (if applicable).
27. Unlock the PCB holder and remove the reworked PCB.
17

PROFILING
Recommended settings and profiling procedure:
1. Follow steps 1­15 of Replacing a BGA guide.
2. After the BGA IC has been properly placed on top of the target area slide the infrared module di­
rectly on top of the target device.
3. Turn on the infra­red sensor and set the infrared temperature to around 150­180 degrees. The in­
frared tool would slowly light up.
4. Place the tip of the thermal sensor in direct line of sight to the infrared beam. Placing the tip 1 or 2
inches from the mouth of the infrared module is recommended.
5. When the infrared beam has lit up to a high intensity, focus its beam such that the main beam (the
brightest circle) slightly encompasses the entire target BGA. Mark this height on the scale as our
optimum height for this size of BGA. A recommended height for starters is between 25­28 mm.
6. Carefully place the tip of the thermal sensor on one corner of the BGA. The tip of the sensor should
be touching the BGA IC, or the PCB Board. For best results it is recommended that the thermal
sensor be placed directly on center top area of the IC to be soldered.
7. Turn off the infrared module.
8. Turn on the pre­heater and set the pre­heat temperature to around 300 to 350 degrees. This, in
turn, radiates an effective temperature of 150 to 180 degrees on the target PCB.
9. turn on the infrared module when the pre­heater has reached the target temperature and the PCB
has heat up to around 150­180 degrees.
10. Place the thermal sensor’s tip carefully at one corner of the BGA. Make sure the thermal sensor is
within the main beam of the infrared and directly touches the BGA or the PCB.
11. Set the infrared temperature to around 180°C. The infrared beam would slowly brighten until it
reaches the set temperature.
12. When the actual temperature display has reached the set temperature use a timer to record the
time it takes for proper reflow to occur. If the temperature is not enough to allow reflow increase
the set temperature by one step and restart the timer. Continue this procedure until complete re­
flow has occurred. Record the temperature setting and the time it took for complete reflow to oc­
cur. This could be recorded as the optimum temperature and timer setting.
13. Turn off the infrared module and pre­heater.
14. Wait for the BGA and PCB to cool down before removing from the system.
After the profiling procedure has been completed the following data will be obtained.
Profile Data
PARAMETERS SETTINGS
Pre­Heating Temperature 370°C
Infrared Module Height 26 mm from PCB
Infrared Set Temperature 200°C
Timer Settings 40 seconds
Thermal Sensor Placement Corner of IC
Further reworking can be done based on these data.
18

PROFILING
Profile Adjustment
1. The timer may need to be increased if only partial reflow occurs and some balls at the edges are not
fully melded with the PCB.
2. If timer has been increased up to 90 seconds and still no complete reflow occurs re­set timer to the
original and increase infra­red temperature this time.
3. If the infrared temperature has been increased to nearly equal the maximum reflow temperature
before complete reflow occurs, this may post harm to the components. Decrease the infrared tem­
perature and increase the pre­heating temperature.
4. If the components appear to be getting damaged, decrease the infrared temperature setting. The
pre­heating temperature can be increased to compensate.
5. If the BGA ICs keeps getting exposed without any result, it may be that the height of the infrared
module is too low causing the main beam to be too focused on the center of the target object. In­
crease the height of the infrared module if this occurs.
Timer Settings
After profile adjustments the new profile may be within the following range.
Temperature in Celsius
250
200
150
100
50
0
NOTE: In case reworking does not work on the gathered
profile the following adjustments may be done to the profile.
Adjusted Profile Data
PARAMETERS SETTINGS
Pre­Heat Temperature 370±15°C
Infrared Module Height 26±3mm
Infrared Set Temperature 200±6°C
Timer Settings 40±20 seconds
Thermal Sensor Placement Corner of IC or Center of IC
The timer only counts down when the set temperature has been reached, the setting for the timer
would now be for the actual reflow time not including the preheating and soaking time. Recommended
settings for timer are 30 to 90 seconds. See illustration below.
Set Timer
0 50 100 150 200 250 300
Time in seconds
Timer configuration: Timer starts counting down only when the set
temperature has been reached; the temperature is then maintained at this
set amount of time. When the timer reaches zero the infrared is shutdown.
19

REWORKING TIPS
● Always apply flux to joints before reflow.
● Before replacing a component, check if there is enough solder on the pads to solder new compo­
nent.
● Before replacing a component, make sure the new component has no bent leads.
● Use Flux Gel. When the gel turns into a fluid/liquid, this means the PCB is already preheated and
may now be applied heat using the infrared tool. Flux Gel also helps in proper placement of the
component.
● If the pre­heat temperature is too low or the preheating time is too short when you apply the infra­
red tool, the heat will be absorbed by the PCB's ground plane and will increase the time to reflow.
● The longer the PCB is pre­heated, the less infrared for top heat is required.
● When the solder is fully molten, tap the PCB and watch the surface tension of the solder draw the
component into exact alignment.
● Never use temperature settings higher than maximum allowable reflow temperature.
● The height of the infrared tool may be raised or lowered depending on the type of solder paste used,
and target device size.
● Lead free solder paste tend to need a higher temperature to reflow .
● Larger IC packaging may need a longer time before reflow occurs.
20

GLOSSARY
PRE­HEATER
The device or mechanism that provides heat to PCB and attached component prior to actual rework
process. This prepares and protects the PCB from delaminating and the component from thermal
shock. The pre­heater is also responsible for equalizing the conductive effect (heat) to the ground
plane of the PCB and supplying 75% of heat energy during the entire rework process.
OPTIMIZER SYSTEM
A visual inspection system that uses split vision technology to create optic illusions. This projects the
view of the bottom part of a BGA/component and the top of a PCB using two light sources such that
the balls and holes are drawn into perfect alignment. The lights can be adjusted to be brighter or
dimmer in order to achieve an optimized view.
GOGGLES and VISION SHIELD
The devices that protect the eyes from the harmful effects of direct exposure to infrared radiation.
In addition, it allows the user to see the focused infrared light for precise soldering and reworking.
SET TEMPERATURE
The temperature that is being inputted to the BGA rework system. This can be slightly lower or
higher than the recommended solder paste reflow temperature or equal to or lower than the maxi­
mum allowable reflow temperature.
REFLOW TEMPERATURE
The temperature in which the solder melts and melds completely with the PCB.
MAXIMUM ALLOWABLE REFLOW TEMPERATURE
The maximum temperature that devices or components can be subjected to in order to achieve a
perfect reflow. Manufacturers of ICs, PCBs, solder paste, and solder flux oftentimes incorporate this
information from the component datasheet or technical manual to serve as reference during rework.
THERMAL or TEMPERATURE SENSOR
The arm­like device that is protruding from the side of the infrared module and provides the most
approximate temperature reading being delivered to the component during rework. The suggested
usage is to place the tip at the edge or center of the component of concern and must be physically
in contact with the said object.
21

AOYUE TONGYI ELECTRONIC EQUIPMENT FACTORY
Jishui Industrial Zone, Nantou, Zhongshan City, Guangdong Province, P.R.China
www.aoyue.com
Copyright © 2007 Aoyue Tongyi International Ltd.
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